Gen Murakami

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting device having a mirror portion
- Patent number 7,476,913
- Issue date Jan 13, 2009
- Renesas Technology Corp.
- Hiroyuki Isobe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Light-emitting unit and method for producing same as well as lead f...
- Patent number 7,317,181
- Issue date Jan 8, 2008
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting unit and method for producing same as well as lead f...
- Patent number 6,995,510
- Issue date Feb 7, 2006
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,981,585
- Issue date Jan 3, 2006
- Renesas Technology Corp.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, electronic device, and circuit...
- Patent number 6,855,893
- Issue date Feb 15, 2005
- Hitachi Cable Ltd.
- Toyohiko Kumakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,531,760
- Issue date Mar 11, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,443,298
- Issue date Sep 3, 2002
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device, lead-patterning substrate, and electronics de...
- Patent number 6,433,409
- Issue date Aug 13, 2002
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, lead-patterning substrate, and electronics de...
- Patent number 6,426,548
- Issue date Jul 30, 2002
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed stacked arrangement of semiconductor devices
- Patent number RE37539
- Issue date Feb 5, 2002
- Hitachi, Ltd.
- Satoshi Oguchi
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device
- Patent number 6,326,681
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,303,982
- Issue date Oct 16, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a semiconductor chip to a lead-patterning substr...
- Patent number 6,297,142
- Issue date Oct 2, 2001
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,223,893
- Issue date May 1, 2001
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device
- Patent number 6,204,552
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,130,114
- Issue date Oct 10, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a resin sealing member which exposes...
- Patent number 6,124,629
- Issue date Sep 26, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 6,114,751
- Issue date Sep 5, 2000
- Hitachi Cable, Ltd.
- Toyohiko Kumakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,100,115
- Issue date Aug 8, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having all outer leads extending from one side...
- Patent number 6,100,580
- Issue date Aug 8, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,081,023
- Issue date Jun 27, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,072,231
- Issue date Jun 6, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device chip on lead and lead on chip manufacturing
- Patent number 6,069,029
- Issue date May 30, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, interposer for semiconductor device
- Patent number 6,031,292
- Issue date Feb 29, 2000
- Hitachi Cable, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a packaged semiconductor device and a lead-frame t...
- Patent number 6,030,859
- Issue date Feb 29, 2000
- Hitachi, Ltd.
- Ichiro Anjoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,018,191
- Issue date Jan 25, 2000
- Hitachi, Ltd.
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having lead on chip structure
- Patent number 6,002,167
- Issue date Dec 14, 1999
- Hitachi Cable, Ltd.
- Kazuhisa Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist pattern forming method using anti-reflective layer resist pa...
- Patent number 5,988,368
- Issue date Nov 23, 1999
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Light Emitting Device and Process for Manufacturing the Same
- Publication number 20080128724
- Publication date Jun 5, 2008
- Hiroyuki Isobe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Light-emitting unit and method for producing same as well as lead f...
- Publication number 20060054912
- Publication date Mar 16, 2006
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board, semiconductor device, electronic device, and circuit...
- Publication number 20040211591
- Publication date Oct 28, 2004
- Hitachi Cable Ltd.
- Toyohiko Kumakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light-emitting unit and method for producing same as well as lead f...
- Publication number 20030107316
- Publication date Jun 12, 2003
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20030057113
- Publication date Mar 27, 2003
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20020179460
- Publication date Dec 5, 2002
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20020174627
- Publication date Nov 28, 2002
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20010015327
- Publication date Aug 23, 2001
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor device
- Publication number 20010008302
- Publication date Jul 19, 2001
- Gen Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, lead-patterning substrate, and electronics de...
- Publication number 20010002066
- Publication date May 31, 2001
- Hitachi Cable Ltd.
- Mamoru Mita
- H01 - BASIC ELECTRIC ELEMENTS

Gen Murakami

Person

Patents Grantslast 30 patents

Light emitting device having a mirror portion

Light-emitting unit and method for producing same as well as lead f...

Light-emitting unit and method for producing same as well as lead f...

Surface package type semiconductor package and method of producing...

Semiconductor device

Wiring board, semiconductor device, electronic device, and circuit...

Semiconductor device

Semiconductor device

Surface package type semiconductor package and method of producing...

Semiconductor device, lead-patterning substrate, and electronics de...

Semiconductor device, lead-patterning substrate, and electronics de...

Sealed stacked arrangement of semiconductor devices

Semiconductor device

Semiconductor device

Method for bonding a semiconductor chip to a lead-patterning substr...

Surface package type semiconductor package and method of producing...

Semiconductor device

Semiconductor device

Semiconductor device including a resin sealing member which exposes...

Semiconductor device and electronic device

Semiconductor device

Semiconductor device having all outer leads extending from one side...

Semiconductor device

Semiconductor device

Semiconductor device chip on lead and lead on chip manufacturing

Semiconductor device, interposer for semiconductor device

Method of making a packaged semiconductor device and a lead-frame t...

Semiconductor device

Semiconductor device having lead on chip structure

Resist pattern forming method using anti-reflective layer resist pa...

Patents Applicationslast 30 patents

Light Emitting Device and Process for Manufacturing the Same

Light-emitting unit and method for producing same as well as lead f...

Wiring board, semiconductor device, electronic device, and circuit...

Semiconductor device

Semiconductor device

Light-emitting unit and method for producing same as well as lead f...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Semiconductor device

Semiconductor device, lead-patterning substrate, and electronics de...