Number | Date | Country | Kind |
---|---|---|---|
57-62410 | Apr 1982 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
3102213 | Bedson et al. | Aug 1963 | |
3760091 | Cannizzaro et al. | Sep 1973 | |
3795047 | Abolafia et al. | Mar 1974 | |
3867759 | Siefker | Feb 1975 |
Entry |
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"Reinforcement of Printed Circuits", Archer et al., IBM Tech. Discl. Bull., vol. 13, No. 8, Jan. 71, (2296). |
"Multilayer Circuit Board", Cannizzaro et al., IBM Tech. Discl. Bull., vol. 13, No. 7, Dec. 70, (2075). |
"Plating Thru-Holes in Circ. Boards", . . . Schuessler et al., IBM Tech. Discl. Bull., vol. 13, No. 7, Dec. 70, (1831). |
"Multilayer Printed Circ. Panel", Haddad, IBM Tech. Discl. Bull., vol. 12, No. 8, Jan. 70, (1191). |