Erik Wilson

Follow

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ruthenium interconnect with high aspect ratio and method of fabrica...
- Patent number 9,299,643
- Issue date Mar 29, 2016
- Cypress Semiconductor Corporation
- Zheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-filling with uniform properties
- Patent number 8,415,256
- Issue date Apr 9, 2013
- Alexander Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-H plasma treatment with N2 anneal for electronic memory devices
- Patent number 8,202,810
- Issue date Jun 19, 2012
- Spansion LLC
- Alexander H. Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu annealing for improved data retention in flash memory devices
- Patent number 8,026,169
- Issue date Sep 27, 2011
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-filling with uniform properties
- Patent number 7,884,030
- Issue date Feb 8, 2011
- Advanced Micro Devices, Inc. and Spansion LLC
- Alexander Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with copper interconnects and composite silic...
- Patent number 7,534,732
- Issue date May 19, 2009
- Spansion LLC
- Minh Van Ngo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Ruthenium interconnect with high aspect ratio and method of fabrica...
- Publication number 20100078815
- Publication date Apr 1, 2010
- Zheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu annealing for improved data retention in flash memory devices
- Publication number 20080108193
- Publication date May 8, 2008
- Spansion LLC
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal liner for gap-filling
- Publication number 20080096364
- Publication date Apr 24, 2008
- Spansion LLC
- Erik Wilson
- H01 - BASIC ELECTRIC ELEMENTS