Evan E. Patton

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 8,883,640
- Issue date Nov 11, 2014
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 8,450,210
- Issue date May 28, 2013
- Novellus Systems, Inc.
- Evan E. Patton
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for electroplating metals into microscopic recessed features
- Patent number 8,048,280
- Issue date Nov 1, 2011
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 8,026,174
- Issue date Sep 27, 2011
- Novellus Systems, Inc.
- Evan E. Patton
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sensor for measuring liquid contaminants in a semiconductor wafer f...
- Patent number 7,696,538
- Issue date Apr 13, 2010
- Novellus Systems, Inc.
- Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for controlled-angle wafer positioning
- Patent number 7,686,927
- Issue date Mar 30, 2010
- Novellus Systems, Inc.
- Jonathan D. Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential station tool for wet processing of semiconductor wafers
- Patent number 7,189,647
- Issue date Mar 13, 2007
- Novellus Systems, Inc.
- Evan E. Patton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for controlled-angle wafer positioning
- Patent number 7,097,410
- Issue date Aug 29, 2006
- Novellus Systems, Inc.
- Jonathan D. Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid detection end effector sensor and method of using the same
- Patent number 7,084,466
- Issue date Aug 1, 2006
- Novellus Systems, Inc.
- Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamshell apparatus with crystal shielding and in-situ rinse-dry
- Patent number 7,033,465
- Issue date Apr 25, 2006
- Novellus Systems, Inc.
- Evan E. Patton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for controlling electrolyte flow for uniform...
- Patent number 6,964,792
- Issue date Nov 15, 2005
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for electroplating metal into microscopic recessed features
- Patent number 6,946,065
- Issue date Sep 20, 2005
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper electroplating method and apparatus
- Patent number 6,890,416
- Issue date May 10, 2005
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamshell apparatus for electrochemically treating wafers
- Patent number 6,800,187
- Issue date Oct 5, 2004
- Novellus Systems, Inc.
- Jonathan D. Reid
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for uniform electroplating of thin metal seede...
- Patent number 6,773,571
- Issue date Aug 10, 2004
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Clamshell apparatus with dynamic uniformity control
- Patent number 6,755,946
- Issue date Jun 29, 2004
- Novellus Systems, Inc.
- Evan E. Patton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating process chamber and method with pre-wetting and rins...
- Patent number 6,716,334
- Issue date Apr 6, 2004
- Novellus Systems, Inc.
- Jonathan D. Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electroplating copper onto semiconductor wafer
- Patent number 6,589,401
- Issue date Jul 8, 2003
- Novellus Systems, Inc.
- Evan E. Patton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for controlled-angle wafer immersion
- Patent number 6,551,487
- Issue date Apr 22, 2003
- Novellus Systems, Inc.
- Jonathan D. Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electroplating apparatus
- Patent number 6,527,920
- Issue date Mar 4, 2003
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of controlling chemical bath composition in a manufacturing...
- Patent number 6,471,845
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John O. Dukovic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Clamshell apparatus for electrochemically treating semiconductor wa...
- Patent number 6,436,249
- Issue date Aug 20, 2002
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for uniform electroplating of integrated circu...
- Patent number 6,402,923
- Issue date Jun 11, 2002
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual channel rotary union
- Patent number 6,343,793
- Issue date Feb 5, 2002
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Edge bevel removal of copper from silicon wafers
- Patent number 6,309,981
- Issue date Oct 30, 2001
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating process including pre-wetting and rinsing
- Patent number 6,214,193
- Issue date Apr 10, 2001
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric potential shaping apparatus for holding a semiconductor wa...
- Patent number 6,193,859
- Issue date Feb 27, 2001
- Novellus Systems, Inc.
- Robert J. Contolini
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating semiconductor wafer using variable current...
- Patent number 6,162,344
- Issue date Dec 19, 2000
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electric potential shaping method for electroplating
- Patent number 6,159,354
- Issue date Dec 12, 2000
- Novellus Systems, Inc.
- Robert J. Contolini
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Clamshell apparatus for electrochemically treating semiconductor wa...
- Patent number 6,156,167
- Issue date Dec 5, 2000
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR ELECTROPLATING METALS INTO MICROSCOPIC RECESSED FEATURES
- Publication number 20120279864
- Publication date Nov 8, 2012
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Liquid detection end effector sensor and method of using the same
- Publication number 20060169977
- Publication date Aug 3, 2006
- Novellus Systems, Inc.
- Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for electroplating metals into microscopic recessed features
- Publication number 20060011483
- Publication date Jan 19, 2006
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sequential station tool for wet processing of semiconductor wafers
- Publication number 20050282371
- Publication date Dec 22, 2005
- Novellus Systems, Inc.
- Evan E. Patton
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Evan E. Patton

Person

Patents Grantslast 30 patents

Sequential station tool for wet processing of semiconductor wafers

Sequential station tool for wet processing of semiconductor wafers

Process for electroplating metals into microscopic recessed features

Sequential station tool for wet processing of semiconductor wafers

Sensor for measuring liquid contaminants in a semiconductor wafer f...

Methods and apparatus for controlled-angle wafer positioning

Sequential station tool for wet processing of semiconductor wafers

Methods and apparatus for controlled-angle wafer positioning

Liquid detection end effector sensor and method of using the same

Clamshell apparatus with crystal shielding and in-situ rinse-dry

Methods and apparatus for controlling electrolyte flow for uniform...

Process for electroplating metal into microscopic recessed features

Copper electroplating method and apparatus

Clamshell apparatus for electrochemically treating wafers

Method and apparatus for uniform electroplating of thin metal seede...

Clamshell apparatus with dynamic uniformity control

Electroplating process chamber and method with pre-wetting and rins...

Apparatus for electroplating copper onto semiconductor wafer

Methods and apparatus for controlled-angle wafer immersion

Copper electroplating apparatus

Method of controlling chemical bath composition in a manufacturing...

Clamshell apparatus for electrochemically treating semiconductor wa...

Method and apparatus for uniform electroplating of integrated circu...

Dual channel rotary union

Edge bevel removal of copper from silicon wafers

Electroplating process including pre-wetting and rinsing

Electric potential shaping apparatus for holding a semiconductor wa...

Method of electroplating semiconductor wafer using variable current...

Electric potential shaping method for electroplating

Clamshell apparatus for electrochemically treating semiconductor wa...

Patents Applicationslast 30 patents

PROCESS FOR ELECTROPLATING METALS INTO MICROSCOPIC RECESSED FEATURES

Liquid detection end effector sensor and method of using the same

Process for electroplating metals into microscopic recessed features

Sequential station tool for wet processing of semiconductor wafers