Fang-Jun Leu

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,672,677
- Issue date Jun 2, 2020
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method of an image sensor module
- Patent number 7,572,676
- Issue date Aug 11, 2009
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure and method of manufacturing the same
- Patent number 7,544,529
- Issue date Jun 9, 2009
- Industrial Technology Research Institute
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure
- Patent number 7,417,293
- Issue date Aug 26, 2008
- Industrial Technology Research Institute
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method of an image sensor module
- Patent number 7,411,306
- Issue date Aug 12, 2008
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package for electronic elements and packaging method thereof
- Patent number 7,091,592
- Issue date Aug 15, 2006
- Industrial Technology Research Institute
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip ball grid array package with a heat slug
- Patent number 6,166,435
- Issue date Dec 26, 2000
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply device with low power dissipation
- Patent number 5,880,942
- Issue date Mar 9, 1999
- Acer Peripherals Inc.
- Fang-Jye Leu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Quickly restartable power supply apparatus
- Patent number 5,812,385
- Issue date Sep 22, 1998
- Acer Peripherals, Inc.
- Fang-Jye Leu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and apparatus for preventing improper switching of a dual po...
- Patent number 5,309,348
- Issue date May 3, 1994
- Acer Peripherals, Inc.
- Fang-Jye Leu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fanless convection cooling design for personal computers
- Patent number 5,243,493
- Issue date Sep 7, 1993
- Industrial Technology Research Institute
- Jian-Dih Jeng
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180358307
- Publication date Dec 13, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180261519
- Publication date Sep 13, 2018
- Industrial Technology Research Institute
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180233477
- Publication date Aug 16, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20170084521
- Publication date Mar 23, 2017
- Industrial Technology Research Institute
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method of an image sensor module
- Publication number 20070195188
- Publication date Aug 23, 2007
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070190687
- Publication date Aug 16, 2007
- Industrial Technology Research Institute
- Shou-Lung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package for electronic elements
- Publication number 20060220212
- Publication date Oct 5, 2006
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method of an image sensor module
- Publication number 20060030070
- Publication date Feb 9, 2006
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor packaging structure and method of manufacturing the same
- Publication number 20060022290
- Publication date Feb 2, 2006
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor packaging structure and method
- Publication number 20050236684
- Publication date Oct 27, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked package for electronic elements and packaging method thereof
- Publication number 20040238933
- Publication date Dec 2, 2004
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Fang-Jun Leu

Person

Patents Grantslast 30 patents

Electronic packaging structure

Semiconductor package structure

Packaging structure and method of an image sensor module

Image sensor packaging structure and method of manufacturing the same

Image sensor packaging structure

Packaging structure and method of an image sensor module

Stacked package for electronic elements and packaging method thereof

Flip-chip ball grid array package with a heat slug

Power supply device with low power dissipation

Quickly restartable power supply apparatus

Method and apparatus for preventing improper switching of a dual po...

Fanless convection cooling design for personal computers

Patents Applicationslast 30 patents

ELECTRONIC PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

Packaging structure and method of an image sensor module

IMAGE SENSOR PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Stacked package for electronic elements

Packaging structure and method of an image sensor module

Image sensor packaging structure and method of manufacturing the same

Image sensor packaging structure and method

Stacked package for electronic elements and packaging method thereof