Fu Tang Chu

Person

Fengshan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 11,189,518
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,332,849
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,074,622
- Issue date Sep 11, 2018
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sawing a wafer and method for manufacturing a semiconduc...
- Patent number 7,749,866
- Issue date Jul 6, 2010
- Advanced Semiconductor Engineering, Inc.
- Fu Tang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer cassette
- Patent number 6,691,876
- Issue date Feb 17, 2004
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive pattern for attaching semiconductor chip onto substrate
- Patent number 6,476,504
- Issue date Nov 5, 2002
- Advanced Semiconductor Engineering, Inc.
- Fu Tang Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20210151342
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180374805
- Publication date Dec 27, 2018
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180226365
- Publication date Aug 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SAWING A WAFER AND METHOD FOR MANUFACTURING A SEMICONDUC...
- Publication number 20080176360
- Publication date Jul 24, 2008
- Advanced Semiconductor Engineering, Inc.
- Fu Tang CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing method for a wafer
- Publication number 20080045124
- Publication date Feb 21, 2008
- Fu-Tang Chu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR DICING A WAFER
- Publication number 20070224780
- Publication date Sep 27, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Fu Tang CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer cassette
- Publication number 20030075518
- Publication date Apr 24, 2003
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frame cassette
- Publication number 20030066810
- Publication date Apr 10, 2003
- Advanced Semiconductor Engineering, Inc.
- Fu-Tang Chu
- H01 - BASIC ELECTRIC ELEMENTS

Fu Tang Chu

Person

Patents Grantslast 30 patents

Method of processing a semiconductor wafer

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Method for sawing a wafer and method for manufacturing a semiconduc...

Semiconductor wafer cassette

Adhesive pattern for attaching semiconductor chip onto substrate

Patents Applicationslast 30 patents

METHOD OF PROCESSING A SEMICONDUCTOR WAFER

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR SAWING A WAFER AND METHOD FOR MANUFACTURING A SEMICONDUC...

Sawing method for a wafer

METHOD FOR DICING A WAFER

Semiconductor wafer cassette

Frame cassette