The present disclosure generally relates to portable electronic and more specifically, substrates for use with package-level components.
Recent consumer trends indicate that the demand for portable electronic systems continues to trend upwards. Given that the market drivers for portable electronic systems include factors such as size, performance, cost and reliability, there is often a critical tradeoff that has to be struck between cost and size of respective portable electronic systems. Because reliability may not be compromised, design considerations have focused on size and performance. Size is crucial and must be substantiated by performance while being balanced with cost. Portable electronic systems can include digital or mixed signal chips, analog chips and passives for radio frequency (RF) integration.
RF modules specifically may feature individually packaged actives and passives that are assembled on a printed wiring board. A need therefore exists for a device that is capable of being used in multiple or all regions of the world, that is multi-band and multi-mode, that is usable with high-density integration of ultra-miniaturized components in multi-band RF sub-systems. Implementing a highly-miniaturized multi-band RF sub-systems with System-On-Package (SOP), however, faces certain challenges.
Such challenges may include designing of highly integrated, embedded components for RF front end, chip package co-design of active components with embedded components, managing electromagnetic interference (EMI) between these components, as well as addressing thermal issues that arise from high-density integration.
Furthermore, ultra-miniaturized design and embedding of actives and passives have been demonstrated by previous approaches but still require improvement as to EMI and thermal management between the components. It is with respect to these and other considerations that the various embodiments described below are presented.
In some aspects, a electromagnetic interference shielding device is described having a first substrate one or more surfaces. One or more laminates are operatively attached to the one or more surfaces of the first substrate. A cavity is provided that is defined by the first substrate and its corresponding one or more laminates and at least one inner lateral portion. The cavity is operable to receive one or more microelectromechanical system (MEMS) components. These the components may include one or a combination of inductors, capacitors, and interconnections. A first conductive structure integrally formed with a trench or via array of the substrate spans a thickness defined by one or more of surfaces of the first substrate, the first conductive structure operable to shield electromagnetic interference between MEMS components assembled with the first substrate. Surfaces of the first substrate may be operable for die embedding and/or receiving one or more metallization patterns.
The substrate may be constructed from glass or otherwise be a constructed from organic, low-loss materials. The cavity may also be metalized or coated such that the cavity may be partially or completely filled with conductive or non-conductive material
In certain embodiments, the first conductive structure may be integrally formed with the trench of the substrate. In this embodiment, the first conductive structure may provide up to 25 dB more lateral isolation than via-arrays. However, the device is not so limited and the first conductive structure may instead be integrally formed with a continuous pad of a via array of the substrate, the continuous pad being disposed at a predetermined height relative to the substrate (e.g. 20-40 μm). One or more surfaces of the first conductive structure may be generally orthogonal to the first substrate and extend a predetermined height relative to the substrate.
In other embodiments, the cavity may be partially or completely filled with conductive or non-conductive material. The first conductive structure may also include a plurality of individual portions separated and arranged in a predetermined pattern or array as needed or required. One or more planar surfaces of the first conductive structure may be operable to surround or form a dividing EMI shield between one or more MEMS components in communication or otherwise assembled with the first substrate. The individual portions may in turn shield the MEMS components from interfering with each other and from interfering with signal lines inside and outside a system-on-package corresponding with the device.
A second conductive structure may be provided and oriented parallel with the substrate in a manner that covers the cavity. The first and second conductive structures may be constructed, partially or completely, from of a conducting magnetic material. However, the first and/or second conductive structures are not so limited and instead may be constructed from a multi-layer structure. The multi-layer structure may include a magnetic layer positioned between a non-magnetic layer and an insulator layer and each layer may be from the same metal or may be from different metals as described more particularly below.
In some embodiments, the one or more MEMS components may be electrically connected to the one or more surfaces of the first substrate in a face-down orientation. In this respect, the one or more MEMS components may be electrically connected to one or more terminals of a system-on-package package corresponding with the device.
A second substrate may also be used with the first substrate. having one or more surfaces, the second substrate being similar to the foregoing first substrate and disposed above of the first substrate and including a conductive structure that functions as an EMI shield for one or more MEMS components assembled therewith. The first and second substrates may be electrically connected and their conductive structures may also be constructed from one, or a combination of, Cu, CoZr, and Al.
In other embodiments, an electromagnetic interference trench-based shielding system is disclosed having a substrate having one or more surfaces. The substrate may be operable to receive one or more microelectromechanical system (MEMS) components. A first conductive structure may span a thickness defined by one or more of surfaces of the substrate and may extend outwardly from the substrate to a predetermined height relative substrate. The first conductive structure may be in communication with a trench of the substrate and oriented generally orthogonal to the first substrate. In this respect, the first conductive structure may be integrally formed with the trench or otherwise assembled, connected, attached, or formed therewith. The first conductive structure separates at least two MEMS components assembled to the substrate.
A process of fabricating one or more electromagnetic shields between components for ultra-thin radiofrequency packages is also disclosed herein. The process may include the following steps: selectively inserting one or more through package vias (TPVs) in a substrate; removing residue from an edge of the one or more TPVs by desmearing; electroless seed plating the substrate thereby increasing thickness and conductivity; coating the substrate by electrolytic plating with a metal; thinning upper and lower surfaces of the substrate; laminating upper and lower surfaces of the substrate with a first layer of photoresist film; exposing the first layer of photoresist film of the upper and lower surfaces to wavelengths in the ultraviolet spectrum; subtractive etching the electrolytic plating on the upper and lower surfaces of the substrate and stripping the photoresist film; electroless seed layer plating on the upper and lower surfaces of the substrate; applying a relatively a second layer of photoresist film to the upper surface of the substrate, the second layer being thicker than the first layer of photoresist film; exposing the second layer of photoresist film to wavelengths in the ultraviolet spectrum; electroplating the second layer of photoresist film with a metal; stripping the relatively thick photoresist film and etching the electroless seed layer on the upper surface of the substrate thereby forming one or more electromagnetic interference (EMI) shields in communication with corresponding trenches of the substrate; and laminating one or more layers to apply uniform pressure to uneven profiles of the substrate caused by the one or more EMI shields.
The TPVs may be selectively inserted using laser ablation through use of UV, excimer, CO2, or CO2T lasers. However, the process is not so limited and other forms of TPV insertion are contemplated including mechanical, photo-definable where the material is photo sensitive and patternable by selective exposure to light. Chemical forms of removal may also be used where, for example, in the photo-definable process, a chemical may be used as a “developer” to remove the uncured patterns.
The substrate may also be electroless seed plated with copper. In certain embodiments, thinning of the upper and lower surfaces of the substrate may be carried out by chemical etching. Desmearing may be accomplished through plasma, chemical desmear, or through use of lasers. Other aspects and features of the present disclosure will become apparent to those of ordinary skill in the art, upon reviewing the following detailed description in conjunction with the accompanying figures.
Reference will now be made to the accompanying drawings, which are not necessarily drawn to scale.
The subject matter of the various embodiments is described with specificity to meet statutory requirements. However, the description itself is not intended to limit the scope of the claimed invention. Rather, it has been contemplated that the claimed invention can be embodied in other ways, to include different steps or elements similar to the ones described in this document, in conjunction with other present or future technologies. Although the term “step” can be used herein to connote different aspects of methods employed, the term should not be interpreted as implying any particular order among or between various steps herein disclosed unless and except when the order of individual steps is explicitly required. The following description is illustrative and non-limiting to any one aspect.
It should also be noted that, as used in the specification and the claims, the singular forms “a,” “an” and “the” include plural references unless the context clearly dictates otherwise. For example, reference to a component is intended to also include composition of a plurality of components. References to a composition containing “a” constituent are intended to include other constituents in addition to the one named. Also, in describing preferred embodiments, terminology will be resorted to for the sake of clarity. It is intended that each term contemplates its broadest meaning as understood by those skilled in the art and includes all technical equivalents that operate in a similar manner to accomplish a similar purpose.
Ranges can be expressed herein as from “about” or “approximately” one particular value and/or to “about” or “approximately” another particular value. When such a range is expressed, other exemplary embodiments include from the one particular value and/or to the other particular value. The terms “comprising” or “containing” or “including” mean that at least the named component, element, particle, or method step is present in the system or article or method, but does not exclude the presence of other components, materials, particles, or method steps, even if the other such components, material, particles, and method steps have the same function as what is named.
It is also to be understood that the mention of one or more method steps does not preclude the presence of additional method steps or intervening method steps between those steps expressly identified. Similarly, it is also to be understood that the mention of one or more components in a system or composition does not preclude the presence of additional components than those expressly identified. To facilitate an understanding of the principles and features of the present invention, embodiments are explained hereinafter with reference to implementation in illustrative embodiments.
As discussed herein, a “highly miniaturized” may signify components with a distance of separation between other components in a device or system ranging from 0.1-3 mm.
In the following description, references are made to the accompanying drawings that form a part hereof and that show, by way of illustration, specific embodiments or examples. In certain embodiments of the present disclosure, the herein disclosed system 100 is operable to achieve ultra-miniaturized EM shield integration without compromising on the size and/or form factor while still mitigating the EMI of system 100 between components therein. Components of system 100 may include passive components including inductors and capacitors as well as interconnections such as vias, transmission lines and chip bumps. The dimensions of these elements may be dependent on necessity and design of the particular package associated with system 100.
Regarding EMI in particular, unlike electric fields, low wave-impedance of magnetic fields in the near-field region makes it difficult to shield magnetic waves through reflection loss. A shield with high absorption loss is typically used to address EMI issues which can be achieved through shields with large thickness, high conductivity, or high permeability. However, in ultra-miniaturized systems, the metal thickness cannot be high enough which results in low absorption loss. In addition, magnetic materials tend to exhibit high permeability only up to a particular frequency such that present shields have shortcomings in terms of design limitations related to thickness and materials.
Additionally, with increasing miniaturization in packaging, the demand for miniaturized shields offering equal or better isolation is crucial. Certain approaches have included incorporating a cage structure to isolate RF and digital signals. This particular approach has been used with stacked packages. However, this approach fails to provide sufficient isolation and is a frequency-dependent solution.
Other approaches have incorporated metal can structures for EMI shielding and isolation for the board at the system level around different sub-sections. However, this approach suffers from being too bulky, heavy and for failing to provide shielding from internal interference. Other approaches have also included integrated, over-molded shields for isolating Tx and Rx circuits at the sub-package level. This integrated, over-molded solution, however, suffers by providing insufficient isolation due to holes in its shield. Therefore, problems in the art remain unresolved as to shielding between densely packed components in a miniaturized packages at least because of the complexities resulting from miniaturization of the shields.
System 100 as described herein solves these and other problems of the art by effectively shielding respective components from EM radiation with no resonance due to aperture. System 100 may also eliminate the need for a bulky metal enclosure on the printed circuit board (PCB) formed therewith. In this respect, system 100 as described more particularly below may permit use of high proximity of digital and RF components with correspondingly low costs, a relatively compact form-factor, and improved thermal relief for system 100.
Specifically, system 100 may be capable of providing between 30-60 dB EM isolation at distances less than 100 a frequency range of 1-20 GHz, and thickness of shield material less than 10 μm. System 100 as depicted in
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Substrate 3 of
Components of system 100 such as dies D1 and D2 of
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This outgoing wave does not get reflected at layer 102 since the impedance of the insulator layer 102 is higher than that of the magnetic layer 103. Instead, the outgoing wave reflected from layer 103 experiences the first reflection only at layer 101 as it propagates from layer 101 into the air medium outside the associated shield. Thus, layer 101 helps eliminate the effect of multiple reflections in layer 102. Further, the part of the wave that gets reflected inside at layer 101 tries to enter the shield again but the wave is reflected at layer 102 and then at layer 103 while also being absorbed in layers 101 and 102. Accordingly, reflected waves that re-enter the shield of structure 10 that could otherwise manifest as secondary and tertiary emissions out of structure 10 are instead attenuated by a series of absorption and reflection losses.
While the most effective and stable material choice in those embodiments that use multi-layer structure 10 of
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Substrate 3 may then undergo electrolytic plating in step 220 to further coat the substrate 3 with one or more layers of a metal such as gold, silver, tin, zinc, copper, cadmium, chromium, nickel, platinum, lead, or the like. Upper and/or lower surfaces of substrate 3 may then be thinned down in step 225 and then undergo photoresist (PR) lamination 230 on the lower and/or upper surfaces. Preferably, PR film layer of step 230 may be relatively thin and may be applied on both the lower and upper surfaces by, for example, a laminating mechanism. Layers of step 230 may also be any positive and/or negative photoresists capable of being used with substrates constructed from materials such as Si, GaAs, InP, glass, or metals such as Au, Cu and Al. Thereafter, the one or more PR film layers laminated with substrate 3 may be exposed in step 235 to wavelengths in the ultraviolet spectrum (e.g. less than 400 nm).
However, step 235 may also include exposing the one or more PR film layers of step 230 to an electron beam. Patterning and/or metallization of the core metal layers and the TPVs of steps 205 to 235 may be performed using double-side wet metallization techniques. In addition, shielding trenches and/or TPVs of substrate 3 may be simultaneously formed thereon using laser ablation, mechanical removal, or chemical removal. In those embodiments where laser ablation is used, UV, excimer, CO2, and CO2T lasers may be used depending need or preference.
In step 240, the core of system 100 may then be developed with build up and then undergo subtractive etching 245. The PR film layers of 230 may then be stripped therefrom in step 250. Thereafter, system 100 may undergo electroless metal layer plating and preferably, copper seed layer plating in step 255. System 100 may then receive a relatively thick layer of photoresist film 260 and again, expose system to wavelengths in the ultraviolet spectrum and further develop system 100 in step 265. System 100 may then undergo electroplating with a metal such as copper 270 to form structures 10, have its PR film layer stripped therefrom 275, and undergo seed layer etching 280. Finally, system 100 in step 285 may undergo further build-up lamination by, for example, adding an additional layer to apply uniform pressure resulting from uneven profiles caused by structures 10. Carrying out the foregoing steps of process 200 leaves system 100 fully formed with corresponding structures 10 ready for EMI shielding between components of system 100. Further processing of any of the previously described steps of process 200 may be repeated as needed or required.
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Examples of certain implementations of the disclosed system 100 will now be described with respect to
The substrate analyzed in this example was constructed from compatible metals including copper, nickel, aluminum, nickel-iron (NiFe), and cobalt-zirconium (CoZr). Above each material's ferro-magnetic resonance frequency, it is understood that magnetic materials tend to absorb radiation incident thereon. Pursuant to each material analyzed, the ferromagnetic resonance (FMR) was determined through experimental characterization as follows:
Analytical calculations were performed to estimate the shield effectiveness of the above-listed materials assuming a distance between source and shield of approximately 0.5 mm. The simulation considered a frequency range of 0.5 GHz-20 GHz since this covers the operating frequencies of WLAN and cellular RF modules, including three harmonics. The impact of thickness on shield effectiveness was also studied by varying the metal thickness from 1-5 μm.
In
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To study the shield effectiveness, a pair of microstrip transmission lines of length 15 mm, separated by 180 microns, were considered and the required shield structure was integrated between them. The far-end crosstalk between these lines was employed to compare the shield effectiveness of the shield structures. The simulations of the via array and trench were performed and the comparison of their shield effectiveness revealed that the shield effectiveness of the trench structure was more than that of the via array, with the highest simulated EM isolation between the transmission lines being 20 dB for the trench and 25 dB for the via array.
With respect to
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The presence of trench-based structures 10 were also used with said trench being positioned above the plane of associated transmission lines between 20 μm and 40 μm. When the trenches were extended vertically upwards by 20-40 μm, the shield effectiveness was observed to increase by up to 6 dB.
The specific configurations, choice of materials and the size and shape of various elements can be varied according to particular design specifications or constraints requiring a system or method constructed according to the principles of the disclosed technology. Such changes are intended to be embraced within the scope of the disclosed technology. The presently disclosed embodiments, therefore, are considered in all respects to be illustrative and not restrictive. The scope of the disclosure is indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalents thereof are intended to be embraced therein.
This Application claims benefit under 35 U.S.C §119(e) of U.S. Provisional Patent Application Ser. No. 62/066,579, filed Oct. 21, 2014, and entitled “Structure method of package-level horizontal and vertical metal patterns embedded in electronic component substrates”, which is incorporated by reference in its entirety as if fully set forth below.
Number | Date | Country | |
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62066579 | Oct 2014 | US |