Fang-Chang Liu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for storing and transporting semiconductor elements, and...
- Patent number 12,085,220
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die carrier structure
- Patent number 11,881,421
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Chung Tsai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor processing apparatus and method utilizing electrostat...
- Patent number 11,854,860
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for storing and transporting semiconductor elements, and...
- Patent number 11,796,123
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for generating ultrasonic panoramic image and ultrasonic dev...
- Patent number 11,647,987
- Issue date May 16, 2023
- QISDA Corporation
- Wei-Shin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor processing apparatus and method utilizing electrostat...
- Patent number 11,532,499
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for storing and transporting semiconductor elements, and...
- Patent number 11,195,737
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Sung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral power device with reduced on-resistance
- Patent number 11,101,349
- Issue date Aug 24, 2021
- Efficient Power Conversion Corporation
- Wen-Chia Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die carrier structure
- Patent number 10,964,569
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Cheng Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatus and method utilizing electrostat...
- Patent number 10,950,485
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image calibration method and detecting device
- Patent number 10,937,137
- Issue date Mar 2, 2021
- QISDA Corporation
- Fang-Bin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for storing and transporting semiconductor elements, and...
- Patent number 10,738,935
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
GaN transistors with polysilicon layers used for creating additiona...
- Patent number 10,312,260
- Issue date Jun 4, 2019
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN transistors with polysilicon layers used for creating additiona...
- Patent number 9,837,438
- Issue date Dec 5, 2017
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with matching threshold voltages and method for...
- Patent number 9,583,480
- Issue date Feb 28, 2017
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN device with reduced output capacitance and process for making same
- Patent number 9,331,191
- Issue date May 3, 2016
- Efficient Power Conversion Corporation
- Stephen L. Colino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN transistors with polysilicon layers for creating additional com...
- Patent number 9,214,461
- Issue date Dec 15, 2015
- Efficient Power Coversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with matching threshold voltages and method for...
- Patent number 9,214,399
- Issue date Dec 15, 2015
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate self-aligned isolation in gallium nitride devic...
- Patent number 9,214,528
- Issue date Dec 15, 2015
- Efficient Power Conversion Corporation
- Chunhua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure in gallium nitride devices and integrated circuits
- Patent number 9,171,911
- Issue date Oct 27, 2015
- Efficient Power Conversion Corporation
- Chunhua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement mode GaN HEMT device with gate spacer and method for fa...
- Patent number 8,823,012
- Issue date Sep 2, 2014
- Efficient Power Conversion Corporation
- Alexander Lidow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for back illuminated optoelectronic device an...
- Patent number 8,361,898
- Issue date Jan 29, 2013
- Visera Technologies Company Limited
- Kai-Chih Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating isolation structures for CMOS image sensor ch...
- Patent number 7,833,810
- Issue date Nov 16, 2010
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structures for optoelectronic devices
- Patent number 7,824,964
- Issue date Nov 2, 2010
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for network address translation based on pure...
- Patent number 7,746,869
- Issue date Jun 29, 2010
- Infineon Technologies AG
- Fang-Cheng Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bonding pad structure for back illuminated optoelectronic device an...
- Patent number 7,679,187
- Issue date Mar 16, 2010
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures for CMOS image sensor chip scale packages
- Patent number 7,569,409
- Issue date Aug 4, 2009
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for optoelectronic device and fabrication method...
- Patent number 7,566,944
- Issue date Jul 28, 2009
- Visera Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LIFM algorithm for security association database lookup in IPSEC ap...
- Patent number 7,100,043
- Issue date Aug 29, 2006
- ADMtek Incorporated
- Fang-cheng Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of making a bump on a substrate without ribbon residue
- Patent number 6,696,356
- Issue date Feb 24, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...
- Publication number 20240360950
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE CARRIER STRUCTURE
- Publication number 20240087932
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Chung TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...
- Publication number 20240087945
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...
- Publication number 20230383895
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...
- Publication number 20230077331
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE CARRIER STRUCTURE
- Publication number 20210217642
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Chung TSAI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...
- Publication number 20210202297
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROBING SYSTEM, SIGNAL PROCESSING METHOD AND RELATED PROBING...
- Publication number 20210165086
- Publication date Jun 3, 2021
- Qisda Corporation
- Ya-Wen Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...
- Publication number 20200335386
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...
- Publication number 20200332943
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LATERAL POWER DEVICE WITH REDUCED ON-RESISTANCE
- Publication number 20200075726
- Publication date Mar 5, 2020
- Efficient Power Conversion Corporation
- Wen-Chia Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CALIBRATION METHOD AND DETECTING DEVICE
- Publication number 20200065951
- Publication date Feb 27, 2020
- Qisda Corporation
- Fang-Bin LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE CARRIER STRUCTURE
- Publication number 20200006105
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Cheng KO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR GENERATING ULTRASONIC PANORAMIC IMAGE AND ULTRASONIC DEV...
- Publication number 20190231314
- Publication date Aug 1, 2019
- Qisda Corporation
- Wei-Shin Hung
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...
- Publication number 20190093815
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Tse-Lun Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GaN TRANSISTORS WITH POLYSILICON LAYERS USED FOR CREATING ADDITIONA...
- Publication number 20170330898
- Publication date Nov 16, 2017
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH MATCHING THRESHOLD VOLTAGES AND METHOD FOR...
- Publication number 20160111416
- Publication date Apr 21, 2016
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN TRANSISTORS WITH POLYSILICON LAYERS USED FOR CREATING ADDITIONA...
- Publication number 20160086980
- Publication date Mar 24, 2016
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASOUND SYSTEM AND POINTER CONTROLLER
- Publication number 20150157295
- Publication date Jun 11, 2015
- QISDA CORPORATION
- Fang-Bin Liu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT WITH MATCHING THRESHOLD VOLTAGES AND METHOD FOR...
- Publication number 20150034962
- Publication date Feb 5, 2015
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN TRANSISTORS WITH POLYSILICON LAYERS FOR CREATING ADDITIONAL COM...
- Publication number 20150028384
- Publication date Jan 29, 2015
- Efficient Power Conversion Corporation
- Jianjun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN DEVICE WITH REDUCED OUTPUT CAPACITANCE AND PROCESS FOR MAKING SAME
- Publication number 20150028390
- Publication date Jan 29, 2015
- Efficient Power Conversion Corporation
- Stephen L. Colino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FABRICATE SELF-ALIGNED ISOLATION IN GALLIUM NITRIDE DEVIC...
- Publication number 20150011057
- Publication date Jan 8, 2015
- Efficient Power Conversion Corporation
- Chunhua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PROCESSING METHOD AND IMAGE DISPLAY DEVICE
- Publication number 20140292793
- Publication date Oct 2, 2014
- QISDA CORPORATION
- Yu-Ting Lai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AN...
- Publication number 20100127408
- Publication date May 27, 2010
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR CHIP SCALE PACKAGES
- Publication number 20090263927
- Publication date Oct 22, 2009
- VISERA TECHNOLOGIES COMPANY LIMITED
- Tzu-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURES FOR OPTOELECTRONIC DEVICES
- Publication number 20090186449
- Publication date Jul 23, 2009
- Kai-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure for optoelectronic device
- Publication number 20090026562
- Publication date Jan 29, 2009
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure for back illuminated optoelectronic device an...
- Publication number 20080169117
- Publication date Jul 17, 2008
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure for optoelectronic device and fabrication method...
- Publication number 20080169477
- Publication date Jul 17, 2008
- VisEra Technologies Company Limited
- Kai-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Fang-Chang Liu

Person

Patents Grantslast 30 patents

Apparatus for storing and transporting semiconductor elements, and...

Semiconductor die carrier structure

Semiconductor processing apparatus and method utilizing electrostat...

Apparatus for storing and transporting semiconductor elements, and...

Method for generating ultrasonic panoramic image and ultrasonic dev...

Semiconductor processing apparatus and method utilizing electrostat...

Apparatus for storing and transporting semiconductor elements, and...

Lateral power device with reduced on-resistance

Semiconductor die carrier structure

Semiconductor processing apparatus and method utilizing electrostat...

Image calibration method and detecting device

Apparatus for storing and transporting semiconductor elements, and...

GaN transistors with polysilicon layers used for creating additiona...

GaN transistors with polysilicon layers used for creating additiona...

Integrated circuit with matching threshold voltages and method for...

GaN device with reduced output capacitance and process for making same

GaN transistors with polysilicon layers for creating additional com...

Integrated circuit with matching threshold voltages and method for...

Method to fabricate self-aligned isolation in gallium nitride devic...

Isolation structure in gallium nitride devices and integrated circuits

Enhancement mode GaN HEMT device with gate spacer and method for fa...

Bonding pad structure for back illuminated optoelectronic device an...

Method of fabricating isolation structures for CMOS image sensor ch...

Method for fabricating package structures for optoelectronic devices

Method and apparatus for network address translation based on pure...

Bonding pad structure for back illuminated optoelectronic device an...

Isolation structures for CMOS image sensor chip scale packages

Package structure for optoelectronic device and fabrication method...

LIFM algorithm for security association database lookup in IPSEC ap...

Method of making a bump on a substrate without ribbon residue

Patents Applicationslast 30 patents

APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...

SEMICONDUCTOR DIE CARRIER STRUCTURE

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...

APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...

SEMICONDUCTOR DIE CARRIER STRUCTURE

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...

SIGNAL PROBING SYSTEM, SIGNAL PROCESSING METHOD AND RELATED PROBING...

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...

APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...

LATERAL POWER DEVICE WITH REDUCED ON-RESISTANCE

IMAGE CALIBRATION METHOD AND DETECTING DEVICE

SEMICONDUCTOR DIE CARRIER STRUCTURE

METHOD FOR GENERATING ULTRASONIC PANORAMIC IMAGE AND ULTRASONIC DEV...

APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND...

GaN TRANSISTORS WITH POLYSILICON LAYERS USED FOR CREATING ADDITIONA...

INTEGRATED CIRCUIT WITH MATCHING THRESHOLD VOLTAGES AND METHOD FOR...

GAN TRANSISTORS WITH POLYSILICON LAYERS USED FOR CREATING ADDITIONA...

ULTRASOUND SYSTEM AND POINTER CONTROLLER

INTEGRATED CIRCUIT WITH MATCHING THRESHOLD VOLTAGES AND METHOD FOR...

GaN TRANSISTORS WITH POLYSILICON LAYERS FOR CREATING ADDITIONAL COM...

GaN DEVICE WITH REDUCED OUTPUT CAPACITANCE AND PROCESS FOR MAKING SAME

METHOD TO FABRICATE SELF-ALIGNED ISOLATION IN GALLIUM NITRIDE DEVIC...

IMAGE PROCESSING METHOD AND IMAGE DISPLAY DEVICE

BONDING PAD STRUCTURE FOR BACK ILLUMINATED OPTOELECTRONIC DEVICE AN...

ISOLATION STRUCTURES FOR CMOS IMAGE SENSOR CHIP SCALE PACKAGES

METHOD FOR FABRICATING PACKAGE STRUCTURES FOR OPTOELECTRONIC DEVICES

Package structure for optoelectronic device

Bonding pad structure for back illuminated optoelectronic device an...

Package structure for optoelectronic device and fabrication method...