BRIEF DESCRIPTION OF THE DRAWINGS
The present invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
FIG. 1A (PRIOR ART) is a plan view showing passive components mounted on a substrate by SMT conventionally;
FIGS. 1B and 1C (PRIOR ART) are cross-sectional views of FIG. 1A taken along lines 1B-1B and 1C-1C respectively;
FIGS. 2A and 2B (PRIOR ART) are schematic views showing mounting of a passive component as disclosed in U.S. Pat. No. 6,521,997;
FIGS. 3A and 3B (PRIOR ART) are schematic views showing mounting of a passive component as disclosed in U.S. Patent No. 2005/0253231;
FIGS. 4A and 4B are plan views showing an electronic carrier board in accordance with a first preferred embodiment of the present invention;
FIG. 4C is a plan view showing the electronic carrier board having a protective layer with openings thereof being shifted to the left in accordance with the first preferred embodiment of the present invention;
FIG. 4D is a plan view showing the electronic carrier board having the protective layer formed with openings of different dimensions in accordance with the first preferred embodiment of the present invention;
FIG. 5 is a plan view showing an electronic carrier board in accordance with a second preferred embodiment of the present invention;
FIG. 6A is a plan view showing an electronic carrier board in accordance with a third preferred embodiment of the present invention;
FIG. 6B is a plan view showing the electronic carrier board having a protective layer with openings thereof being shifted to the right in accordance with the third preferred embodiment of the present invention;
FIGS. 7A to 7C are plan views showing an electronic carrier board in accordance with a fourth preferred embodiment of the present invention;
FIGS. 8A and 8B are a plan view and a cross-sectional view respectively showing a package structure using an electronic carrier board of the present invention;
FIG. 9 is a plan view showing an electronic carrier board in accordance with a fifth preferred embodiment of the present invention;
FIG. 10 is a plan view showing an electronic carrier board in accordance with a sixth preferred embodiment of the present invention; and
FIG. 11 is a plan view showing an electronic carrier board in accordance with a seventh preferred embodiment of the present invention.