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Eric Daniel Perfecto
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Poughkeepsie, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Chip-to-chip and chip-to-substrate interconnections in multi-chip s...
Patent number
10,438,894
Issue date
Oct 8, 2019
GLOBALFOUNDRIES Inc.
Mukta Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure for establishing interconnects in packages using thin int...
Patent number
10,002,835
Issue date
Jun 19, 2018
GLOBALFOUNDRIES Inc.
Benjamin V. Fasano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device contact structure having stacked nickel, coppe...
Patent number
9,853,006
Issue date
Dec 26, 2017
GLOBALFOUNDRIES Inc.
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-transparent microelectronic grade glass as a substrate, tempora...
Patent number
9,728,440
Issue date
Aug 8, 2017
GLOBALFOUNDRIES Inc.
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrodeposition systems and methods that minimize anode and/or pl...
Patent number
9,689,084
Issue date
Jun 27, 2017
GLOBALFOUNRIES INC.
Charles L. Arvin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for establishing interconnects in packages using thin interp...
Patent number
9,607,973
Issue date
Mar 28, 2017
GLOBALFOUNDRIES Inc.
Benjamin V. Fasano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silver alloying post-chip join
Patent number
9,576,922
Issue date
Feb 21, 2017
GLOBALFOUNDRIES Inc.
Thomas J. Brunschwiler
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayered contact structure having nickel, copper, and nickel-ir...
Patent number
9,396,991
Issue date
Jul 19, 2016
GLOBALFOUNDRIES Inc.
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electromigration-resistant lead-free solder interconnect structures
Patent number
9,379,007
Issue date
Jun 28, 2016
Globalfoundries Inc.
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal solder joints for 3D packaging
Patent number
9,343,420
Issue date
May 17, 2016
GLOBALFOUNDRIES Inc.
Brian M. Erwin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of electrolytic plating to control solder wetting
Patent number
9,324,669
Issue date
Apr 26, 2016
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic coating to inhibit solder wetting on pillar sidewalls
Patent number
9,190,376
Issue date
Nov 17, 2015
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact and solder ball interconnect
Patent number
9,177,928
Issue date
Nov 3, 2015
Globalfoundries
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under ball metallurgy (UBM) for improved electromigration
Patent number
9,142,501
Issue date
Sep 22, 2015
International Business Machines Corporation
Charles L. Arvin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Under ball metallurgy (UBM) for improved electromigration
Patent number
9,084,378
Issue date
Jul 14, 2015
International Business Machines Corporation
Charles L. Arvin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Far back end of the line metallization method and structures
Patent number
8,937,009
Issue date
Jan 20, 2015
International Business Machines Corporation
Timothy H. Daubenspeck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
Patent number
8,910,853
Issue date
Dec 16, 2014
International Business Machines Corporation
Charles L. Arvin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Injection molded solder process for forming solder bumps on substrates
Patent number
8,820,612
Issue date
Sep 2, 2014
International Business Machines Corporation
Claudius Feger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder volume compensation with C4 process
Patent number
8,742,578
Issue date
Jun 3, 2014
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-to-wafer process for manufacturing a stacked structure
Patent number
8,518,741
Issue date
Aug 27, 2013
International Business Machines Corporation
Minhua Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Injection molded solder process for forming solder bumps on substrates
Patent number
8,496,159
Issue date
Jul 30, 2013
International Business Machines Corporation
Claudius Feger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
Patent number
8,493,746
Issue date
Jul 23, 2013
International Business Machines Corporation
Charles L. Arvin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three dimensional stacked package structure
Patent number
8,466,543
Issue date
Jun 18, 2013
International Business Machines Corporation
Thomas J. Fleischman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip assembly method employing post-contact differential heating
Patent number
8,381,966
Issue date
Feb 26, 2013
International Business Machines Corporation
Rajneesh Kumar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dimensionally decoupled ball limiting metalurgy
Patent number
8,338,286
Issue date
Dec 25, 2012
International Business Machines Corporation
Eric David Perfecto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optimization of metallurgical properties of a solder joint
Patent number
8,197,612
Issue date
Jun 12, 2012
International Business Machines Corporation
James A Busby
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Materials and method to seal vias in silicon substrates
Patent number
7,199,450
Issue date
Apr 3, 2007
International Business Machines Corporation
Jon A. Casey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film transfer join process and multilevel thin film module
Patent number
6,998,327
Issue date
Feb 14, 2006
International Business Machines Corporation
Jeffrey B. Danielson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
Patent number
6,678,949
Issue date
Jan 20, 2004
International Business Machines Corporation
Chandrika Prasad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device produced by a process of controlling grain growth in metal f...
Patent number
6,638,374
Issue date
Oct 28, 2003
International Business Machines Corporation
Patrick W. DeHaven
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
Publication number
20240170288
Publication date
May 23, 2024
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
Publication number
20240113055
Publication date
Apr 4, 2024
International Business Machines Corporation
Nicholas Alexander Polomoff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
Publication number
20230268275
Publication date
Aug 24, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID
Publication number
20180166356
Publication date
Jun 14, 2018
GLOBALFOUNDRIES INC.
Shahid A. Butt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USI...
Publication number
20170148737
Publication date
May 25, 2017
GLOBALFOUNDRIES INC.
Benjamin V. FASANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILVER ALLOYING POST-CHIP JOIN
Publication number
20160329289
Publication date
Nov 10, 2016
GLOBALFOUNDRIES INC.
Thomas J. Brunschwiler
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAYERED CONTACT STRUCTURE
Publication number
20160307860
Publication date
Oct 20, 2016
GLOBALFOUNDRIES INC.
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-TRANSPARENT MICROELECTRONIC GRADE GLASS AS A SUBSTRATE, TEMPORA...
Publication number
20160118287
Publication date
Apr 28, 2016
International Business Machines Corporation
Charles L. Arvin
B32 - LAYERED PRODUCTS
Information
Patent Application
USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING
Publication number
20160079193
Publication date
Mar 17, 2016
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYERED CONTACT STRUCTURE HAVING NICKEL, COPPER, AND NICKEL-IR...
Publication number
20160056072
Publication date
Feb 25, 2016
GLOBALFOUNDRIES, Inc.
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRODEPOSITION SYSTEMS AND METHODS THAT MINIMIZE ANODE AND/OR PL...
Publication number
20150337451
Publication date
Nov 26, 2015
International Business Machines Corporation
Charles L. Arvin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ORGANIC COATING TO INHIBIT SOLDER WETTING ON PILLAR SIDEWALLS
Publication number
20150333025
Publication date
Nov 19, 2015
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT AND SOLDER BALL INTERCONNECT
Publication number
20150311170
Publication date
Oct 29, 2015
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNIVERSAL SOLDER JOINTS FOR 3D PACKAGING
Publication number
20150235979
Publication date
Aug 20, 2015
International Business Machines Corporation
Brian M. Erwin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
Publication number
20140339699
Publication date
Nov 20, 2014
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES
Publication number
20140319522
Publication date
Oct 30, 2014
International Business Machines Corporation
Timothy H. Daubenspeck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
Publication number
20140262458
Publication date
Sep 18, 2014
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-to-Wafer Process for Manufacturing a Stacked Structure
Publication number
20140124948
Publication date
May 8, 2014
International Business Machines Corporation
Minhua Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER VOLUME COMPENSATION WITH C4 PROCESS
Publication number
20140021607
Publication date
Jan 23, 2014
International Business Machines Corporation
Charles L. Arvin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
Publication number
20130284495
Publication date
Oct 31, 2013
Charles L. Arvin
B82 - NANO-TECHNOLOGY
Information
Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
Publication number
20130249066
Publication date
Sep 26, 2013
International Business Machines Corporation
CHARLES L. ARVIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
Publication number
20130252418
Publication date
Sep 26, 2013
International Business Machines Corporation
CHARLES L. ARVIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES
Publication number
20120305631
Publication date
Dec 6, 2012
International Business Machines Corporation
Claudius Feger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES
Publication number
20120305633
Publication date
Dec 6, 2012
International Business Machines Corporation
Claudius Feger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP ASSEMBLY METHOD EMPLOYING POST-CONTACT DIFFERENTIAL HEATING
Publication number
20120217287
Publication date
Aug 30, 2012
International Business Machines Corporation
Rajneesh Kumar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY
Publication number
20120083114
Publication date
Apr 5, 2012
International Business Machines Corporation
ERIC DANIEL PERFECTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL STACKED PACKAGE STRUCTURE
Publication number
20110291261
Publication date
Dec 1, 2011
International Business Machines Corporation
Thomas J. Fleischman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Robust FBEOL and UBM Structure of C4 Interconnects
Publication number
20110063815
Publication date
Mar 17, 2011
International Business Machines Corporation
Minhua Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
Publication number
20100200271
Publication date
Aug 12, 2010
International Business Machines Corporation
Charles L. Arvin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT
Publication number
20090266447
Publication date
Oct 29, 2009
International Business Machines Corporation
JAMES A. BUSBY
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR