Franz Schrank

Person

Osterreich, AT

People

Patents Grantslast 30 patents

Information Patent Grant
LED/LD illumination device with separate luminophore configuration,...
- Patent number 12,027,653
- Issue date Jul 2, 2024
- Tridonic Jennersdorf GMBH
- Steffen Riemer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
LED module and use of the LED module
- Patent number 11,460,181
- Issue date Oct 4, 2022
- TDK ELECTRONICS AG
- Franz Schrank
- F21 - LIGHTING
Information Patent Grant
Semiconductor device with through-substrate via
- Patent number 11,367,672
- Issue date Jun 21, 2022
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor device and method for forming a pressure sensor device
- Patent number 11,313,749
- Issue date Apr 26, 2022
- Sciosense B.V.
- Joerg Siegert
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing an optical sensor and optical sensor
- Patent number 11,271,134
- Issue date Mar 8, 2022
- ams AG
- Gregor Toschkoff
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing a semiconductor device and semiconductor d...
- Patent number 11,139,207
- Issue date Oct 5, 2021
- ams AG
- Thomas Bodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack-resistant semiconductor devices
- Patent number 11,127,656
- Issue date Sep 21, 2021
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for detection of radiation and method of produ...
- Patent number 11,107,848
- Issue date Aug 31, 2021
- AMS AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an optical sensor at wafer-level and optical se...
- Patent number 10,943,936
- Issue date Mar 9, 2021
- ams AG
- Gregor Toschkoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package and method of producing an optical package
- Patent number 10,847,664
- Issue date Nov 24, 2020
- AMS AG
- David Mehrl
- G02 - OPTICS
Information Patent Grant
Method of producing an optical sensor at wafer-level and optical se...
- Patent number 10,734,534
- Issue date Aug 4, 2020
- AMS AG
- Harald Etschmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with a refractive element and a method of pro...
- Patent number 10,644,047
- Issue date May 5, 2020
- AMS AG
- Jens Hofrichter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via and corresponding m...
- Patent number 10,468,541
- Issue date Nov 5, 2019
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an interposer-chip-arrangement for dense packag...
- Patent number 10,340,254
- Issue date Jul 2, 2019
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for wafer-scale integration
- Patent number 10,332,931
- Issue date Jun 25, 2019
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising an aperture array and method of pro...
- Patent number 10,283,541
- Issue date May 7, 2019
- AMS AG
- Joerg Siegert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method
- Patent number 10,256,147
- Issue date Apr 9, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor chip stack and method of producing a sensor chip stack
- Patent number 10,243,017
- Issue date Mar 26, 2019
- AMS International AG
- Georg Parteder
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device for optical applications and method of produci...
- Patent number 10,084,004
- Issue date Sep 25, 2018
- AMS AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,870,988
- Issue date Jan 16, 2018
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-chip-arrangement for dense packaging of chips
- Patent number 9,818,724
- Issue date Nov 14, 2017
- AMS AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with through-substrate v...
- Patent number 9,773,729
- Issue date Sep 26, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,735,101
- Issue date Aug 15, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor arrangement and method of producing an optical senso...
- Patent number 9,684,074
- Issue date Jun 20, 2017
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer-scale integration of semiconductor devices and semi...
- Patent number 9,608,035
- Issue date Mar 28, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module, LED illumination means, and LED lamp for the energy-eff...
- Patent number 9,574,723
- Issue date Feb 21, 2017
- Lumitech Produktion und Entwicklung GmbH
- Erwin Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated hot plate and recessed substra...
- Patent number 9,570,390
- Issue date Feb 14, 2017
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via covered by a solder...
- Patent number 9,553,039
- Issue date Jan 24, 2017
- AMS AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor device and method of producing a semiconductor...
- Patent number 9,543,245
- Issue date Jan 10, 2017
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module, LED illumination means, and LED lamp for the energy-eff...
- Patent number 9,206,947
- Issue date Dec 8, 2015
- Lumitech Produktion und Entwicklung GmbH
- Erwin Baumgartner
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
THIN PHOTODETECTOR DEVICE AND FABRICATION THEREOF
- Publication number 20240321932
- Publication date Sep 26, 2024
- ams-Osram AG
- Rainer Minixhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor Device and Method for Forming a Pressure Sensor Device
- Publication number 20220221363
- Publication date Jul 14, 2022
- Sciosense B.V.
- Jörg Siegert
- G01 - MEASURING TESTING
Information Patent Application
LED Module and Use of Said LED Module
- Publication number 20220065431
- Publication date Mar 3, 2022
- TDK Electronics AG
- Franz Schrank
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA
- Publication number 20210175153
- Publication date Jun 10, 2021
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
- Publication number 20200313031
- Publication date Oct 1, 2020
- ams AG
- Gregor TOSCHKOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...
- Publication number 20200243387
- Publication date Jul 30, 2020
- ams AG
- Thomas BODNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED/LD ILLUMINATION DEVICE WITH SEPARATE LUMINOPHORE CONFIGURATION,...
- Publication number 20200168772
- Publication date May 28, 2020
- TRIDONIC JENNERSDORF GMBH
- Steffen RIEMER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device
- Publication number 20200020611
- Publication date Jan 16, 2020
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE
- Publication number 20190265119
- Publication date Aug 29, 2019
- ams International AG
- Joerg Siegert
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...
- Publication number 20190165020
- Publication date May 30, 2019
- ams AG
- Gregor Toschkoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF...
- Publication number 20190035835
- Publication date Jan 31, 2019
- ams AG
- Jens HOFRICHTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
- Publication number 20180323320
- Publication date Nov 8, 2018
- ams AG
- David MEHRL
- G02 - OPTICS
Information Patent Application
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...
- Publication number 20180226514
- Publication date Aug 9, 2018
- ams AG
- Harald ETSCHMAIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAG...
- Publication number 20180096969
- Publication date Apr 5, 2018
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR CHIP STACK AND METHOD OF PRODUCING A SENSOR CHIP STACK
- Publication number 20180006074
- Publication date Jan 4, 2018
- ams International AG
- Georg PARTEDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY AND METHOD OF PRO...
- Publication number 20170309665
- Publication date Oct 26, 2017
- ams AG
- Joerg SIEGERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR WAFER-SCALE INTEGRATION
- Publication number 20170179183
- Publication date Jun 22, 2017
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD
- Publication number 20170062277
- Publication date Mar 2, 2017
- ams AG
- Martin SCHREMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20170025351
- Publication date Jan 26, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170018518
- Publication date Jan 19, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR OPTICAL APPLICATIONS AND METHOD OF PRODUCI...
- Publication number 20160343757
- Publication date Nov 24, 2016
- ams AG
- Hubert ENICHLMAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND CORRESPONDING M...
- Publication number 20160322519
- Publication date Nov 3, 2016
- ams AG
- Franz SCHRANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR ARRANGEMENT AND METHOD OF PRODUCING AN OPTICAL SENSO...
- Publication number 20160306042
- Publication date Oct 20, 2016
- ams AG
- Franz SCHRANK
- G01 - MEASURING TESTING
Information Patent Application
LED MODULE, LED ILLUMINATION MEANS, AND LED LAMP FOR THE ENERGY-EFF...
- Publication number 20160186937
- Publication date Jun 30, 2016
- Lumitech Produktion und Entwicklung GmbH
- Erwin BAUMGARTNER
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE FOR DETECTION OF RADIATION AND METHOD OF PRODU...
- Publication number 20160020238
- Publication date Jan 21, 2016
- ams AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLICATION OF A CARRIER TO A DEVICE WAFER
- Publication number 20150340264
- Publication date Nov 26, 2015
- ams AG
- Joerg SIEGERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HOT PLATE AND RECESSED SUBSTRA...
- Publication number 20150303141
- Publication date Oct 22, 2015
- ams AG
- Franz Schrank
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PRODUCING A SEMICONDUCTOR...
- Publication number 20150287674
- Publication date Oct 8, 2015
- ams AG
- Franz Schrank
- G01 - MEASURING TESTING
Information Patent Application
INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAGING OF CHIPS
- Publication number 20150162308
- Publication date Jun 11, 2015
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS

Franz Schrank

Person

Patents Grantslast 30 patents

LED/LD illumination device with separate luminophore configuration,...

LED module and use of the LED module

Semiconductor device with through-substrate via

Pressure sensor device and method for forming a pressure sensor device

Method for manufacturing an optical sensor and optical sensor

Method for manufacturing a semiconductor device and semiconductor d...

Crack-resistant semiconductor devices

Semiconductor device for detection of radiation and method of produ...

Method of producing an optical sensor at wafer-level and optical se...

Optical package and method of producing an optical package

Method of producing an optical sensor at wafer-level and optical se...

Optoelectronic device with a refractive element and a method of pro...

Semiconductor device with through-substrate via and corresponding m...

Method of producing an interposer-chip-arrangement for dense packag...

Semiconductor device for wafer-scale integration

Semiconductor device comprising an aperture array and method of pro...

Dicing method

Sensor chip stack and method of producing a sensor chip stack

Semiconductor device for optical applications and method of produci...

Method of producing a semiconductor device with through-substrate v...

Interposer-chip-arrangement for dense packaging of chips

Method of producing a semiconductor device with through-substrate v...

Semiconductor device with through-substrate via covered by a solder...

Optical sensor arrangement and method of producing an optical senso...

Method of wafer-scale integration of semiconductor devices and semi...

LED module, LED illumination means, and LED lamp for the energy-eff...

Semiconductor device with integrated hot plate and recessed substra...

Semiconductor device with through-substrate via covered by a solder...

Semiconductor sensor device and method of producing a semiconductor...

LED module, LED illumination means, and LED lamp for the energy-eff...

Patents Applicationslast 30 patents

THIN PHOTODETECTOR DEVICE AND FABRICATION THEREOF

Pressure Sensor Device and Method for Forming a Pressure Sensor Device

LED Module and Use of Said LED Module

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA

METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...

LED/LD ILLUMINATION DEVICE WITH SEPARATE LUMINOPHORE CONFIGURATION,...

Semiconductor Device

PRESSURE SENSOR DEVICE AND METHOD FOR FORMING A PRESSURE SENSOR DEVICE

METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...

AN OPTOELECTRONIC DEVICE WITH A REFRACTIVE ELEMENT AND A METHOD OF...

OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE

METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...

METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAG...

SENSOR CHIP STACK AND METHOD OF PRODUCING A SENSOR CHIP STACK

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE COMPRISING AN APERTURE ARRAY AND METHOD OF PRO...

SEMICONDUCTOR DEVICE FOR WAFER-SCALE INTEGRATION

DICING METHOD

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SEMICONDUCTOR DEVICE FOR OPTICAL APPLICATIONS AND METHOD OF PRODUCI...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND CORRESPONDING M...

OPTICAL SENSOR ARRANGEMENT AND METHOD OF PRODUCING AN OPTICAL SENSO...

LED MODULE, LED ILLUMINATION MEANS, AND LED LAMP FOR THE ENERGY-EFF...

SEMICONDUCTOR DEVICE FOR DETECTION OF RADIATION AND METHOD OF PRODU...

METHOD OF APPLICATION OF A CARRIER TO A DEVICE WAFER

SEMICONDUCTOR DEVICE WITH INTEGRATED HOT PLATE AND RECESSED SUBSTRA...

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PRODUCING A SEMICONDUCTOR...

INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAGING OF CHIPS