Gary C. Downes

Person

Moorpark, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of processing and plating planar articles
- Patent number 6,558,750
- Issue date May 6, 2003
- Technic Inc.
- Daniel J. Gramarossa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafers and other planar articles within a proc...
- Patent number 6,524,463
- Issue date Feb 25, 2003
- Technic, Inc.
- Daniel J. Gramarossa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for plating wafers, substrates and other articles
- Patent number 6,419,805
- Issue date Jul 16, 2002
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,361,669
- Issue date Mar 26, 2002
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for inserting a wafer, substrate or other arti...
- Patent number 6,322,313
- Issue date Nov 27, 2001
- Technic Inc.
- Robert Kaufman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,299,751
- Issue date Oct 9, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,296,753
- Issue date Oct 2, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for electroplating wafers, substrates and othe...
- Patent number 6,287,443
- Issue date Sep 11, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,277,260
- Issue date Aug 21, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for electroplating wafers, substrates and othe...
- Patent number 6,274,023
- Issue date Aug 14, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,274,024
- Issue date Aug 14, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,267,862
- Issue date Jul 31, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anode having separately excitable sections to compensate for non-un...
- Patent number 6,251,238
- Issue date Jun 26, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for plating wafers, substrates and other articles
- Patent number 6,197,182
- Issue date Mar 6, 2001
- Technic Inc.
- Robert Kaufman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING WAFERS AND OTHER PLANAR ARTICLES WITHIN A PROC...
- Publication number 20030010643
- Publication date Jan 16, 2003
- Daniel J. Gramarossa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of processing and plating wafers and other planar articles
- Publication number 20030013285
- Publication date Jan 16, 2003
- Daniel J. Gramarossa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing and plating planar articles
- Publication number 20030012885
- Publication date Jan 16, 2003
- Daniel J. Gramarossa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Automatic wafer processing and plating system
- Publication number 20030010449
- Publication date Jan 16, 2003
- Daniel J. Gramarossa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Processing cells for wafers and other planar articles
- Publication number 20030010625
- Publication date Jan 16, 2003
- Daniel J. Gramarossa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System for plating planar articles
- Publication number 20030010626
- Publication date Jan 16, 2003
- Daniel J. Gramarossa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Gary C. Downes

Person

Patents Grantslast 30 patents

Method of processing and plating planar articles

Method of processing wafers and other planar articles within a proc...

Apparatus for plating wafers, substrates and other articles

Apparatus and method for plating wafers, substrates and other articles

Apparatus and method for inserting a wafer, substrate or other arti...

Apparatus and method for plating wafers, substrates and other articles

Apparatus and method for plating wafers, substrates and other articles

Apparatus and method for electroplating wafers, substrates and othe...

Apparatus and method for plating wafers, substrates and other articles

Apparatus and method for electroplating wafers, substrates and othe...

Apparatus and method for plating wafers, substrates and other articles

Apparatus and method for plating wafers, substrates and other articles

Anode having separately excitable sections to compensate for non-un...

Apparatus and method for plating wafers, substrates and other articles

Patents Applicationslast 30 patents

METHOD OF PROCESSING WAFERS AND OTHER PLANAR ARTICLES WITHIN A PROC...

Method of processing and plating wafers and other planar articles

Method of processing and plating planar articles

Automatic wafer processing and plating system

Processing cells for wafers and other planar articles

System for plating planar articles