Claims
- 1. A chip card comprising:
a chip card body having a first cavity and a second cavity, the second cavity being recessed into a base of the first cavity, so that the first cavity extends laterally beyond the second cavity and a base surface of the first cavity surrounds the second cavity; a carrier substrate secured to the chip card body and arranged in the first cavity and having an upper surface contact for reading the chip card on its top side and a lower surface contact on its underside, which are electrically connected to one another by contact-hole lines, which run through the carrier substrate, the contact-hole lines passing through both the lower surface contacts and the upper surface contacts and being arranged in a region of the first cavity which extends laterally outside the second cavity, and the contact-hole lines being covered at the base of the first cavity; a semiconductor chip connected to the lower surface contacts of the carrier substrate by electrical connections; and a bonding layer, which extends from the base of the first cavity into an interior of the second cavity and covers a region of the semiconductor chip, securing the carrier substrate, on its underside, to the base surface of the first cavity.
- 2. The chip card of claim 1, wherein the bonding layer surrounds the semiconductor chip in the second cavity from below.
- 3. The chip card of claim 1, further comprising an electrically insulating or anisotropic conductive paste covering the semiconductor chip in a region of the electrical connections to the lower surface contacts of the carrier substrate, and not covering a region of the semiconductor chip which is not covered by the paste.
- 4. The chip card of claim 1, wherein the bonding layer covers the contact-hole lines.
- 5. The chip card of claim 1, further comprising recesses formed by the bonding layer and surrounding the contact-hole lines, wherein the bonding layer surrounds and seals spaces formed by the recesses.
- 6. The chip card of claim 1, wherein the lower surface contact of the carrier substrate extends beyond an inner edge of a base surface of the first cavity and above the semiconductor chip within the second cavity.
- 7. The chip card of claim 1, wherein the semiconductor chip is bonded to the lower surface contacts of the carrier substrate using a flip-chip method.
- 8. The chip card of claim 1, wherein the bonding layer is formed from a material which only becomes adhesive at an elevated temperature.
- 9. The chip card of claim 1, wherein the bonding layer is formed from a cured liquid adhesive.
- 10. The chip card of claim 9, wherein the bonding layer is formed from cured cyanoacrylate.
- 11. The chip card of claim 1, wherein the chip card is a mobile radio card.
- 12. A chip card comprising:
a chip card body having a first cavity and a second cavity, the second cavity being recessed into a base of the first cavity, so that the first cavity extends laterally beyond the second cavity and a base surface of the first cavity surrounds the second cavity; a semiconductor chip provided in the second cavity; a carrier substrate provided in the first cavity and having upper and lower surface contacts; a contact-hole line electrically connecting the upper and lower surface contacts of the carrier substrate and arranged in a region of the first cavity which extends laterally outside the second cavity; and a bonding layer extending from the base of the first cavity into an interior of the second cavity, closing a lower end of the contact-hole line, and covering a region of the semiconductor chip.
- 13. The chip card of claim 12, wherein the bonding layer surrounds the semiconductor chip in the second cavity from below.
- 14. The chip card of claim 12, further comprising a recess formed by the bonding layer and surrounding the contact-hole line, wherein the bonding layer surrounds and seals a space formed by the recess.
- 15. The chip card of claim 12, wherein the lower surface contact of the carrier substrate extends beyond an inner edge of a base surface of the first cavity and above the semiconductor chip within the second cavity.
- 16. The chip card of claim 12, wherein the semiconductor chip is bonded to the lower surface contact of the carrier substrate using a flip-chip method.
- 17. The chip card of claim 12, wherein the bonding layer is formed from a material which only becomes adhesive at an elevated temperature.
- 18. The chip card of claim 12, wherein the bonding layer is formed from a cured liquid adhesive.
- 19. The chip card of claim 18, wherein the bonding layer is formed from cured cyanoacrylate.
- 20. The chip card of claim 12, wherein the chip card is a mobile radio card.
Priority Claims (1)
Number |
Date |
Country |
Kind |
101 39 395.4 |
Aug 2001 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of International Patent Application Serial No. PCT/DE02/02935, filed Aug. 9, 2002, which published in German on Feb. 27, 2003 as WO 03/017196.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE02/02935 |
Aug 2002 |
US |
Child |
10762882 |
Jan 2004 |
US |