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Fuhan Liu
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Atlanta, GA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
Patent number
10,672,718
Issue date
Jun 2, 2020
Georgia Tech Research Corporation
Venkatesh Sundaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
Patent number
9,275,934
Issue date
Mar 1, 2016
Georgia Tech Research Corporation
Venkatesh Sundaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-last embedded interconnect structures
Patent number
8,536,695
Issue date
Sep 17, 2013
Georgia Tech Research Corporation
Fuhan Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin-film capacitor structures embedded in semiconductor packages a...
Patent number
8,391,017
Issue date
Mar 5, 2013
Georgia Tech Research Corporation
David Ross McGregor
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...
Publication number
20160141257
Publication date
May 19, 2016
Georgia Tech Research Corporation
Venkatesh Sundaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR...
Publication number
20160113108
Publication date
Apr 21, 2016
Georgia Tech Research Corporation
Venkatesh SUNDARAM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...
Publication number
20130119555
Publication date
May 16, 2013
Georgia Tech Research Corporation
Venkatesh Sundaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...
Publication number
20120261805
Publication date
Oct 18, 2012
Georgia Tech Research Corporation
VENKATESH V. SUNDARAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING TH...
Publication number
20120228754
Publication date
Sep 13, 2012
Georgia Tech Research Corporation
FUHAN LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...
Publication number
20100270646
Publication date
Oct 28, 2010
GEORGIA TECH RESEARCH CORPORATION
Cheong-Wo Hunter Chan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...
Publication number
20100270645
Publication date
Oct 28, 2010
GEORGIA TECH RESEARCH CORPORATION
DAVID ROSS MCGREGOR
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR