Fu-Di Tang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating carrier-free semiconductor package
- Patent number 11,289,409
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-free semiconductor package and fabrication method
- Patent number 10,566,271
- Issue date Feb 18, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package without chip carrier
- Patent number 9,190,296
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package having electrical conne...
- Patent number 9,177,837
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package without chip carrier and fabrication method t...
- Patent number 8,975,734
- Issue date Mar 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating quad flat non-leaded semiconductor package
- Patent number 8,835,225
- Issue date Sep 16, 2014
- Siliconware Precision Industries Co., Ltd.
- Fu-Di Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,716,861
- Issue date May 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded semiconductor package
- Patent number 8,624,368
- Issue date Jan 7, 2014
- Siliconware Precision Industries Co., Ltd.
- Fu-Di Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,390,118
- Issue date Mar 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a support structure and fabrication meth...
- Patent number 8,241,967
- Issue date Aug 14, 2012
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a support structure and fabrication meth...
- Patent number 7,893,547
- Issue date Feb 22, 2011
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package without chip carrier and fabrication method t...
- Patent number 7,679,172
- Issue date Mar 16, 2010
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-free semiconductor package and fabrication method thereof
- Patent number 7,314,820
- Issue date Jan 1, 2008
- Siliconware Precision Industries Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method and semiconductor package using the same
- Patent number 7,126,229
- Issue date Oct 24, 2006
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipating structure
- Patent number 6,696,750
- Issue date Feb 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Cha-Yun Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device with flash-proof structure
- Patent number 6,696,752
- Issue date Feb 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Guo-Kai Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with dot array of silver-plated regions on die pad for us...
- Patent number 6,396,129
- Issue date May 28, 2002
- Siliconware Precision Industries Co., Ltd.
- Chin-Yuan Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20200144167
- Publication date May 7, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
- Publication number 20170200671
- Publication date Jul 13, 2017
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20150129288
- Publication date May 14, 2015
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Pen-Yi LIAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER
- Publication number 20140315351
- Publication date Oct 23, 2014
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...
- Publication number 20140206146
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE
- Publication number 20140162409
- Publication date Jun 12, 2014
- Siliconware Precision Industries Co., Ltd.
- Fu-Di Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20130161802
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...
- Publication number 20120007234
- Publication date Jan 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
- Publication number 20110298126
- Publication date Dec 8, 2011
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICAT...
- Publication number 20110221049
- Publication date Sep 15, 2011
- Siliconware Precision Industries Co., Ltd.
- Fu-Di Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20110221059
- Publication date Sep 15, 2011
- Siliconware Precision Industries Co., Ltd.
- Fu-Di Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20110156252
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A SUPPORT STRUCTURE AND FABRICATION METH...
- Publication number 20110143498
- Publication date Jun 16, 2011
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing quad flat non-leaded semiconductor package
- Publication number 20070059863
- Publication date Mar 15, 2007
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A SUPPORT STRUCTURE AND FABRICATION METH...
- Publication number 20070059865
- Publication date Mar 15, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-free semiconductor package with stand-off member and fabric...
- Publication number 20070054438
- Publication date Mar 8, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package without chip carrier and fabrication method t...
- Publication number 20070018291
- Publication date Jan 25, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20070007669
- Publication date Jan 11, 2007
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame-based semiconductor package and lead frame thereof
- Publication number 20060151862
- Publication date Jul 13, 2006
- SILICONWARE PRECISON INDUSTRIES CO., LTD.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-free semiconductor package and fabrication method thereof
- Publication number 20060121647
- Publication date Jun 8, 2006
- Siliconware Precision Industries Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20050173791
- Publication date Aug 11, 2005
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages having flash-proof structure and method for manufacturing...
- Publication number 20010042915
- Publication date Nov 22, 2001
- Siliconware Precision Industries, Ltd.
- Guo-Kai Su
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for fabricating carrier-free semiconductor package

Carrier-free semiconductor package and fabrication method

Fabrication method of semiconductor package without chip carrier

Fabrication method of semiconductor package having electrical conne...

Semiconductor package without chip carrier and fabrication method t...

Method for fabricating quad flat non-leaded semiconductor package

Semiconductor package having electrical connecting structures and f...

Quad flat non-leaded semiconductor package

Semiconductor package having electrical connecting structures and f...

Semiconductor package with a support structure and fabrication meth...

Semiconductor package with a support structure and fabrication meth...

Semiconductor package without chip carrier and fabrication method t...

Carrier-free semiconductor package and fabrication method thereof

Wire-bonding method and semiconductor package using the same

Semiconductor package with heat dissipating structure

Encapsulated semiconductor device with flash-proof structure

Leadframe with dot array of silver-plated regions on die pad for us...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

CIRCUIT SUBSTRATE AND METHOD FOR MAKING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...

METHOD FOR FABRICATING QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICAT...

QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

SEMICONDUCTOR PACKAGE WITH A SUPPORT STRUCTURE AND FABRICATION METH...

Method of manufacturing quad flat non-leaded semiconductor package

SEMICONDUCTOR PACKAGE WITH A SUPPORT STRUCTURE AND FABRICATION METH...

Carrier-free semiconductor package with stand-off member and fabric...

Semiconductor package without chip carrier and fabrication method t...

Wire-bonding method and semiconductor package using the same

Lead-frame-based semiconductor package and lead frame thereof

Carrier-free semiconductor package and fabrication method thereof

Wire-bonding method and semiconductor package using the same

Packages having flash-proof structure and method for manufacturing...