Fumiyuki Kobayashi

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and manufacture thereof, ceramic composition for...
- Patent number 6,118,671
- Issue date Sep 12, 2000
- Hitachi, Ltd.
- Hirayoshi Tanei
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Circuit substrate and electronics computer, using sintered glass ce...
- Patent number 5,825,632
- Issue date Oct 20, 1998
- Hitachi, Ltd.
- Hirayoshi Tanei
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Cooling device of multi-chip module
- Patent number 5,751,062
- Issue date May 12, 1998
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 5,731,066
- Issue date Mar 24, 1998
- Hitachi, Ltd.
- Akihiro Ando
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device of semiconductor chips
- Patent number RE35721
- Issue date Feb 3, 1998
- Hitachi, Ltd.
- Takahiro Daikoku
- 165 - Heat exchange
Information Patent Grant
Method for producing thin film multilayer wiring board
- Patent number 5,707,749
- Issue date Jan 13, 1998
- Hitachi, Ltd.
- Junichi Katagiri
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic apparatus
- Patent number 5,592,363
- Issue date Jan 7, 1997
- Hitachi, Ltd.
- Takayuki Atarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting substrate
- Patent number 5,350,886
- Issue date Sep 27, 1994
- Hitachi, Ltd.
- Kunio Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip carrier, module having same chip carrier mounted...
- Patent number 5,281,151
- Issue date Jan 25, 1994
- Hitachi, Ltd.
- Hideo Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing multilayer ceramic body with convex side faces
- Patent number 5,277,723
- Issue date Jan 11, 1994
- Hitachi, Ltd.
- Hironori Kodama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic circuit device and method of producing the same
- Patent number 5,276,289
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Ryohei Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of thermal conductive members for a multi-chip mo...
- Patent number 5,276,586
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Toshio Hatsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device, method of connecting with solder and sol...
- Patent number 5,136,360
- Issue date Aug 4, 1992
- Hitachi, Ltd.
- Masahide Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling arrangement for semiconductor devices and method of making...
- Patent number 5,133,403
- Issue date Jul 28, 1992
- Hitachi, Ltd.
- Hitoshi Yokono
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mounting mechanism for mounting heat sink on multi-chip module
- Patent number 5,109,317
- Issue date Apr 28, 1992
- Hitachi, Ltd.
- Mitsuo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 5,089,936
- Issue date Feb 18, 1992
- Hitachi, Ltd.
- Hiroyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for cooling an electronic device and heat radiation...
- Patent number 5,077,601
- Issue date Dec 31, 1991
- Hitachi, Ltd.
- Toshio Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for electronic device
- Patent number 5,040,992
- Issue date Aug 20, 1991
- Hitachi, Ltd.
- Mitsuo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 4,970,575
- Issue date Nov 13, 1990
- Hitachi, Ltd.
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and method of producing the same
- Patent number 4,884,170
- Issue date Nov 28, 1989
- Hitachi, Ltd.
- Nobuaki Ohki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus cooling system
- Patent number 4,837,663
- Issue date Jun 6, 1989
- Hitachi, Ltd.
- Shizuo Zushi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for airtightly packaging semiconductor package
- Patent number 4,836,434
- Issue date Jun 6, 1989
- Hitachi, Ltd.
- Takaji Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor resin package structure
- Patent number 4,825,284
- Issue date Apr 25, 1989
- Hitachi, Ltd.
- Tasao Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device of semiconductor chips
- Patent number 4,770,242
- Issue date Sep 13, 1988
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component part having lead terminals
- Patent number 4,739,125
- Issue date Apr 19, 1988
- Hitachi, Ltd.
- Yutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for adjusting pressure loss of cooling air for an assembly o...
- Patent number 4,739,444
- Issue date Apr 19, 1988
- Hitachi, Ltd.
- Shizuo Zushi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply structure and system for mounting the same
- Patent number 4,731,703
- Issue date Mar 15, 1988
- Hitachi Ltd.
- Tamotsu Tsukaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-conducting cooling module
- Patent number 4,649,990
- Issue date Mar 17, 1987
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic packaged semiconductor device
- Patent number 4,651,192
- Issue date Mar 17, 1987
- Hitachi, Ltd.
- Yasuo Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic substrate and method for the production thereof
- Patent number 4,624,896
- Issue date Nov 25, 1986
- Hitachi, Ltd.
- Yutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Fumiyuki Kobayashi

Person

Patents Grantslast 30 patents

Circuit substrate and manufacture thereof, ceramic composition for...

Circuit substrate and electronics computer, using sintered glass ce...

Cooling device of multi-chip module

Electronic circuit device

Cooling device of semiconductor chips

Method for producing thin film multilayer wiring board

Electronic apparatus

Mounting substrate

Semiconductor chip carrier, module having same chip carrier mounted...

Method for producing multilayer ceramic body with convex side faces

Electronic circuit device and method of producing the same

Bonding structure of thermal conductive members for a multi-chip mo...

Electronic circuit device, method of connecting with solder and sol...

Cooling arrangement for semiconductor devices and method of making...

Mounting mechanism for mounting heat sink on multi-chip module

Semiconductor module

Cooling system for cooling an electronic device and heat radiation...

Mounting structure for electronic device

Semiconductor device

Multilayer printed circuit board and method of producing the same

Electronic apparatus cooling system

Method and apparatus for airtightly packaging semiconductor package

Semiconductor resin package structure

Cooling device of semiconductor chips

Electric component part having lead terminals

Device for adjusting pressure loss of cooling air for an assembly o...

Power supply structure and system for mounting the same

Heat-conducting cooling module

Ceramic packaged semiconductor device

Multi-layer ceramic substrate and method for the production thereof