Fen Chen

Person

Williston, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Active condensation mitigation inside electronic enclosure
- Patent number 12,151,628
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Fen Chen
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Compositions and methods of treating Huntington's disease
- Patent number 11,752,181
- Issue date Sep 12, 2023
- VOYAGER THERAPEUTICS, INC.
- Dinah Wen-Yee Sah
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Moisture detection and ingression monitoring systems and methods of...
- Patent number 10,900,923
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration monitor
- Patent number 10,794,948
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration monitor
- Patent number 10,677,833
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Moisture detection and ingression monitoring systems and methods of...
- Patent number 10,545,110
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Fen Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Moisture detection and ingression monitoring systems and methods of...
- Patent number 10,545,111
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Fen Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thru-silicon-via structures
- Patent number 10,388,567
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture detection and ingression monitoring systems and methods of...
- Patent number 10,324,056
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Fen Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Moisture detection and ingression monitoring systems and methods of...
- Patent number 10,309,919
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip with anti-reverse engineering function
- Patent number 10,141,274
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Edward C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Moisture detection and ingression monitoring systems and methods of...
- Patent number 10,126,260
- Issue date Nov 13, 2018
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration monitor
- Patent number 9,891,261
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with anti-reverse engineering function
- Patent number 9,893,023
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via leakage and breakdown testing
- Patent number 9,851,398
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration testing of interconnect analogues having bottom-co...
- Patent number 9,851,397
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thru-silicon-via structures
- Patent number 9,812,359
- Issue date Nov 7, 2017
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structures
- Patent number 9,780,031
- Issue date Oct 3, 2017
- Globalfoudries Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with anti-reverse engineering function
- Patent number 9,711,464
- Issue date Jul 18, 2017
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire and dielectric with air gaps
- Patent number 9,613,853
- Issue date Apr 4, 2017
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar field effect transistor test structure and lateral diele...
- Patent number 9,453,873
- Issue date Sep 27, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Structures and methods for monitoring dielectric reliability with t...
- Patent number 9,404,953
- Issue date Aug 2, 2016
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit structure with through-semiconductor via
- Patent number 9,318,414
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with metal cap and methods of fabrication
- Patent number 9,318,413
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with thin film resistor and terminal bond pad
- Patent number 9,287,345
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire and dielectric with air gaps
- Patent number 9,230,914
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire and dielectric with air gaps
- Patent number 9,159,671
- Issue date Oct 13, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with a dual damascene wire and through-substrate...
- Patent number 9,093,503
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating open-ended via chains for testing via formation and die...
- Patent number 9,059,052
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip poly-to-contact process monitoring and reliability evaluati...
- Patent number 9,029,172
- Issue date May 12, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITIONS AND METHODS OF TREATING HUNTINGTON'S DISEASE
- Publication number 20240226203
- Publication date Jul 11, 2024
- VOYAGER THERAPEUTICS, INC.
- Dinah Wen-Yee Sah
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
COMPOSITIONS AND METHODS OF TREATING HUNTINGTON'S DISEASE
- Publication number 20240131093
- Publication date Apr 25, 2024
- VOYAGER THERAPEUTICS, INC.
- Dinah Wen-Yee Sah
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ACTIVE CONDENSATION MITIGATION INSIDE ELECTRONIC ENCLOSURE
- Publication number 20240042953
- Publication date Feb 8, 2024
- GM Cruise Holdings LLC
- Fen Chen
- B60 - VEHICLES IN GENERAL
Information Patent Application
COMPOSITIONS AND METHODS OF TREATING HUNTINGTON'S DISEASE
- Publication number 20200155624
- Publication date May 21, 2020
- VOYAGER THERAPEUTICS, INC.
- Dinah Wen-Yee Sah
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...
- Publication number 20200049651
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Fen CHEN
- G01 - MEASURING TESTING
Information Patent Application
MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...
- Publication number 20190250116
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Fen CHEN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...
- Publication number 20180356359
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Fen CHEN
- G01 - MEASURING TESTING
Information Patent Application
MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...
- Publication number 20180356358
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Fen CHEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE WITH METALLIC DOPED BURIED OXIDE
- Publication number 20180138209
- Publication date May 17, 2018
- GLOBALFOUNDRIES INC.
- Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20180074110
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20180074111
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
- Publication number 20180053734
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRU-SILICON-VIA STRUCTURES
- Publication number 20180047626
- Publication date Feb 15, 2018
- GLOBALFOUNDRIES INC.
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
- Publication number 20170263574
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
- Publication number 20170084552
- Publication date Mar 23, 2017
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRU-SILICON-VIA STRUCTURES
- Publication number 20160358821
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS
- Publication number 20160327502
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Fen CHEN
- G01 - MEASURING TESTING
Information Patent Application
VIA LEAKAGE AND BREAKDOWN TESTING
- Publication number 20160291084
- Publication date Oct 6, 2016
- GLOBALFOUNDRIES INC.
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION TESTING OF INTERCONNECT ANALOGUES HAVING BOTTOM-CO...
- Publication number 20160258998
- Publication date Sep 8, 2016
- GLOBALFOUNDRIES INC.
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
DEVICE STRUCTURE WITH NEGATIVE RESISTANCE CHARACTERISTICS
- Publication number 20160225919
- Publication date Aug 4, 2016
- GLOBALFOUNDRIES INC.
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTIGUOUS DUMMY STRUCTURE SURROUNDING THROUGH-SUBSTRATE VIA NE...
- Publication number 20160148863
- Publication date May 26, 2016
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURES
- Publication number 20160071790
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE AND DIELECTRIC WITH AIR GAPS
- Publication number 20160035621
- Publication date Feb 4, 2016
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20150380326
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
TSV WITH END CAP, METHOD AND 3D INTEGRATED CIRCUIT
- Publication number 20150262911
- Publication date Sep 17, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIE...
- Publication number 20150221567
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR FIELD EFFECT TRANSISTOR TEST STRUCTURE AND LATERAL DIELE...
- Publication number 20150198654
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH A DUAL DAMASCENE WIRE AND THROUGH-SUBSTRATE...
- Publication number 20150194345
- Publication date Jul 9, 2015
- International Busines Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE AND DIELECTRIC WITH AIR GAPS
- Publication number 20150137374
- Publication date May 21, 2015
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE AND DIELECTRIC WITH AIR GAPS
- Publication number 20150137375
- Publication date May 21, 2015
- International Business Machines Corporation
- Fen CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Active condensation mitigation inside electronic enclosure

Compositions and methods of treating Huntington's disease

Moisture detection and ingression monitoring systems and methods of...

Electromigration monitor

Electromigration monitor

Moisture detection and ingression monitoring systems and methods of...

Moisture detection and ingression monitoring systems and methods of...

Thru-silicon-via structures

Moisture detection and ingression monitoring systems and methods of...

Moisture detection and ingression monitoring systems and methods of...

Semiconductor chip with anti-reverse engineering function

Moisture detection and ingression monitoring systems and methods of...

Electromigration monitor

Semiconductor chip with anti-reverse engineering function

Via leakage and breakdown testing

Electromigration testing of interconnect analogues having bottom-co...

Thru-silicon-via structures

Wiring structures

Semiconductor chip with anti-reverse engineering function

Copper wire and dielectric with air gaps

Non-planar field effect transistor test structure and lateral diele...

Structures and methods for monitoring dielectric reliability with t...

Integrated circuit structure with through-semiconductor via

Integrated circuit structure with metal cap and methods of fabrication

Semiconductor structure with thin film resistor and terminal bond pad

Copper wire and dielectric with air gaps

Copper wire and dielectric with air gaps

Semiconductor chip with a dual damascene wire and through-substrate...

Alternating open-ended via chains for testing via formation and die...

On-chip poly-to-contact process monitoring and reliability evaluati...

Patents Applicationslast 30 patents

COMPOSITIONS AND METHODS OF TREATING HUNTINGTON'S DISEASE

COMPOSITIONS AND METHODS OF TREATING HUNTINGTON'S DISEASE

ACTIVE CONDENSATION MITIGATION INSIDE ELECTRONIC ENCLOSURE

COMPOSITIONS AND METHODS OF TREATING HUNTINGTON'S DISEASE

MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...

MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...

MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...

MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS AND METHODS OF...

SEMICONDUCTOR SUBSTRATE WITH METALLIC DOPED BURIED OXIDE

ELECTROMIGRATION MONITOR

ELECTROMIGRATION MONITOR

SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION

THRU-SILICON-VIA STRUCTURES

SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION

SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION

THRU-SILICON-VIA STRUCTURES

MOISTURE DETECTION AND INGRESSION MONITORING SYSTEMS

VIA LEAKAGE AND BREAKDOWN TESTING

ELECTROMIGRATION TESTING OF INTERCONNECT ANALOGUES HAVING BOTTOM-CO...

DEVICE STRUCTURE WITH NEGATIVE RESISTANCE CHARACTERISTICS

NON-CONTIGUOUS DUMMY STRUCTURE SURROUNDING THROUGH-SUBSTRATE VIA NE...

WIRING STRUCTURES

COPPER WIRE AND DIELECTRIC WITH AIR GAPS

ELECTROMIGRATION MONITOR

TSV WITH END CAP, METHOD AND 3D INTEGRATED CIRCUIT

ALTERNATING OPEN-ENDED VIA CHAINS FOR TESTING VIA FORMATION AND DIE...

NON-PLANAR FIELD EFFECT TRANSISTOR TEST STRUCTURE AND LATERAL DIELE...

SEMICONDUCTOR CHIP WITH A DUAL DAMASCENE WIRE AND THROUGH-SUBSTRATE...

COPPER WIRE AND DIELECTRIC WITH AIR GAPS

COPPER WIRE AND DIELECTRIC WITH AIR GAPS