Fukutomi Naoki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 7,187,072
- Issue date Mar 6, 2007
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,746,897
- Issue date Jun 8, 2004
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for use in package of semiconductor device, semiconductor...
- Patent number 6,708,398
- Issue date Mar 23, 2004
- Hitachi Chemical Co., Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor device substrate, and methods o...
- Patent number 6,617,193
- Issue date Sep 9, 2003
- Hitachi Chemical Company, Ltd.
- Yamazaki Toshio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the fabrication of wiring board for electrical tests
- Patent number 6,568,073
- Issue date May 27, 2003
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of fabrication thereof
- Patent number 6,492,203
- Issue date Dec 10, 2002
- Hitachi Chemical Company, Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,365,432
- Issue date Apr 2, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board for mounting semiconductor element, method for manufacturing...
- Patent number 6,268,648
- Issue date Jul 31, 2001
- Hitachi Chemical Co., Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board for electrical tests with bumps having polymeric coating
- Patent number 6,133,534
- Issue date Oct 17, 2000
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 5,976,912
- Issue date Nov 2, 1999
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,664,325
- Issue date Sep 9, 1997
- Hitachi Chemical Co. Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photolithographically viahole-forming photosensitive element compri...
- Patent number 5,532,105
- Issue date Jul 2, 1996
- Hitachi Chemical Company, Ltd.
- Takashi Yamadera
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,504,992
- Issue date Apr 9, 1996
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of wiring board
- Patent number 5,426,850
- Issue date Jun 27, 1995
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring boards
- Patent number 5,153,987
- Issue date Oct 13, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing high-density wiring board
- Patent number 4,830,691
- Issue date May 16, 1989
- Hitachi Chemical Company, Ltd.
- Akinari Kida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-density wired circuit board using insulated wires
- Patent number 4,791,238
- Issue date Dec 13, 1988
- Hitachi Chemical Company, Ltd.
- Masao Kanno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a multistylus head device
- Patent number 4,219,927
- Issue date Sep 2, 1980
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20040110319
- Publication date Jun 10, 2004
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020094606
- Publication date Jul 18, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020039808
- Publication date Apr 4, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for use in package of semiconductor device, semiconductor...
- Publication number 20020020909
- Publication date Feb 21, 2002
- HITACHI CHEMICAL CO., Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS

Fukutomi Naoki

Person

Patents Grantslast 30 patents

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Substrate for use in package of semiconductor device, semiconductor...

Semiconductor device, semiconductor device substrate, and methods o...

Process for the fabrication of wiring board for electrical tests

Semiconductor device and method of fabrication thereof

Fabrication process of semiconductor package and semiconductor package

Board for mounting semiconductor element, method for manufacturing...

Wiring board for electrical tests with bumps having polymeric coating

Fabrication process of semiconductor package and semiconductor package

Fabrication process of wiring board

Photolithographically viahole-forming photosensitive element compri...

Fabrication process of wiring board

Fabrication process of wiring board

Process for producing printed wiring boards

Process for producing high-density wiring board

High-density wired circuit board using insulated wires

Method of producing a multistylus head device

Patents Applicationslast 30 patents

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Substrate for use in package of semiconductor device, semiconductor...