Erik Heinemann

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic component and method for producing an optoelectronic...
- Patent number 9,368,700
- Issue date Jun 14, 2016
- Osram Opto Semiconductors GmbH
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing a semiconductor...
- Patent number 7,902,683
- Issue date Mar 8, 2011
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optoelectronic surface-mounted device and method for forming an opt...
- Patent number 7,731,433
- Issue date Jun 8, 2010
- Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Erik Heinemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module and chip card
- Patent number 7,605,453
- Issue date Oct 20, 2009
- Infineon Technologies AG
- Peter Stampka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing laminated smart cards
- Patent number 7,069,652
- Issue date Jul 4, 2006
- Infineon Technologies AG
- Erik Heinemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Making contact with semiconductor chips in chip cards
- Patent number 7,019,981
- Issue date Mar 28, 2006
- Infineon Technologies AG
- Erik Heinemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Smart-card module with an anisotropically conductive substrate film
- Patent number 6,992,898
- Issue date Jan 31, 2006
- Infineon Technologies AG
- Erik Heinemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device with at least one semiconductor component and a printed circ...
- Patent number 6,806,562
- Issue date Oct 19, 2004
- Infineon Technologies AG
- Bernd Barchmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart card module, smart card with the smart card module, and metho...
- Patent number 6,557,769
- Issue date May 6, 2003
- Infineon Technologies AG
- Frank Püschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a chip module
- Patent number 6,472,250
- Issue date Oct 29, 2002
- Infineon Technologies AG
- Frank Püschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adhesive joint assembly
- Patent number 6,469,902
- Issue date Oct 22, 2002
- Siemens Aktiengesellschaft
- Frank Püschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Carrier element for a semiconductor chip for integration into a chi...
- Patent number D405779
- Issue date Feb 16, 1999
- Siemens Aktiengesellschaft
- Michael Huber
- D14 - Recording, communication, or information retrieval equipment

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND COMPONENT
- Publication number 20240275127
- Publication date Aug 15, 2024
- ams-OSRAM International GmbH
- Jörg Erich SORG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Component and Method for Producing an Optoelectronic...
- Publication number 20140191272
- Publication date Jul 10, 2014
- Osram Opto Semiconductors GmbH
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component and Method for Producing a Semiconductor Co...
- Publication number 20130181247
- Publication date Jul 18, 2013
- Osram Opto Semiconductors GmbH
- Simon Jerebic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SURFACE-MOUNTED DEVICE AND METHOD FOR FORMING AN OPT...
- Publication number 20100142882
- Publication date Jun 10, 2010
- AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
- Erik Heinemann
- G02 - OPTICS
Information Patent Application
CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE
- Publication number 20080205012
- Publication date Aug 28, 2008
- INFINEON TECHNOLOGIES AG
- ERIK HEINEMANN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP MODULE AND CHIP CARD
- Publication number 20070034999
- Publication date Feb 15, 2007
- Infineon Technologies AG
- Peter Stampka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor arrangement and method for producing a semiconductor...
- Publication number 20060278958
- Publication date Dec 14, 2006
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Nonconducting substrate, forming a strip or a panel, on which a mul...
- Publication number 20040256150
- Publication date Dec 23, 2004
- Infineon Technologies AG
- Bernd Barchmann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Making contact with semiconductor chips in chip cards
- Publication number 20040150962
- Publication date Aug 5, 2004
- Infineon Technologies AG
- Erik Heinemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for producing laminated smart cards
- Publication number 20030064544
- Publication date Apr 3, 2003
- Erik Heinemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Smart-card module with an anisotropically conductive substrate film
- Publication number 20020172018
- Publication date Nov 21, 2002
- Erik Heinemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device with at least one semiconductor component and a printed circ...
- Publication number 20020113311
- Publication date Aug 22, 2002
- Bernd Barchmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart card module, smart card with the smart card module, and metho...
- Publication number 20020113131
- Publication date Aug 22, 2002
- Frank Puschner
- G06 - COMPUTING CALCULATING COUNTING

Erik Heinemann

Person

Patents Grantslast 30 patents

Optoelectronic component and method for producing an optoelectronic...

Semiconductor arrangement and method for producing a semiconductor...

Optoelectronic surface-mounted device and method for forming an opt...

Chip module and chip card

Method for producing laminated smart cards

Making contact with semiconductor chips in chip cards

Smart-card module with an anisotropically conductive substrate film

Device with at least one semiconductor component and a printed circ...

Smart card module, smart card with the smart card module, and metho...

Method for producing a chip module

Adhesive joint assembly

Carrier element for a semiconductor chip for integration into a chi...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND COMPONENT

Optoelectronic Component and Method for Producing an Optoelectronic...

Semiconductor Component and Method for Producing a Semiconductor Co...

OPTOELECTRONIC SURFACE-MOUNTED DEVICE AND METHOD FOR FORMING AN OPT...

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

CHIP MODULE AND CHIP CARD

Semiconductor arrangement and method for producing a semiconductor...

Nonconducting substrate, forming a strip or a panel, on which a mul...

Making contact with semiconductor chips in chip cards

Method for producing laminated smart cards

Smart-card module with an anisotropically conductive substrate film

Device with at least one semiconductor component and a printed circ...

Smart card module, smart card with the smart card module, and metho...