METHOD FOR DICING A WAFER

Abstract

A method for dicing a wafer is provided. A layer of adhesive material is applied to the back surface of the wafer so as to provide a sufficient mechanical strength for the wafer during dicing process thereby preventing the dice diced from the wafer from undue chipping on the back surfaces and the side surfaces.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 a and 1b are schematic views illustrating a convention method for dicing a wafer.

FIGS. 2 a to 2c are schematic views illustrating the method for dicing a wafer according to the present invention.

FIG. 3 is a schematic view illustrating the method for uniformly forming the adhesive layer on the back surface of the wafer in FIG. 2a.

FIGS. 4 a and 4b are the enlarged pictures of the dice that are diced from wafers in the conventional methods.

FIG. 4 c is the enlarged picture of the die that is diced from a wafer in the method of the present invention.

Claims

1. A method for dicing a wafer, comprising: providing a wafer having opposing active and back surfaces;applying a layer of adhesive material to the back surface of the wafer;curing the layer of adhesive material to form a hardened adhesive layer on the back surface of the wafer; anddicing the wafer into a plurality of dice.

2. The method as claimed in claim 1, further comprising: attaching a tape to the hardened adhesive layer on the back surface of the wafer.

3. The method as claimed in claim 1, wherein the step of applying a layer of adhesive material to the back surface of the wafer comprises: attaching the active surface of the wafer to a turntable;rotating the turntable to drive the wafer to rotate; andapplying the adhesive material onto the center of the back surface of the wafer to make the adhesive material uniformly spread over the back surface of the wafer.

4. The method as claimed in claim 1, wherein the adhesive layer is non-conductive.

5. The method as claimed in claim 1, wherein the wafer is diced from the active surface of the wafer.

6. The method as claimed in claim 1, wherein the adhesive material is adhesive before curing.

7. The method as claimed in claim 6, wherein the hardened adhesive layer is not adhesive.

8. The method as claimed in claim 1, wherein the adhesive material is thermosetting.

9. The method as claimed in claim 1, wherein the layer of adhesive material is cured by baking.

10. The method as claimed in claim 1, wherein the layer of adhesive material is cured by UV illumination.

11. A method for dicing a wafer, comprising: providing a wafer having opposing active and back surfaces;attaching the active surface of the wafer to a turntable;rotating the turntable to drive the wafer to rotate;applying an adhesive material onto the center of the back surface of the wafer to make the adhesive material uniformly spread over the back surface of the wafer; curing the adhesive material to form a hardened adhesive layer on the back surface of the wafer;attaching a tape to the hardened adhesive layer on the back surface of the wafer; anddicing the wafer into a plurality of dice.

12. The method as claimed in claim 11, wherein the hardened adhesive layer is non-conductive.

13. The method as claimed in claim 11, wherein the wafer is diced from the active surface of the wafer.

14. The method as claimed in claim 11, wherein the adhesive material is adhesive before curing.

15. The method as claimed in claim 14, wherein the hardened adhesive layer is not adhesive.

16. The method as claimed in claim 11, wherein the adhesive material is thermosetting.

17. The method as claimed in claim 11, wherein the adhesive material is cured by baking.

18. The method as claimed in claim 11, wherein the adhesive material is cured by UV illumination.