Feras Eid

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal performance in hybrid bonded 3D die stacks
- Patent number 12,327,775
- Issue date Jun 10, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors and resistors at direct bonding interfaces in microelect...
- Patent number 12,266,682
- Issue date Apr 1, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating voltage regulators and passive circuit elements with to...
- Patent number 12,242,290
- Issue date Mar 4, 2025
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,199,018
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,165,962
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-filter die
- Patent number 12,155,372
- Issue date Nov 26, 2024
- Intel Corporation
- Georgios Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 12,142,543
- Issue date Nov 12, 2024
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die packages including a contiguous heat spreader
- Patent number 12,136,577
- Issue date Nov 5, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic sealing structures in microelectronic assemblies having di...
- Patent number 12,119,291
- Issue date Oct 15, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,113,048
- Issue date Oct 8, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,107,060
- Issue date Oct 1, 2024
- Intel Corproation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additively manufactured structures for heat dissipation from integr...
- Patent number 12,080,620
- Issue date Sep 3, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,057,402
- Issue date Aug 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radio frequency (RF) front-end module (FEM)
- Patent number 12,040,776
- Issue date Jul 16, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic induced heating for solder interconnects
- Patent number 12,040,307
- Issue date Jul 16, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with thermal interface material retaining structures on die...
- Patent number 12,033,914
- Issue date Jul 9, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 11,990,448
- Issue date May 21, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physically unclonable function circuitry of a package substrate and...
- Patent number 11,990,419
- Issue date May 21, 2024
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid backside thermal structures for enhanced IC packages
- Patent number 11,948,906
- Issue date Apr 2, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device having anisotropic thermally conductive sec...
- Patent number 11,933,555
- Issue date Mar 19, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...
- Publication number 20250218847
- Publication date Jul 3, 2025
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD
- Publication number 20250210392
- Publication date Jun 26, 2025
- Intel Corporation
- Bhaskar Jyoti KRISHNATREYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY METHOD AND EQUIPMENT
- Publication number 20250192096
- Publication date Jun 12, 2025
- Intel Corporation
- Yi SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Publication number 20250112199
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Publication number 20250112127
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Publication number 20250112173
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...
- Publication number 20250112155
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...
- Publication number 20250112092
- Publication date Apr 3, 2025
- Intel Corportation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Publication number 20250112187
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
- Publication number 20250108459
- Publication date Apr 3, 2025
- Intel Corporation
- Andrey Vyatskikh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...
- Publication number 20250112177
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER WITH GLASS PANELS
- Publication number 20250112208
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASS...
- Publication number 20250112181
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE
- Publication number 20250112186
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS
- Publication number 20250112218
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon M. Rawlings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-LINKED HYDROPHOBIC COATING WITH PLASMA RESISTANCE FOR DIE-TO-...
- Publication number 20250109221
- Publication date Apr 3, 2025
- Intel Corporation
- Wenhao Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Publication number 20250105053
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLANKET WAFER LASER PRE-EXPOSURE FOR FAST SELECTIVE LAYER TRANSFERS
- Publication number 20250105025
- Publication date Mar 27, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal performance in hybrid bonded 3D die stacks

Liquid cooled interposer for integrated circuit stack

Capacitors and resistors at direct bonding interfaces in microelect...

Thermal management in integrated circuit packages

Integrating voltage regulators and passive circuit elements with to...

Direct bonding in microelectronic assemblies

Modular microchannel thermal solutions for integrated circuit devices

High-throughput additively manufactured power delivery vias and traces

Hermetic sealing structures in microelectronic assemblies having di...

Microelectronic devices designed with mold patterning to create pac...

Multi-filter die

Thermal management solutions for embedded integrated circuit devices

Carrier for microelectronic assemblies having direct bonding

Integrated circuit die packages including a contiguous heat spreader

Hermetic sealing structures in microelectronic assemblies having di...

Microelectronic assemblies

Microelectronic assemblies with inductors in direct bonding regions

Power delivery structures

Additively manufactured structures for heat dissipation from integr...

Microelectronic assemblies with inductors in direct bonding regions

Direct bonding in microelectronic assemblies

Integrated radio frequency (RF) front-end module (FEM)

Magnetic induced heating for solder interconnects

Package with thermal interface material retaining structures on die...

Thermal management in integrated circuit packages

High performance integrated RF passives using dual lithography process

Direct bonding in microelectronic assemblies

Physically unclonable function circuitry of a package substrate and...

Hybrid backside thermal structures for enhanced IC packages

Heat dissipation device having anisotropic thermally conductive sec...

Patents Applicationslast 30 patents

CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...

HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD

SELF-ASSEMBLY METHOD AND EQUIPMENT

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES

PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...

STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...

IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER

SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...

SELECTIVE LAYER TRANSFER WITH GLASS PANELS

BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASS...

TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS

CROSS-LINKED HYDROPHOBIC COATING WITH PLASMA RESISTANCE FOR DIE-TO-...

SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS

BLANKET WAFER LASER PRE-EXPOSURE FOR FAST SELECTIVE LAYER TRANSFERS

SELECTIVE LAYER TRANSFER

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

MICROELECTRONIC ASSEMBLIES

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

ON DIE FLEXURE CONTROL DEVICE AND METHOD

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS