ELKE ZAKEL

Person

SALKENSEE, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for transferring a chip to a contact substrate
- Patent number 9,401,298
- Issue date Jul 26, 2016
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode array and method for producing a diode array
- Patent number 8,742,571
- Issue date Jun 3, 2014
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal face contact structure and method of making same
- Patent number 8,497,578
- Issue date Jul 30, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining aligned discrete optical elements
- Patent number 8,431,477
- Issue date Apr 30, 2013
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Erik Beckert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for alternately contacting two wafers
- Patent number 8,361,881
- Issue date Jan 29, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for drying circuit substrates
- Patent number 8,256,131
- Issue date Sep 4, 2012
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- F26 - DRYING
Information Patent Grant
Device for alternately contacting two wafers
- Patent number 7,932,611
- Issue date Apr 26, 2011
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for transferring a solder deposit configuration
- Patent number 7,926,699
- Issue date Apr 19, 2011
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for mutual contacting of two wafers
- Patent number 7,882,997
- Issue date Feb 8, 2011
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for removing solder material from a soldered joint
- Patent number 7,829,817
- Issue date Nov 9, 2010
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for transferring a solder deposit configuration
- Patent number 7,762,446
- Issue date Jul 27, 2010
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for ablating points of contact (debumping)
- Patent number 7,481,352
- Issue date Jan 27, 2009
- PAC Tech-Packaging Technologies GmbH
- Thorsten Teutsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying material to a workpiece
- Patent number 7,121,449
- Issue date Oct 17, 2006
- Pac Tec - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the formation of a spatial chip arrangement and spatial...
- Patent number 7,087,442
- Issue date Aug 8, 2006
- PAC Tech-Packaging Technologies GmbH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a contact substrate and corresponding contact...
- Patent number 7,049,213
- Issue date May 23, 2006
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying pieces of material to a workpiece
- Patent number 7,021,517
- Issue date Apr 4, 2006
- Pac Tec - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact bump construction for the production of a connector constru...
- Patent number 7,007,834
- Issue date Mar 7, 2006
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate arrangement
- Patent number 6,955,943
- Issue date Oct 18, 2005
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for positioning a tool in relation to a workpiece
- Patent number 6,955,284
- Issue date Oct 18, 2005
- Pac Tec-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for applying solder globules
- Patent number 6,915,940
- Issue date Jul 12, 2005
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump with basic metallization and method for manufacturing the basi...
- Patent number 6,720,257
- Issue date Apr 13, 2004
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing contactless chip cards and corresponding conta...
- Patent number 6,651,891
- Issue date Nov 25, 2003
- Smart Pac GmbH Technology Services
- Elke Zakel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for bonding a flexible substrate to a chip
- Patent number 6,478,906
- Issue date Nov 12, 2002
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact-bumpless chip contacting method and an electronic circuit p...
- Patent number 6,407,457
- Issue date Jun 18, 2002
- Smart Pac GmbH Technology Services
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a structured metallization on a semiconductor wafer
- Patent number 6,284,639
- Issue date Sep 4, 2001
- Fraunhofer-Gesellschaft zur Foerderung der angwandten Forschung e.V.
- Rolf Aschenbrenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of contacting a chip
- Patent number 6,285,562
- Issue date Sep 4, 2001
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chips arranged in plurality of planes and electrically connected to...
- Patent number 6,281,577
- Issue date Aug 28, 2001
- PAC Tech-Packaging Technologies GmbH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,277,660
- Issue date Aug 21, 2001
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,211,571
- Issue date Apr 3, 2001
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Chip housing
- Patent number 6,160,218
- Issue date Dec 12, 2000
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Diode Array and Method for Producing a Diode Array
- Publication number 20120228772
- Publication date Sep 13, 2012
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Array for Substrate Contacting
- Publication number 20120126410
- Publication date May 24, 2012
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ALTERNATELY CONTACTING TWO WAFERS
- Publication number 20110244651
- Publication date Oct 6, 2011
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND METHOD FOR PRODUCING A CONTACT STRUCTURE
- Publication number 20110057312
- Publication date Mar 10, 2011
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION
- Publication number 20100051673
- Publication date Mar 4, 2010
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR JOINING ALIGNED DISCRETE OPTICAL ELEMENTS
- Publication number 20100038348
- Publication date Feb 18, 2010
- Erik Beckert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device for Transferring a Solder Deposit Configuration
- Publication number 20080302863
- Publication date Dec 11, 2008
- PAC TECH - PACKAGING TECHNOLOGIES GMBH AND SMART PAC GMBH TECHNOLOGY SERVICES
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device For Drying Circuit Substrates
- Publication number 20080282574
- Publication date Nov 20, 2008
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical System
- Publication number 20080260370
- Publication date Oct 23, 2008
- Elke Zakel
- G02 - OPTICS
Information Patent Application
Method and Device for Transferring a Chip to a Contact Substrate
- Publication number 20080210368
- Publication date Sep 4, 2008
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device For Mutual Contacting of Two Wafers
- Publication number 20080171404
- Publication date Jul 17, 2008
- PAC TECH- PACKAGIN TECHNOLOGIES GMBH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Device For Alternately Contacting Two Wafers
- Publication number 20070272991
- Publication date Nov 29, 2007
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for applying material to a workpiece
- Publication number 20050031776
- Publication date Feb 10, 2005
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for ablating points of contact (debumping)
- Publication number 20040217150
- Publication date Nov 4, 2004
- Thorsten Teutsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contacting microchips by means of pressure
- Publication number 20040135265
- Publication date Jul 15, 2004
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for positioning a tool in relation to a workpiece
- Publication number 20040129756
- Publication date Jul 8, 2004
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for applying solder globules
- Publication number 20040094600
- Publication date May 20, 2004
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Treatment device for wafers
- Publication number 20040065358
- Publication date Apr 8, 2004
- Thorsten Teutsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bump construction for the production of a connector constru...
- Publication number 20040051116
- Publication date Mar 18, 2004
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for removing solder material from a soldered joint
- Publication number 20040026383
- Publication date Feb 12, 2004
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a substrate arrangement
- Publication number 20030235976
- Publication date Dec 25, 2003
- Elke Zakel
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for producing a contact substrate and corresponding contact...
- Publication number 20030186527
- Publication date Oct 2, 2003
- Elke Zakel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC UNDERCOATING FOR SOLDER MATERIALS
- Publication number 20020047217
- Publication date Apr 25, 2002
- ELKE ZAKEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for the formation of a spatial chip arrangement and spatial...
- Publication number 20020009828
- Publication date Jan 24, 2002
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method and device for transferring a chip to a contact substrate

Diode array and method for producing a diode array

Terminal face contact structure and method of making same

Method for joining aligned discrete optical elements

Method for alternately contacting two wafers

Method and device for drying circuit substrates

Device for alternately contacting two wafers

Method and device for transferring a solder deposit configuration

Method and device for mutual contacting of two wafers

Device for removing solder material from a soldered joint

Method and device for transferring a solder deposit configuration

Method for ablating points of contact (debumping)

Method and device for applying material to a workpiece

Process for the formation of a spatial chip arrangement and spatial...

Method for producing a contact substrate and corresponding contact...

Method and device for applying pieces of material to a workpiece

Contact bump construction for the production of a connector constru...

Method for producing a substrate arrangement

Device for positioning a tool in relation to a workpiece

Device for applying solder globules

Bump with basic metallization and method for manufacturing the basi...

Method for producing contactless chip cards and corresponding conta...

Method for bonding a flexible substrate to a chip

Contact-bumpless chip contacting method and an electronic circuit p...

Method for forming a structured metallization on a semiconductor wafer

Method of contacting a chip

Chips arranged in plurality of planes and electrically connected to...

Method and apparatus for testing chips

Method and apparatus for testing chips

Chip housing

Patents Applicationslast 30 patents

Diode Array and Method for Producing a Diode Array

Contact Array for Substrate Contacting

METHOD AND DEVICE FOR ALTERNATELY CONTACTING TWO WAFERS

CONTACT STRUCTURE AND METHOD FOR PRODUCING A CONTACT STRUCTURE

METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION

METHOD FOR JOINING ALIGNED DISCRETE OPTICAL ELEMENTS

Method and Device for Transferring a Solder Deposit Configuration

Method and Device For Drying Circuit Substrates

Optical System

Method and Device for Transferring a Chip to a Contact Substrate

Method and Device For Mutual Contacting of Two Wafers

Method And Device For Alternately Contacting Two Wafers

Method and device for applying material to a workpiece

Method for ablating points of contact (debumping)

Contacting microchips by means of pressure

Device for positioning a tool in relation to a workpiece

Device for applying solder globules

Treatment device for wafers

Contact bump construction for the production of a connector constru...

Device for removing solder material from a soldered joint

Method for producing a substrate arrangement

Method for producing a contact substrate and corresponding contact...

METALLIC UNDERCOATING FOR SOLDER MATERIALS

Process for the formation of a spatial chip arrangement and spatial...