Francis J. Downes JR.

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a multi-layered interconnect structure
- Patent number 6,829,823
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Francis J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structure
- Patent number 6,720,502
- Issue date Apr 13, 2004
- International Business Machine Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of a metallic interlocking structure
- Patent number 6,693,031
- Issue date Feb 17, 2004
- International Business Machines Corporation
- Gerald G. Advocate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and method for degassing small-high aspect ratio drille...
- Patent number 6,626,196
- Issue date Sep 30, 2003
- International Busines Machines Corporation
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Blind via formation in a photoimageable dielectric material
- Patent number 6,569,604
- Issue date May 27, 2003
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip C4 assembly improvement using magnetic force and adhesive
- Patent number 6,429,384
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Francis J. Downes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package having low modulus, conformal mounting pads
- Patent number 6,399,896
- Issue date Jun 4, 2002
- International Business Machines Corporation
- Frank J. Downes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with high density interconnect layer
- Patent number 6,373,717
- Issue date Apr 16, 2002
- International Business Machines Corporation
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interlocking structure
- Patent number 6,348,737
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electroplating rack and connection system for optimized p...
- Patent number 6,176,985
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Francis J. Downes
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 6,150,255
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip C4 assembly improvement using magnetic force and adhesive
- Patent number 6,142,361
- Issue date Nov 7, 2000
- International Business Machines Corporation
- Francis J. Downes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for uniform plating of dendrites
- Patent number 6,043,150
- Issue date Mar 28, 2000
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, and corresponding method, for stress testing wire bond-t...
- Patent number 5,994,910
- Issue date Nov 30, 1999
- International Business Machines Corporation
- Francis Joseph Downes
- G01 - MEASURING TESTING
Information Patent Grant
Method of planarizing a curved substrate and resulting structure
- Patent number 5,940,729
- Issue date Aug 17, 1999
- International Business Machines Corp.
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform plating of dendrites
- Patent number 5,939,786
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Francis Joseph Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic process for reducing the organic content of an aqueous...
- Patent number 5,230,782
- Issue date Jul 27, 1993
- International Business Machines Corporation
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit structure
- Publication number 20040099939
- Publication date May 27, 2004
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement and method for degassing small-high aspect ratio drille...
- Publication number 20020189637
- Publication date Dec 19, 2002
- International Business Machines
- Francis J. Downes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic package with high density interconnect layer
- Publication number 20020085364
- Publication date Jul 4, 2002
- Francis J. Downes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of a metallic interlocking structure
- Publication number 20020056890
- Publication date May 16, 2002
- International Business Machines Corporation
- Gerald G. Advocate
- H01 - BASIC ELECTRIC ELEMENTS

Francis J. Downes JR.

Person

Patents Grantslast 30 patents

Method of making a multi-layered interconnect structure

Integrated circuit structure

Formation of a metallic interlocking structure

Arrangement and method for degassing small-high aspect ratio drille...

Blind via formation in a photoimageable dielectric material

Chip C4 assembly improvement using magnetic force and adhesive

Circuit package having low modulus, conformal mounting pads

Electronic package with high density interconnect layer

Metallic interlocking structure

Laminated electroplating rack and connection system for optimized p...

Method of planarizing a curved substrate and resulting structure

Chip C4 assembly improvement using magnetic force and adhesive

Method for uniform plating of dendrites

Apparatus, and corresponding method, for stress testing wire bond-t...

Method of planarizing a curved substrate and resulting structure

Uniform plating of dendrites

Electrolytic process for reducing the organic content of an aqueous...

Patents Applicationslast 30 patents

Integrated circuit structure

Arrangement and method for degassing small-high aspect ratio drille...

Electronic package with high density interconnect layer

Formation of a metallic interlocking structure