Eric Lewandowski

Person

Morristown, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective chemical frequency modification of Josephson junction res...
- Patent number 11,895,932
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
Information Patent Grant
Molten solder injection head with vacuum filter and differential ga...
- Patent number 11,766,729
- Issue date Sep 26, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microbattery separator
- Patent number 11,258,132
- Issue date Feb 22, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid readout package for quantum multichip bonding
- Patent number 11,195,799
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cold-welded flip chip interconnect structure
- Patent number 11,165,010
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Permanent wafer handlers with through silicon vias for thermalizati...
- Patent number 11,158,781
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sandwich-parallel micro-battery
- Patent number 11,043,690
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 10,937,735
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Delivery device including reactive material for programmable discre...
- Patent number 10,881,788
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermalization structure for cryogenic temperature devices
- Patent number 10,833,241
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stud bumps for post-measurement qubit frequency modification
- Patent number 10,692,831
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Nicholas T. Bronn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cathode for thin film microbattery
- Patent number 10,686,164
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a homogeneous solid metallic anode for a thin fil...
- Patent number 10,622,590
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bumps using sacrificial layer
- Patent number 10,535,592
- Issue date Jan 14, 2020
- International Business Machines Corporation
- Eric P. Lewandowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microbattery separator
- Patent number 10,388,929
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Homogeneous solid metallic anode for thin film microbattery
- Patent number 10,096,802
- Issue date Oct 9, 2018
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Cathode for thin film microbattery
- Patent number 10,069,116
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming solder bumps using sacrificial layer
- Patent number 9,953,908
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cathode for thin film microbattery
- Patent number 9,806,299
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Controlling fragmentation of chemically strengthened glass
- Patent number 9,738,560
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Cyril Cabral
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Adhesives for bonding handler wafers to device wafers and enabling...
- Patent number 9,586,291
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling fragmentation of chemically strengthened glass
- Patent number 9,586,857
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Cyril Cabral
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer level overmold for three dimensional surfaces
- Patent number 9,508,566
- Issue date Nov 29, 2016
- International Business Machines Corporation
- Paul S Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, flexible microsystem with integrated energy source
- Patent number 9,472,789
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CHEMICAL FREQUENCY MODIFICATION OF JOSEPHSON JUNCTION RES...
- Publication number 20210408360
- Publication date Dec 30, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID READOUT PACKAGE FOR QUANTUM MULTICHIP BONDING
- Publication number 20210305165
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Dongbing Shao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PERMANENT WAFER HANDLERS WITH THROUGH SILICON VIAS FOR THERMALIZATI...
- Publication number 20210159382
- Publication date May 27, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH CAPACITY COMPACT LITHIUM THIN FILM BATTERY
- Publication number 20210091372
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING SOLDER BUMPS
- Publication number 20210028138
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD-WELDED FLIP CHIP INTERCONNECT STRUCTURE
- Publication number 20200259064
- Publication date Aug 13, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH-PARALLEL MICRO-BATTERY
- Publication number 20200212475
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20200098695
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROBATTERY SEPARATOR
- Publication number 20190372075
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molten Solder Injection Head with Vacuum Filter and Differential Ga...
- Publication number 20190091786
- Publication date Mar 28, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY
- Publication number 20190019997
- Publication date Jan 17, 2019
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CATHODE FOR THIN FILM MICROBATTERY
- Publication number 20180331329
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
- Publication number 20180218970
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
- Publication number 20180218971
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODE FOR THIN FILM MICROBATTERY
- Publication number 20180040859
- Publication date Feb 8, 2018
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROBATTERY SEPARATOR
- Publication number 20170179455
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER
- Publication number 20170125329
- Publication date May 4, 2017
- International Business Machines Corporation
- Eric P. Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delivery Device Including Reactive Material For Programmable Discre...
- Publication number 20170119960
- Publication date May 4, 2017
- International Business Machines Corporation
- BING DANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS
- Publication number 20160264456
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Cyril Cabral
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS
- Publication number 20160137548
- Publication date May 19, 2016
- International Business Machines Corporation
- Cyril Cabral
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Wafer Level Overmold for Three Dimensional Surfaces
- Publication number 20160049344
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY
- Publication number 20150288024
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN, FLEXIBLE MICROSYSTEM WITH INTEGRATED ENERGY SOURCE
- Publication number 20150287960
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
CATHODE FOR THIN FILM MICROBATTERY
- Publication number 20150288023
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE BONDING OF A FLIP CHIP PACKAGE
- Publication number 20150137366
- Publication date May 21, 2015
- International Business Machines Corporation
- Gregory M. Fritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING...
- Publication number 20150035173
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Bing Dang
- B32 - LAYERED PRODUCTS

Eric Lewandowski

Person

Patents Grantslast 30 patents

Uniform chip gaps via injection-molded solder pillars

System and method for forming solder bumps

Selective chemical frequency modification of Josephson junction res...

Molten solder injection head with vacuum filter and differential ga...

Hybrid under-bump metallization component

Microbattery separator

Hybrid readout package for quantum multichip bonding

Cold-welded flip chip interconnect structure

Permanent wafer handlers with through silicon vias for thermalizati...

Sandwich-parallel micro-battery

Hybrid under-bump metallization component

Delivery device including reactive material for programmable discre...

System and method for forming solder bumps

Thermalization structure for cryogenic temperature devices

Stud bumps for post-measurement qubit frequency modification

Cathode for thin film microbattery

Two-component bump metallization

Method of forming a homogeneous solid metallic anode for a thin fil...

Two-component bump metallization

Method for forming solder bumps using sacrificial layer

Microbattery separator

Homogeneous solid metallic anode for thin film microbattery

Cathode for thin film microbattery

Method for forming solder bumps using sacrificial layer

Cathode for thin film microbattery

Controlling fragmentation of chemically strengthened glass

Adhesives for bonding handler wafers to device wafers and enabling...

Controlling fragmentation of chemically strengthened glass

Wafer level overmold for three dimensional surfaces

Thin, flexible microsystem with integrated energy source

Patents Applicationslast 30 patents

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

SELECTIVE CHEMICAL FREQUENCY MODIFICATION OF JOSEPHSON JUNCTION RES...

HYBRID READOUT PACKAGE FOR QUANTUM MULTICHIP BONDING

PERMANENT WAFER HANDLERS WITH THROUGH SILICON VIAS FOR THERMALIZATI...

HYBRID UNDER-BUMP METALLIZATION COMPONENT

HIGH CAPACITY COMPACT LITHIUM THIN FILM BATTERY

SYSTEM AND METHOD FOR FORMING SOLDER BUMPS

COLD-WELDED FLIP CHIP INTERCONNECT STRUCTURE

SANDWICH-PARALLEL MICRO-BATTERY

HYBRID UNDER-BUMP METALLIZATION COMPONENT

MICROBATTERY SEPARATOR

TWO-COMPONENT BUMP METALLIZATION

TWO-COMPONENT BUMP METALLIZATION

Molten Solder Injection Head with Vacuum Filter and Differential Ga...

HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY

CATHODE FOR THIN FILM MICROBATTERY

METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER

METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER

CATHODE FOR THIN FILM MICROBATTERY

MICROBATTERY SEPARATOR

METHOD FOR FORMING SOLDER BUMPS USING SACRIFICIAL LAYER

Delivery Device Including Reactive Material For Programmable Discre...

CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS

CONTROLLING FRAGMENTATION OF CHEMICALLY STRENGTHENED GLASS

Wafer Level Overmold for Three Dimensional Surfaces

HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY

THIN, FLEXIBLE MICROSYSTEM WITH INTEGRATED ENERGY SOURCE

CATHODE FOR THIN FILM MICROBATTERY

REACTIVE BONDING OF A FLIP CHIP PACKAGE

ADHESIVES FOR BONDING HANDLER WAFERS TO DEVICE WAFERS AND ENABLING...