Eliot K. Broadbent

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 8,883,640
- Issue date Nov 11, 2014
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 8,450,210
- Issue date May 28, 2013
- Novellus Systems, Inc.
- Evan E. Patton
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 8,026,174
- Issue date Sep 27, 2011
- Novellus Systems, Inc.
- Evan E. Patton
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 7,189,647
- Issue date Mar 13, 2007
- Novellus Systems, Inc.
- Evan E. Patton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for uniform electropolishing of damascene ic s...
- Patent number 6,709,565
- Issue date Mar 23, 2004
- Novellus Systems, Inc.
- Steven T. Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passivation of copper in dual damascene metalization
- Patent number 6,554,914
- Issue date Apr 29, 2003
- Novellus Systems, Inc.
- Robert T. Rozbicki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma process apparatus for integrated circuit fabrication having...
- Patent number 6,225,744
- Issue date May 1, 2001
- Novellus Systems, Inc.
- Jeffrey A. Tobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating semiconductor wafer using variable current...
- Patent number 6,162,344
- Issue date Dec 19, 2000
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating semicoductor wafer using variable currents...
- Patent number 6,110,346
- Issue date Aug 29, 2000
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating semiconductor wafer using variable current...
- Patent number 6,074,544
- Issue date Jun 13, 2000
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system with shields for varying thickness profile of...
- Patent number 6,027,631
- Issue date Feb 22, 2000
- Novellus Systems, Inc.
- Eliot K. Broadbent
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gas-based substrate deposition protection
- Patent number 5,925,411
- Issue date Jul 20, 1999
- Siliconix incorporated
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for preventing deposition on frontside peripheral region...
- Patent number 5,882,417
- Issue date Mar 16, 1999
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Exclusion guard and gas-based substrate protection for chemical vap...
- Patent number 5,843,233
- Issue date Dec 1, 1998
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Exclusion guard and gas-based substrate protection for chemical vap...
- Patent number 5,769,951
- Issue date Jun 23, 1998
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing substrate backside deposition during a chemic...
- Patent number 5,679,405
- Issue date Oct 21, 1997
- National Semiconductor Corp.
- Michael E. Thomas
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus for supporting a substrate and introducing gas flow doxim...
- Patent number 5,620,525
- Issue date Apr 15, 1997
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of generating plasma having high ion density for substrate p...
- Patent number 5,605,599
- Issue date Feb 25, 1997
- Novellus Systems, Inc.
- Jeffrey C. Benzing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer surface protection in a gas deposition process
- Patent number 5,578,532
- Issue date Nov 26, 1996
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Induction plasma source
- Patent number 5,405,480
- Issue date Apr 11, 1995
- Novellus Systems, Inc.
- Jeffrey C. Benzing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-based backside protection during substrate processing
- Patent number 5,374,594
- Issue date Dec 20, 1994
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Induction plasma source
- Patent number 5,346,578
- Issue date Sep 13, 1994
- Novellus Systems, Inc.
- Jeffrey C. Benzing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-based substrate protection during processing
- Patent number 5,238,499
- Issue date Aug 24, 1993
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas-based backside protection during substrate processing
- Patent number 5,230,741
- Issue date Jul 27, 1993
- Novellus Systems, Inc.
- Everhardus P. van de Ven
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sweeping method and magnet track apparatus for magnetron sputtering
- Patent number 5,188,717
- Issue date Feb 23, 1993
- Novellus Systems, Inc.
- Eliot K. Broadbent
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cooling method and apparatus for magnetron sputtering
- Patent number 5,171,415
- Issue date Dec 15, 1992
- Novellus Systems, Inc.
- Kenneth C. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-based backside protection during substrate processing
- Patent number 5,133,284
- Issue date Jul 28, 1992
- National Semiconductor Corp.
- Michael E. Thomas
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for manufacturing a planar electrical interconnection utiliz...
- Patent number 5,063,175
- Issue date Nov 5, 1991
- North American Philips Corp., Signetics Division
- Eliot K. Broadbent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum conductor with highly oriented grain...
- Patent number 4,976,809
- Issue date Dec 11, 1990
- North American Philips Corp, Signetics Division
- Eliot K. Broadbent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection for semiconductor integrated circuits
- Patent number 4,612,257
- Issue date Sep 16, 1986
- Signetics Corporation
- Eliot K. Broadbent
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Sequential station tool for wet processing of semiconductor wafers
- Publication number 20050282371
- Publication date Dec 22, 2005
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for uniform electropolishing of damascene ic s...
- Publication number 20020074238
- Publication date Jun 20, 2002
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS

Eliot K. Broadbent

Person

Patents Grantslast 30 patents

Sequential station tool for wet processing of semiconductor wafers

Sequential station tool for wet processing of semiconductor wafers

Sequential station tool for wet processing of semiconductor wafers

Sequential station tool for wet processing of semiconductor wafers

Method and apparatus for uniform electropolishing of damascene ic s...

Passivation of copper in dual damascene metalization

Plasma process apparatus for integrated circuit fabrication having...

Method of electroplating semiconductor wafer using variable current...

Method of electroplating semicoductor wafer using variable currents...

Method of electroplating semiconductor wafer using variable current...

Electroplating system with shields for varying thickness profile of...

Gas-based substrate deposition protection

Apparatus for preventing deposition on frontside peripheral region...

Exclusion guard and gas-based substrate protection for chemical vap...

Exclusion guard and gas-based substrate protection for chemical vap...

Method for preventing substrate backside deposition during a chemic...

Apparatus for supporting a substrate and introducing gas flow doxim...

Method of generating plasma having high ion density for substrate p...

Wafer surface protection in a gas deposition process

Induction plasma source

Gas-based backside protection during substrate processing

Induction plasma source

Gas-based substrate protection during processing

Gas-based backside protection during substrate processing

Sweeping method and magnet track apparatus for magnetron sputtering

Cooling method and apparatus for magnetron sputtering

Gas-based backside protection during substrate processing

Method for manufacturing a planar electrical interconnection utiliz...

Method of forming an aluminum conductor with highly oriented grain...

Electrical interconnection for semiconductor integrated circuits

Patents Applicationslast 30 patents

Sequential station tool for wet processing of semiconductor wafers

Method and apparatus for uniform electropolishing of damascene ic s...