Fanny LAPORTE

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Sassenage, FR

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240038607
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION SUBSTRATE AND METHOD OF MANUFACTURING SUCH A SUBSTRATE
- Publication number 20230290712
- Publication date Sep 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER
- Publication number 20230223277
- Publication date Jul 13, 2023
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISSIPATION
- Publication number 20230171927
- Publication date Jun 1, 2023
- STMicroelectronics (Grenoble 2) SAS
- Richard REMBERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTREMELY HIGH FREQUENCY ELECTROMAGNETIC WAVE TRANSMIT/RECEIVE DEVICE
- Publication number 20230029946
- Publication date Feb 2, 2023
- STMicroelectronics S.A.
- Victor FIORESE
- H01 - BASIC ELECTRIC ELEMENTS