Eric A. Hudson

Person

Berkeley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for cleaning an edge ring pocket
- Patent number 11,935,730
- Issue date Mar 19, 2024
- Lam Research Corporation
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed plasma chamber in dual chamber configuration
- Patent number 11,670,486
- Issue date Jun 6, 2023
- Lam Research Corporation
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi zone gas injection upper electrode system
- Patent number 11,594,400
- Issue date Feb 28, 2023
- Lam Research Corporation
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching an etch layer
- Patent number 11,171,011
- Issue date Nov 9, 2021
- Lam Research Corporation
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three or more states for achieving high aspect ratio dielectric etch
- Patent number 10,861,708
- Issue date Dec 8, 2020
- Lam Research Corporation
- Takumi Yanagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching features in a stack
- Patent number 10,847,374
- Issue date Nov 24, 2020
- Lam Research Corporation
- Leonid Belau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective atomic layer etching
- Patent number 10,847,375
- Issue date Nov 24, 2020
- Lam Research Corporation
- Chia-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing substrates using a movable plasma confinemen...
- Patent number 10,741,367
- Issue date Aug 11, 2020
- Lam Research Corporation
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi zone gas injection upper electrode system
- Patent number 10,622,195
- Issue date Apr 14, 2020
- Lam Research Corporation
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed plasma chamber in dual chamber configuration
- Patent number 10,553,399
- Issue date Feb 4, 2020
- Lam Research Corporation
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayers as an etchant in atomic layer etching
- Patent number 10,541,144
- Issue date Jan 21, 2020
- Lam Research Corporation
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three or more states for achieving high aspect ratio dielectric etch
- Patent number 10,504,744
- Issue date Dec 10, 2019
- Lam Research Corporation
- Takumi Yanagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask shrink layer for high aspect ratio dielectric etch
- Patent number 10,431,458
- Issue date Oct 1, 2019
- Lam Research Corporation
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to deposit sidewall passivation for high aspect ratio cyl...
- Patent number 10,373,840
- Issue date Aug 6, 2019
- Lam Research Corporation
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Active feedback control of subsystems of a process module
- Patent number 10,366,869
- Issue date Jul 30, 2019
- Lam Research Corporation
- Scott Riggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Porous low-k dielectric etch
- Patent number 10,361,091
- Issue date Jul 23, 2019
- Lam Research Corporation
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching features using metal passivation
- Patent number 10,361,092
- Issue date Jul 23, 2019
- Lam Research Corporation
- Francis Sloan Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple control modes
- Patent number 10,325,759
- Issue date Jun 18, 2019
- Lam Research Corporation
- John C. Valcore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to deposit sidewall passivation for high aspect ratio cyl...
- Patent number 10,304,693
- Issue date May 28, 2019
- Lam Research Corporation
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Technique to deposit sidewall passivation for high aspect ratio cyl...
- Patent number 10,297,459
- Issue date May 21, 2019
- Lam Research Corporation
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for a hybrid capacitively-coupled and an indu...
- Patent number 10,276,348
- Issue date Apr 30, 2019
- Lam Research Corporation
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative ion control for dielectric etch
- Patent number 10,181,412
- Issue date Jan 15, 2019
- Lam Research Corporation
- Alexei Marakhtanov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Technique to tune sidewall passivation deposition conformality for...
- Patent number 10,170,324
- Issue date Jan 1, 2019
- Lam Research Corporation
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to deposit metal-containing sidewall passivation for high...
- Patent number 10,170,323
- Issue date Jan 1, 2019
- Lam Research Corporation
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to deposit sidewall passivation for high aspect ratio cyl...
- Patent number 9,997,372
- Issue date Jun 12, 2018
- Lam Research Corporation
- Joseph Scott Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to deposit sidewall passivation for high aspect ratio cyl...
- Patent number 9,997,373
- Issue date Jun 12, 2018
- Lam Research Corporation
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlling ion energy distribution in plasma processing systems
- Patent number 9,887,069
- Issue date Feb 6, 2018
- Lam Research Corporation
- Andreas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to deposit sidewall passivation for high aspect ratio cyl...
- Patent number 9,887,097
- Issue date Feb 6, 2018
- Lam Research Corporation
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ion to neutral control for wafer processing with dual plasma source...
- Patent number 9,793,126
- Issue date Oct 17, 2017
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and apparatus for plasma etch having independent con...
- Patent number 9,735,020
- Issue date Aug 15, 2017
- Lam Research Corporation
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multiple State Pulsing for High Aspect Ratio Etch
- Publication number 20240120205
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Aniruddha Joi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE
- Publication number 20240120209
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILE OPTIMIZATION FOR HIGH ASPECT RATIO MEMORY USING AN ETCH FRO...
- Publication number 20230369061
- Publication date Nov 16, 2023
- LAM RESEARCH CORPORATION
- Leonid BELAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION CHEMISTRY FOR PLASMA ETCHING
- Publication number 20230335378
- Publication date Oct 19, 2023
- LAM RESEARCH CORPORATION
- Eric A. HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED PLASMA CHAMBER IN DUAL CHAMBER CONFIGURATION
- Publication number 20230317412
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH
- Publication number 20230298896
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Gregory Clinton Veber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PA...
- Publication number 20230268192
- Publication date Aug 24, 2023
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF VAPOR DEPOSITION PROCESS INTO PLASMA ETCH REACTOR
- Publication number 20230260759
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Eric A. Hudson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS CONTROL FOR ION ENERGY DELIVERY USING MULTIPLE GENERATORS A...
- Publication number 20230230804
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Ranadeep Bhowmick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO DIELECTRIC ETCH WITH CHLORINE
- Publication number 20230127597
- Publication date Apr 27, 2023
- LAM RESEARCH CORPORATION
- Rui Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITY
- Publication number 20230081817
- Publication date Mar 16, 2023
- LAM RESEARCH CORPORATION
- Leonid Belau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND...
- Publication number 20230005717
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ATTACHMENT TO ENHANCE SiO2:SiNx ETCH SELECTIVITY
- Publication number 20220362803
- Publication date Nov 17, 2022
- LAM RESEARCH CORPORATION
- Eric A. Hudson
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
HIGH DENSITY, MODULUS, AND HARDNESS AMORPHOUS CARBON FILMS AT LOW P...
- Publication number 20220282366
- Publication date Sep 8, 2022
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR CLEANING AN EDGE RING POCKET
- Publication number 20220254616
- Publication date Aug 11, 2022
- LAM RESEARCH CORPORATION
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON BASED DEPOSITIONS USED FOR CRITICAL DIMENSION CONTROL DURING...
- Publication number 20220199417
- Publication date Jun 23, 2022
- LAM RESEARCH CORPORATION
- Jon HENRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING AN ETCH LAYER
- Publication number 20220028696
- Publication date Jan 27, 2022
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI ZONE GAS INJECTION UPPER ELECTRODE SYSTEM
- Publication number 20200243307
- Publication date Jul 30, 2020
- LAM RESEARCH CORPORATION
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED PLASMA CHAMBER IN DUAL CHAMBER CONFIGURATION
- Publication number 20200227237
- Publication date Jul 16, 2020
- LAM RESEARCH CORPORATION
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM CHAMBER OPENING SYSTEM
- Publication number 20200194234
- Publication date Jun 18, 2020
- LAM RESEARCH CORPORATION
- Leonid BELAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems for Managing Byproduct Material Accumulation Du...
- Publication number 20200105508
- Publication date Apr 2, 2020
- LAM RESEARCH CORPORATION
- Leonid Belau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE OR MORE STATES FOR ACHIEVING HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20200090948
- Publication date Mar 19, 2020
- LAM RESEARCH CORPORATION
- Takumi Yanagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING AN ETCH LAYER
- Publication number 20200066540
- Publication date Feb 27, 2020
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ATOMIC LAYER ETCHING
- Publication number 20190393046
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Chia-Chun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYERS AS AN ETCHANT IN ATOMIC LAYER ETCHING
- Publication number 20190189462
- Publication date Jun 20, 2019
- LAM RESEARCH CORPORATION
- Eric Hudson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING CHAMBER
- Publication number 20190157051
- Publication date May 23, 2019
- LAM RESEARCH CORPORATION
- Leonid BELAU
- B08 - CLEANING
Information Patent Application
ACTIVE FEEDBACK CONTROL OF SUBSYSTEMS OF A PROCESS MODULE
- Publication number 20190157039
- Publication date May 23, 2019
- LAM RESEARCH CORPORATION
- Scott Riggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ETCHING FEATURES IN A STACK
- Publication number 20190131135
- Publication date May 2, 2019
- LAM RESEARCH CORPORATION
- Leonid BELAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS LOW-K DIELECTRIC ETCH
- Publication number 20180350618
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Eric HUDSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS ADDITIVES FOR SIDEWALL PASSIVATION DURING HIGH ASPECT RATIO CRY...
- Publication number 20180286707
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Eric A. Hudson
- H01 - BASIC ELECTRIC ELEMENTS

Eric A. Hudson

Person

Patents Grantslast 30 patents

Systems and methods for cleaning an edge ring pocket

Pulsed plasma chamber in dual chamber configuration

Multi zone gas injection upper electrode system

Method for etching an etch layer

Three or more states for achieving high aspect ratio dielectric etch

Method for etching features in a stack

Selective atomic layer etching

Methods for processing substrates using a movable plasma confinemen...

Multi zone gas injection upper electrode system

Pulsed plasma chamber in dual chamber configuration

Self-assembled monolayers as an etchant in atomic layer etching

Three or more states for achieving high aspect ratio dielectric etch

Mask shrink layer for high aspect ratio dielectric etch

Technique to deposit sidewall passivation for high aspect ratio cyl...

Active feedback control of subsystems of a process module

Porous low-k dielectric etch

Etching features using metal passivation

Multiple control modes

Technique to deposit sidewall passivation for high aspect ratio cyl...

Technique to deposit sidewall passivation for high aspect ratio cyl...

Methods and apparatus for a hybrid capacitively-coupled and an indu...

Negative ion control for dielectric etch

Technique to tune sidewall passivation deposition conformality for...

Technique to deposit metal-containing sidewall passivation for high...

Technique to deposit sidewall passivation for high aspect ratio cyl...

Technique to deposit sidewall passivation for high aspect ratio cyl...

Controlling ion energy distribution in plasma processing systems

Technique to deposit sidewall passivation for high aspect ratio cyl...

Ion to neutral control for wafer processing with dual plasma source...

System, method and apparatus for plasma etch having independent con...

Patents Applicationslast 30 patents

Multiple State Pulsing for High Aspect Ratio Etch

SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

PROFILE OPTIMIZATION FOR HIGH ASPECT RATIO MEMORY USING AN ETCH FRO...

PASSIVATION CHEMISTRY FOR PLASMA ETCHING

PULSED PLASMA CHAMBER IN DUAL CHAMBER CONFIGURATION

METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH

IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PA...

INTEGRATION OF VAPOR DEPOSITION PROCESS INTO PLASMA ETCH REACTOR

PROCESS CONTROL FOR ION ENERGY DELIVERY USING MULTIPLE GENERATORS A...

HIGH ASPECT RATIO DIELECTRIC ETCH WITH CHLORINE

HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITY

MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW CONTROL AND...

SELECTIVE ATTACHMENT TO ENHANCE SiO2:SiNx ETCH SELECTIVITY

HIGH DENSITY, MODULUS, AND HARDNESS AMORPHOUS CARBON FILMS AT LOW P...

SYSTEMS AND METHODS FOR CLEANING AN EDGE RING POCKET

CARBON BASED DEPOSITIONS USED FOR CRITICAL DIMENSION CONTROL DURING...

METHOD FOR ETCHING AN ETCH LAYER

MULTI ZONE GAS INJECTION UPPER ELECTRODE SYSTEM

PULSED PLASMA CHAMBER IN DUAL CHAMBER CONFIGURATION

VACUUM CHAMBER OPENING SYSTEM

Methods and Systems for Managing Byproduct Material Accumulation Du...

THREE OR MORE STATES FOR ACHIEVING HIGH ASPECT RATIO DIELECTRIC ETCH

METHOD FOR ETCHING AN ETCH LAYER

SELECTIVE ATOMIC LAYER ETCHING

SELF-ASSEMBLED MONOLAYERS AS AN ETCHANT IN ATOMIC LAYER ETCHING

METHOD FOR CLEANING CHAMBER

ACTIVE FEEDBACK CONTROL OF SUBSYSTEMS OF A PROCESS MODULE

METHOD FOR ETCHING FEATURES IN A STACK

POROUS LOW-K DIELECTRIC ETCH

GAS ADDITIVES FOR SIDEWALL PASSIVATION DURING HIGH ASPECT RATIO CRY...