Fufa Chen

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,911,808
- Issue date Feb 27, 2024
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,848,217
- Issue date Dec 19, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafers
- Patent number 11,752,529
- Issue date Sep 12, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,638,937
- Issue date May 2, 2023
- ACM Research, Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,633,765
- Issue date Apr 25, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Grant
System for cleaning semiconductor wafers
- Patent number 11,141,762
- Issue date Oct 12, 2021
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,103,898
- Issue date Aug 31, 2021
- ACM Research, Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods and apparatus for cleaning substrates
- Patent number 11,037,804
- Issue date Jun 15, 2021
- ACM Research, Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staged aluminum deposition process for filling vias
- Patent number 6,660,135
- Issue date Dec 9, 2003
- Applied Materials, Inc.
- Sang-Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the CVD deposition of a low residual halogen content mul...
- Patent number 6,436,820
- Issue date Aug 20, 2002
- Applied Materials, Inc.
- Jianhua Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
300 mm CVD chamber design for metal-organic thin film deposition
- Patent number 6,364,949
- Issue date Apr 2, 2002
- Applied Materials, Inc.
- David T. Or
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Staged aluminum deposition process for filling vias
- Patent number 6,352,620
- Issue date Mar 5, 2002
- Applied Materials, Inc.
- Sang-Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid vaporizers for semiconductor processing systems
- Patent number 6,332,601
- Issue date Dec 25, 2001
- Applied Materials
- Joel M. Huston
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid level pressure sensor and method
- Patent number 6,220,091
- Issue date Apr 24, 2001
- Applied Materials, Inc.
- Fufa Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of performing titanium/titanium nitride integration
- Patent number 6,221,174
- Issue date Apr 24, 2001
- Applied Materials, Inc.
- Fufa Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid vaporizer systems and methods for their use
- Patent number 6,179,277
- Issue date Jan 30, 2001
- Applied Materials, Inc.
- Joel M. Huston
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Programmable electrical interlock system for a vacuum processing sy...
- Patent number 6,086,676
- Issue date Jul 11, 2000
- Applied Materials, Inc.
- Yeh-Jen Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20230256480
- Publication date Aug 17, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20220032344
- Publication date Feb 3, 2022
- Hui WANG
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20220037172
- Publication date Feb 3, 2022
- ACM Research (Shanghai) Inc.
- Hui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20210402444
- Publication date Dec 30, 2021
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20190283090
- Publication date Sep 19, 2019
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHODS AND APPARATUS FOR CLEANING SUBSTRATES
- Publication number 20190287824
- Publication date Sep 19, 2019
- ACM Research (Shanghai) Inc.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180071794
- Publication date Mar 15, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
METHOD FOR CLEANING SEMICONDUCTOR WAFERS
- Publication number 20180071795
- Publication date Mar 15, 2018
- ACM Research (Shanghai) Inc.
- Hui Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Method of tisin deposition using a chemical vapor deposition process
- Publication number 20020114886
- Publication date Aug 22, 2002
- APPLIED MATERIALS, INC.
- Jing-Pei Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Staged aluminum deposition process for filling vias
- Publication number 20020064952
- Publication date May 30, 2002
- Sang-Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGED ALUMINUM DEPOSITION PROCESS FOR FILLING VIAS
- Publication number 20010047932
- Publication date Dec 6, 2001
- APPLIED MATERIALS, INC.
- SANG-HO YU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

System for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

Method for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

System for cleaning semiconductor wafers

System for cleaning semiconductor wafers

Methods and apparatus for cleaning substrates

Methods and apparatus for cleaning substrates

Staged aluminum deposition process for filling vias

Method for the CVD deposition of a low residual halogen content mul...

300 mm CVD chamber design for metal-organic thin film deposition

Staged aluminum deposition process for filling vias

Liquid vaporizers for semiconductor processing systems

Liquid level pressure sensor and method

Method of performing titanium/titanium nitride integration

Liquid vaporizer systems and methods for their use

Programmable electrical interlock system for a vacuum processing sy...

Patents Applicationslast 30 patents

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

METHODS AND APPARATUS FOR CLEANING SUBSTRATES

SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS

METHOD FOR CLEANING SEMICONDUCTOR WAFERS

Method of tisin deposition using a chemical vapor deposition process

Staged aluminum deposition process for filling vias

STAGED ALUMINUM DEPOSITION PROCESS FOR FILLING VIAS