Floyd K. Eide

Person

Huntington Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 7,242,082
- Issue date Jul 10, 2007
- Irvine Sensors Corp.
- Floyd Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable layers containing ball grid array packages
- Patent number 6,967,411
- Issue date Nov 22, 2005
- Irvine Sensors Corporation
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking layers containing enclosed IC chips
- Patent number 6,195,268
- Issue date Feb 27, 2001
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC stack utilizing secondary leadframes
- Patent number 6,028,352
- Issue date Feb 22, 2000
- Irvine Sensors Corporation
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC stack utilizing BGA contacts
- Patent number 6,014,316
- Issue date Jan 11, 2000
- Irvine Sensors Corporation
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack and method of making same
- Patent number 5,612,570
- Issue date Mar 18, 1997
- Dense-Pac Microsystems, Inc.
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package having chip attached to and wire bonded within an o...
- Patent number 5,313,096
- Issue date May 17, 1994
- Dense-Pac Microsystems, Inc.
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip stacking
- Patent number 4,956,694
- Issue date Sep 11, 1990
- Dense-Pac Microsystems, Inc.
- Floyd Eide
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stackable layer containing ball grid array package
- Publication number 20060055039
- Publication date Mar 16, 2006
- Floyd Eide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable layers containing ball grid array packages
- Publication number 20040004286
- Publication date Jan 8, 2004
- Floyd K. Eide
- H01 - BASIC ELECTRIC ELEMENTS

Floyd K. Eide

Person

Patents Grantslast 30 patents

Stackable layer containing ball grid array package

Stackable layers containing ball grid array packages

Stacking layers containing enclosed IC chips

IC stack utilizing secondary leadframes

IC stack utilizing BGA contacts

Chip stack and method of making same

IC chip package having chip attached to and wire bonded within an o...

Integrated circuit chip stacking

Patents Applicationslast 30 patents

Stackable layer containing ball grid array package

Stackable layers containing ball grid array packages