Eric Chih-Fang Liu

Person

Guilderland, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wet etch process and method to control fin height and channel area...
- Patent number 12,148,624
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for planarizing a substrate using a combined wet etch and c...
- Patent number 12,100,598
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for highly anisotropic etching of titanium oxide spacer usin...
- Patent number 12,009,211
- Issue date Jun 11, 2024
- Tokyo Electron Limited
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a dielectric layer
- Patent number 11,756,790
- Issue date Sep 12, 2023
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for capping of cores for self-aligned multiple pa...
- Patent number 11,651,965
- Issue date May 16, 2023
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for EUV inverse patterning in processing of microelectronic...
- Patent number 11,557,479
- Issue date Jan 17, 2023
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a semiconductor feature using atomic layer etch
- Patent number 11,424,123
- Issue date Aug 23, 2022
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning processes
- Patent number 11,417,526
- Issue date Aug 16, 2022
- Tokyo Electron Limited
- David L. O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing lithography defects and pattern transfer
- Patent number 11,333,968
- Issue date May 17, 2022
- Tokyo Electron Limited
- Angelique D. Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio via etch using atomic layer deposition protection...
- Patent number 11,121,027
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition process
- Patent number 10,978,307
- Issue date Apr 13, 2021
- Tokyo Electron Limited
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of line cut by multi-color patterning technique
- Patent number 10,790,154
- Issue date Sep 29, 2020
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods to apply stress engineering to self-aligned m...
- Patent number 10,734,228
- Issue date Aug 4, 2020
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ruthenium metal feature fill for interconnects
- Patent number 10,700,009
- Issue date Jun 30, 2020
- Tokyo Electron Limited
- Kai-Hung Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ spacer reshaping for self-aligned multi-patterning methods...
- Patent number 10,453,686
- Issue date Oct 22, 2019
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer formation for self-aligned multi-patterning technique
- Patent number 10,170,329
- Issue date Jan 1, 2019
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing photoresist materials and structures
- Patent number 10,049,892
- Issue date Aug 14, 2018
- Tokyo Electron Limited
- Nihar Mohanty
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NON-PLANAR TRANSISTOR STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240405022
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING STABILITY OF SOFT OR ORGANIC...
- Publication number 20240404829
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Katie LUTKER-LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELF-ALIGNED DIELECTRIC WALL FORMATION FOR FORKSHEET APPL...
- Publication number 20240304500
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition of Passivating Layer During Spacer Etching
- Publication number 20240258108
- Publication date Aug 1, 2024
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Profile Control for Semiconductor Manufacturing
- Publication number 20240153770
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for In-Situ Dry Development
- Publication number 20240096622
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Steven Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Patterning Method of Patterning a Substrate
- Publication number 20240087892
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PLANARIZING A SUBSTRATE USING A COMBINED WET ETCH AND C...
- Publication number 20240087907
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH PROCESS AND METHOD TO CONTROL FIN HEIGHT AND CHANNEL AREA...
- Publication number 20240087909
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...
- Publication number 20240087950
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Substrate
- Publication number 20240087891
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning a Semiconductor Substrate
- Publication number 20240063019
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Alexandra Krawicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE HARDMASKS FOR SELF-ALIGNED MULTI-PATTERNING PROCESSES
- Publication number 20240047210
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...
- Publication number 20230352343
- Publication date Nov 2, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable Hardness Amorphous Carbon Mask
- Publication number 20230343592
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods To Provide Anisotropic Etching Of Metal Hard Masks Using A...
- Publication number 20230343554
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Improving Etch Rate And Critical Dimension Uniformity Wh...
- Publication number 20230343598
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Highly Anisotropic Etching Of Titanium Oxide Spacer Usin...
- Publication number 20230154752
- Publication date May 18, 2023
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL GATE CAPPING LAYER FOR GATE PROTECTION
- Publication number 20220359718
- Publication date Nov 10, 2022
- TOKYO ELECTRON LIMITED
- Yun HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Line Roughness Reduction and Self-Aligned Multi-Patternin...
- Publication number 20220319838
- Publication date Oct 6, 2022
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20220301930
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING A DIELECTRIC LAYER
- Publication number 20220293419
- Publication date Sep 15, 2022
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Reducing Lithography Defects and Pattern Transfer
- Publication number 20220244636
- Publication date Aug 4, 2022
- TOKYO ELECTRON LIMITED
- Angélique D. Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR EUV INVERSE PATTERNING IN PROCESSING OF MICROELECTRONIC...
- Publication number 20210296125
- Publication date Sep 23, 2021
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A SEMICONDUCTOR FEATURE USING ATOMIC LAYER ETCH
- Publication number 20210265164
- Publication date Aug 26, 2021
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Patterning Processes
- Publication number 20210242020
- Publication date Aug 5, 2021
- TOKYO ELECTRON LIMITED
- David L. O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION PROCESS
- Publication number 20210057226
- Publication date Feb 25, 2021
- TOKYO ELECTRON LIMITED
- David O'Meara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR CAPPING OF CORES FOR SELF-ALIGNED MULTIPLE PA...
- Publication number 20210050214
- Publication date Feb 18, 2021
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-AWARE AND CORRECTING HETEROGENOUS PLATFORM INCORPORATING INTEG...
- Publication number 20200043764
- Publication date Feb 6, 2020
- TOKYO ELECTRON LIMITED
- Robert Clark
- G05 - CONTROLLING REGULATING

Eric Chih-Fang Liu

Person

Patents Grantslast 30 patents

Wet etch process and method to control fin height and channel area...

Methods for planarizing a substrate using a combined wet etch and c...

Method for highly anisotropic etching of titanium oxide spacer usin...

Method for patterning a dielectric layer

Method and system for capping of cores for self-aligned multiple pa...

Methods for EUV inverse patterning in processing of microelectronic...

Forming a semiconductor feature using atomic layer etch

Multiple patterning processes

Method for reducing lithography defects and pattern transfer

High aspect ratio via etch using atomic layer deposition protection...

Deposition process

Method of line cut by multi-color patterning technique

Manufacturing methods to apply stress engineering to self-aligned m...

Ruthenium metal feature fill for interconnects

In-situ spacer reshaping for self-aligned multi-patterning methods...

Spacer formation for self-aligned multi-patterning technique

Method for processing photoresist materials and structures

Patents Applicationslast 30 patents

METHOD OF PREVENTING PATTERN COLLAPSE

NON-PLANAR TRANSISTOR STRUCTURES AND METHODS OF MANUFACTURING THEREOF

METHODS AND STRUCTURES FOR INCREASING STABILITY OF SOFT OR ORGANIC...

METHOD OF SELF-ALIGNED DIELECTRIC WALL FORMATION FOR FORKSHEET APPL...

Selective Deposition of Passivating Layer During Spacer Etching

Method of Profile Control for Semiconductor Manufacturing

Method and Apparatus for In-Situ Dry Development

Double Patterning Method of Patterning a Substrate

METHODS FOR PLANARIZING A SUBSTRATE USING A COMBINED WET ETCH AND C...

WET ETCH PROCESS AND METHOD TO CONTROL FIN HEIGHT AND CHANNEL AREA...

WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...

Method for Processing a Substrate

Patterning a Semiconductor Substrate

DOUBLE HARDMASKS FOR SELF-ALIGNED MULTI-PATTERNING PROCESSES

TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...

Variable Hardness Amorphous Carbon Mask

Methods To Provide Anisotropic Etching Of Metal Hard Masks Using A...

Method For Improving Etch Rate And Critical Dimension Uniformity Wh...

Method For Highly Anisotropic Etching Of Titanium Oxide Spacer Usin...

SACRIFICIAL GATE CAPPING LAYER FOR GATE PROTECTION

Method of Line Roughness Reduction and Self-Aligned Multi-Patternin...

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...

METHOD FOR PATTERNING A DIELECTRIC LAYER

Method For Reducing Lithography Defects and Pattern Transfer

METHODS FOR EUV INVERSE PATTERNING IN PROCESSING OF MICROELECTRONIC...

FORMING A SEMICONDUCTOR FEATURE USING ATOMIC LAYER ETCH

Multiple Patterning Processes

DEPOSITION PROCESS

METHOD AND SYSTEM FOR CAPPING OF CORES FOR SELF-ALIGNED MULTIPLE PA...

SELF-AWARE AND CORRECTING HETEROGENOUS PLATFORM INCORPORATING INTEG...