Florian Gstrein

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 12,087,836
- Issue date Sep 10, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colored gratings in microelectronic structures
- Patent number 12,087,594
- Issue date Sep 10, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide layers to inhi...
- Patent number 12,080,639
- Issue date Sep 3, 2024
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure surface modifications by passivating agents
- Patent number 12,036,578
- Issue date Jul 16, 2024
- Intel Corporation
- Florian Gstrein
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Chemical compositions and methods of patterning microelectronic dev...
- Patent number 12,037,434
- Issue date Jul 16, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directed self-assembly structures and techniques
- Patent number 12,012,473
- Issue date Jun 18, 2024
- Intel Corporation
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV patterning methods, structures, and materials
- Patent number 11,984,317
- Issue date May 14, 2024
- Intel Corporation
- Marie Krysak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,955,343
- Issue date Apr 9, 2024
- Intel Corporation
- Robert L. Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,953,826
- Issue date Apr 9, 2024
- Intel Corporation
- James M. Blackwell
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Ligand-capped main group nanoparticles as high absorption extreme u...
- Patent number 11,874,600
- Issue date Jan 16, 2024
- Intel Corporation
- Marie Krysak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Self-aligned gate endcap (SAGE) architectures without fin end gap
- Patent number 11,869,889
- Issue date Jan 9, 2024
- Intel Corporation
- Szuya S. Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,862,463
- Issue date Jan 2, 2024
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,854,787
- Issue date Dec 26, 2023
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures with metal oxide-caped contacts...
- Patent number 11,837,644
- Issue date Dec 5, 2023
- Intel Corporation
- Rami Hourani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and layout design options for DSA on transition regions o...
- Patent number 11,605,623
- Issue date Mar 14, 2023
- Intel Corporation
- Gurpreet Singh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Selective gate spacers for semiconductor devices
- Patent number 11,532,724
- Issue date Dec 20, 2022
- Intel Corporation
- Scott B. Clendenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated workfunction la...
- Patent number 11,476,164
- Issue date Oct 18, 2022
- Intel Corporation
- Ying Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer-based approaches for conductive via fabrication and...
- Patent number 11,456,248
- Issue date Sep 27, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive cap-based approaches for conductive via fabrication and...
- Patent number 11,417,567
- Issue date Aug 16, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional molecules for selective polymer formation on conduc...
- Patent number 11,398,428
- Issue date Jul 26, 2022
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 11,373,950
- Issue date Jun 28, 2022
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ligand-capped main group nanoparticles as high absorption extreme u...
- Patent number 11,320,734
- Issue date May 3, 2022
- Intel Corporation
- Marie Krysak
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,315,798
- Issue date Apr 26, 2022
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for germanium substrate
- Patent number 11,270,887
- Issue date Mar 8, 2022
- Intel Corporation
- Patricio E. Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 11,232,980
- Issue date Jan 25, 2022
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal aluminum gallium indium carbide thin films as liners and barr...
- Patent number 11,227,798
- Issue date Jan 18, 2022
- Intel Corporation
- Scott B. Clendenning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide nanoparticles as fillable hardmask materials
- Patent number 11,227,766
- Issue date Jan 18, 2022
- Intel Corporation
- Marie Krysak
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 11,158,515
- Issue date Oct 26, 2021
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lined photobucket structure for back end of line (BEOL) interconnec...
- Patent number 11,137,681
- Issue date Oct 5, 2021
- Intel Corporation
- James M. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20240360264
- Publication date Oct 31, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING
- Publication number 20240290651
- Publication date Aug 29, 2024
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...
- Publication number 20240222119
- Publication date Jul 4, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MA...
- Publication number 20240204083
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...
- Publication number 20240203868
- Publication date Jun 20, 2024
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW
- Publication number 20240194672
- Publication date Jun 13, 2024
- Intel Corporation
- Bharath Bangalore Rajeeva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH MULTI-PITCH PATTERN FABRICATED...
- Publication number 20240194483
- Publication date Jun 13, 2024
- Intel Corporation
- Eungnak Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS...
- Publication number 20240113039
- Publication date Apr 4, 2024
- Intel Corporation
- Tayseer Mahdi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITHOUT FIN END GAP
- Publication number 20240088143
- Publication date Mar 14, 2024
- Intel Corporation
- Szuya S. LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20240071917
- Publication date Feb 29, 2024
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20240047543
- Publication date Feb 8, 2024
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...
- Publication number 20230307298
- Publication date Sep 28, 2023
- Intel Corporation
- Charles H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230095402
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...
- Publication number 20230101212
- Publication date Mar 30, 2023
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
- Publication number 20220262722
- Publication date Aug 18, 2022
- Intel Corporation
- Richard E. SCHENKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...
- Publication number 20220229364
- Publication date Jul 21, 2022
- Intel Corporation
- Marie KRYSAK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER
- Publication number 20220216065
- Publication date Jul 7, 2022
- Intel Corporation
- Robert L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDED VIAS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199540
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...
- Publication number 20220199462
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLORED GRATINGS IN MICROELECTRONIC STRUCTURES
- Publication number 20220199420
- Publication date Jun 23, 2022
- Intel Corporation
- Gurpreet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FILL DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FAB...
- Publication number 20220102207
- Publication date Mar 31, 2022
- Intel Corporation
- Florian GSTREIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES USING DIRECTED SELF-ASSEMBLY FO...
- Publication number 20220102210
- Publication date Mar 31, 2022
- Intel Corporation
- Paul A. NYHUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE NANOPARTICLES AS FILLABLE HARDMASK MATERIALS
- Publication number 20220093399
- Publication date Mar 24, 2022
- Intel Corporation
- Marie KRYSAK
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SELECTIVE METAL REMOVAL FOR CONDUCTIVE INTERCONNECTS IN INTEGRATED...
- Publication number 20220051896
- Publication date Feb 17, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...
- Publication number 20210397084
- Publication date Dec 23, 2021
- Intel Corporation
- James M. BLACKWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...
- Publication number 20210371566
- Publication date Dec 2, 2021
- Intel Corporation
- Eungnak Han
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS
- Publication number 20210375616
- Publication date Dec 2, 2021
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES
- Publication number 20210375745
- Publication date Dec 2, 2021
- Intel Corporation, Santa Clara, CA
- James Munro Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE GATE SPACERS FOR SEMICONDUCTOR DEVICES
- Publication number 20210143265
- Publication date May 13, 2021
- Intel Corporation
- Scott B. CLENDENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...
- Publication number 20210091194
- Publication date Mar 25, 2021
- Intel Corporation
- Rami HOURANI
- H01 - BASIC ELECTRIC ELEMENTS

Florian Gstrein

Person

Patents Grantslast 30 patents

Selective metal removal for conductive interconnects in integrated...

Contact over active gate structures with metal oxide-caped contacts...

Colored gratings in microelectronic structures

Contact over active gate structures with metal oxide layers to inhi...

Interconnect structure surface modifications by passivating agents

Chemical compositions and methods of patterning microelectronic dev...

Directed self-assembly structures and techniques

EUV patterning methods, structures, and materials

Two-stage bake photoresist with releasable quencher

Lined photobucket structure for back end of line (BEOL) interconnec...

Ligand-capped main group nanoparticles as high absorption extreme u...

Self-aligned gate endcap (SAGE) architectures without fin end gap

Metal oxide nanoparticles as fillable hardmask materials

Advanced lithography and self-assembled devices

Contact over active gate structures with metal oxide-caped contacts...

Materials and layout design options for DSA on transition regions o...

Selective gate spacers for semiconductor devices

Integrated circuit structures having differentiated workfunction la...

Etch stop layer-based approaches for conductive via fabrication and...

Conductive cap-based approaches for conductive via fabrication and...

Multifunctional molecules for selective polymer formation on conduc...

Advanced lithography and self-assembled devices

Ligand-capped main group nanoparticles as high absorption extreme u...

Two-stage bake photoresist with releasable quencher

Passivation layer for germanium substrate

Bottom-up fill dielectric materials for semiconductor structure fab...

Metal aluminum gallium indium carbide thin films as liners and barr...

Metal oxide nanoparticles as fillable hardmask materials

Selective metal removal for conductive interconnects in integrated...

Lined photobucket structure for back end of line (BEOL) interconnec...

Patents Applicationslast 30 patents

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING

PATTERNING BASED ON IN-SITU FORMATION OF BLOCK COPOYLMER THROUGH DE...

DSA (DIRECTED SELF-ASSEMBLY) BASED SPACER AND LINER FOR SHORTING MA...

SERIAL DIRECTED SELF-ASSEMBLY (DSA) PROCESSES FOR FORMING METAL LAY...

MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW

INTEGRATED CIRCUIT (IC) DEVICE WITH MULTI-PITCH PATTERN FABRICATED...

BACKSIDE WAFER TREATMENTS TO REDUCE DISTORTIONS AND OVERLAY ERRORS...

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITHOUT FIN END GAP

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...

ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT E...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

CONTACT OVER ACTIVE GATE STRUCTURES WITH CONDUCTIVE TRENCH CONTACT...

ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES

LIGAND-CAPPED MAIN GROUP NANOPARTICLES AS HIGH ABSORPTION EXTREME U...

TWO-STAGE BAKE PHOTORESIST WITH RELEASABLE QUENCHER

GUIDED VIAS IN MICROELECTRONIC STRUCTURES

VIA OPENING RECTIFICATION USING LAMELLAR TRIBLOCK COPOLYMER, POLYME...

COLORED GRATINGS IN MICROELECTRONIC STRUCTURES

BOTTOM-UP FILL DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FAB...

CONTACT OVER ACTIVE GATE STRUCTURES USING DIRECTED SELF-ASSEMBLY FO...

METAL OXIDE NANOPARTICLES AS FILLABLE HARDMASK MATERIALS

SELECTIVE METAL REMOVAL FOR CONDUCTIVE INTERCONNECTS IN INTEGRATED...

LINED PHOTOBUCKET STRUCTURE FOR BACK END OF LINE (BEOL) INTERCONNEC...

CHEMICAL COMPOSITIONS & METHODS OF PATTERNING MICROELECTRONIC DEVIC...

EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS

DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES

SELECTIVE GATE SPACERS FOR SEMICONDUCTOR DEVICES

CONTACT OVER ACTIVE GATE STRUCTURES WITH METAL OXIDE-CAPED CONTACTS...