Fang-Lin Tsai

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and circuit structure thereof
- Patent number 11,791,300
- Issue date Oct 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of layer structure for mounting semiconductor de...
- Patent number 10,396,021
- Issue date Aug 27, 2019
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,236,261
- Issue date Mar 19, 2019
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure for mounting semiconductor device and fabrication m...
- Patent number 9,972,564
- Issue date May 15, 2018
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack structure of semiconductor packages
- Patent number 8,420,521
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic carrier board and package structure thereof
- Patent number 8,013,443
- Issue date Sep 6, 2011
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic carrier board applicable to surface mount technology
- Patent number 7,889,511
- Issue date Feb 15, 2011
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of semiconductor packages and method for fabricatin...
- Patent number 7,855,443
- Issue date Dec 21, 2010
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic carrier board and package structure thereof
- Patent number 7,696,623
- Issue date Apr 13, 2010
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic carrier board applicable to surface mounted technology (...
- Patent number 7,573,722
- Issue date Aug 11, 2009
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282655
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222290
- Publication date Jul 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038685
- Publication date Feb 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230066456
- Publication date Mar 2, 2023
- Siliconware Precision Industries Co., Ltd.
- Pei-Geng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20220148996
- Publication date May 12, 2022
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DE...
- Publication number 20180233442
- Publication date Aug 16, 2018
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180211925
- Publication date Jul 26, 2018
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE AND FABRICATION M...
- Publication number 20150206814
- Publication date Jul 23, 2015
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACK STRUCTURE OF SEMICONDUCTOR PACKAGES
- Publication number 20110070697
- Publication date Mar 24, 2011
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF
- Publication number 20100170709
- Publication date Jul 8, 2010
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC CARRIER BOARD
- Publication number 20090288866
- Publication date Nov 26, 2009
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stack structure of semiconductor packages and method for fabricatin...
- Publication number 20070246811
- Publication date Oct 25, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20070202633
- Publication date Aug 30, 2007
- Siliconware Precision Industries Co., Ltd.
- Wen-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic carrier board
- Publication number 20070164084
- Publication date Jul 19, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic carrier board and package structure thereof
- Publication number 20070145561
- Publication date Jun 28, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic carrier board and package structure thereof
- Publication number 20070138632
- Publication date Jun 21, 2007
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Fang-Lin Tsai

Person

Patents Grantslast 30 patents

Electronic package and circuit structure thereof

Fabrication method of layer structure for mounting semiconductor de...

Electronic package and method for fabricating the same

Layer structure for mounting semiconductor device and fabrication m...

Method for fabricating stack structure of semiconductor packages

Electronic carrier board and package structure thereof

Electronic carrier board applicable to surface mount technology

Stack structure of semiconductor packages and method for fabricatin...

Electronic carrier board and package structure thereof

Electronic carrier board applicable to surface mounted technology (...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

FABRICATION METHOD OF LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DE...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

LAYER STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE AND FABRICATION M...

METHOD FOR FABRICATING STACK STRUCTURE OF SEMICONDUCTOR PACKAGES

ELECTRONIC CARRIER BOARD AND PACKAGE STRUCTURE THEREOF

ELECTRONIC CARRIER BOARD

Stack structure of semiconductor packages and method for fabricatin...

Semiconductor package and method for fabricating the same

Electronic carrier board

Electronic carrier board and package structure thereof

Electronic carrier board and package structure thereof