Gene J. Gaudenzi

Person

Purdys, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-level electronic package and method for making same
- Patent number 6,618,267
- Issue date Sep 9, 2003
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming reflowed solder ball with low melting point meta...
- Patent number 6,344,234
- Issue date Feb 5, 2002
- International Business Machines Corportion
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming a capacitor with multi-level interconnection tec...
- Patent number 6,336,262
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowed solder ball with low melting point metal cap
- Patent number 6,259,159
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming features upon a substrate
- Patent number 6,051,273
- Issue date Apr 18, 2000
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective deposition mask and method for making the same
- Patent number 5,922,496
- Issue date Jul 13, 1999
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Capacitor with multi-level interconnection technology
- Patent number 5,808,853
- Issue date Sep 15, 1998
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a flip chip on flexible circuit carrier using...
- Patent number 5,729,896
- Issue date Mar 24, 1998
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making direct chip attach circuit card
- Patent number 5,634,268
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled multi-layer module
- Patent number 5,539,186
- Issue date Jul 23, 1996
- International Business Machines Corporation
- Anthony J. Abrami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount chip package having an array of solder ball contacts...
- Patent number 5,490,040
- Issue date Feb 6, 1996
- International Business Machines Corporation
- Gene J. Gaudenzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attach module (DCAM)
- Patent number 5,313,366
- Issue date May 17, 1994
- International Business Machines Corporation
- Gene J. Gaudenzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ECC function with self-contained high performance partial write or...
- Patent number 5,313,475
- Issue date May 17, 1994
- International Business Machines Corporation
- Daryl C. Cromer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bidirectional buffer with latch and parity capability
- Patent number 5,173,619
- Issue date Dec 22, 1992
- International Business Machines Corporation
- Gene J. Gaudenzi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bidirectional buffer with latch and parity capability
- Patent number 5,107,507
- Issue date Apr 21, 1992
- International Business Machines
- Patrick M. Bland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Programmable voltage controlled ring oscillator
- Patent number 4,978,927
- Issue date Dec 18, 1990
- International Business Machines Corporation
- Kristen A. Hausman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Current source technology
- Patent number 4,954,738
- Issue date Sep 4, 1990
- International Business Machines Corporation
- Gene J. Gaudenzi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Voltage regulator capable of sinking current
- Patent number 4,810,962
- Issue date Mar 7, 1989
- International Business Machines Corporation
- Gene J. Gaudenzi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus for increasing the input noise margin of a gate
- Patent number 4,727,271
- Issue date Feb 23, 1988
- International Business Machines Corporation
- Alfred F. Favata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Switching circuit having low speed/power product
- Patent number 4,682,056
- Issue date Jul 21, 1987
- International Business Machines Corporation
- Gene J. Gaudenzi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Small signal swing driver circuit
- Patent number 4,682,050
- Issue date Jul 21, 1987
- International Business Machines Corporation
- Herve L. Beranger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Low power off-chip driver circuit
- Patent number 4,585,953
- Issue date Apr 29, 1986
- International Business Machines Corporation
- Gene J. Gaudenzi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Controllable di/dt push/pull driver
- Patent number 4,394,588
- Issue date Jul 19, 1983
- International Business Machines Corporation
- Gene J. Gaudenzi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Dottable active collector driver circuit
- Patent number 4,251,737
- Issue date Feb 17, 1981
- International Business Machines Corporation
- Gene J. Gaudenzi
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...
- Publication number 20010013423
- Publication date Aug 16, 2001
- HORMAZDYAR M. DALAL
- H01 - BASIC ELECTRIC ELEMENTS

Gene J. Gaudenzi

Person

Patents Grantslast 30 patents

Multi-level electronic package and method for making same

Method for forming reflowed solder ball with low melting point meta...

Process of forming a capacitor with multi-level interconnection tec...

Reflowed solder ball with low melting point metal cap

Method for forming features upon a substrate

Selective deposition mask and method for making the same

Capacitor with multi-level interconnection technology

Method for attaching a flip chip on flexible circuit carrier using...

Method for making direct chip attach circuit card

Temperature controlled multi-layer module

Surface mount chip package having an array of solder ball contacts...

Direct chip attach module (DCAM)

ECC function with self-contained high performance partial write or...

Bidirectional buffer with latch and parity capability

Bidirectional buffer with latch and parity capability

Programmable voltage controlled ring oscillator

Current source technology

Voltage regulator capable of sinking current

Apparatus for increasing the input noise margin of a gate

Switching circuit having low speed/power product

Small signal swing driver circuit

Low power off-chip driver circuit

Controllable di/dt push/pull driver

Dottable active collector driver circuit

Patents Applicationslast 30 patents

FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...