Fee Hoon Wong

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of assembling a semiconductor package
- Patent number 8,410,586
- Issue date Apr 2, 2013
- Infineon Technologies, AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...
- Publication number 20230197585
- Publication date Jun 22, 2023
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE FORMATION USING LEAD FRAME WITH STRUCT...
- Publication number 20230178428
- Publication date Jun 8, 2023
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170329
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Assembling a Semiconductor Package
- Publication number 20090065912
- Publication date Mar 12, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR