Georgios C. Dogiamis

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate with glass core having vertical power planes for...
- Patent number 12,368,091
- Issue date Jul 22, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic planar spiral and high aspect ratio inductors for power de...
- Patent number 12,347,761
- Issue date Jul 1, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a hybrid bonded interposer for di...
- Patent number 12,341,114
- Issue date Jun 24, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide interconnect bridges
- Patent number 12,327,795
- Issue date Jun 10, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide interconnects for semiconductor packages and related methods
- Patent number 12,266,840
- Issue date Apr 1, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,255,158
- Issue date Mar 18, 2025
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for conductively coating millimeter waveguides
- Patent number 12,183,961
- Issue date Dec 31, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,166,261
- Issue date Dec 10, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-filter die
- Patent number 12,155,372
- Issue date Nov 26, 2024
- Intel Corporation
- Georgios Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide bundle including first and sec...
- Patent number 12,126,068
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave dielectric waveguide including an opening of varyin...
- Patent number 12,126,067
- Issue date Oct 22, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic support for millimeter-wave communication including...
- Patent number 12,107,314
- Issue date Oct 1, 2024
- Intel Corporation
- Neelam Prabhu Gaunkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersive waveguide crosstalk mitigation
- Patent number 12,088,360
- Issue date Sep 10, 2024
- Intel Corporation
- Henning Braunisch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radio frequency (RF) front-end module (FEM)
- Patent number 12,040,776
- Issue date Jul 16, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic induced heating for solder interconnects
- Patent number 12,040,307
- Issue date Jul 16, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 12,021,289
- Issue date Jun 25, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Physically unclonable function circuitry of a package substrate and...
- Patent number 11,990,419
- Issue date May 21, 2024
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,984,439
- Issue date May 14, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components for millimeter-wave communication
- Patent number 11,955,684
- Issue date Apr 9, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersion compensation for electromagnetic waveguides
- Patent number 11,916,604
- Issue date Feb 27, 2024
- Intel Corporation
- Diego Correas-Serrano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Additive manufacturing for integrated circuit assembly cables
- Patent number 11,895,815
- Issue date Feb 6, 2024
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing for integrated circuit assembly connectors
- Patent number 11,887,944
- Issue date Jan 30, 2024
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION
- Publication number 20250192418
- Publication date Jun 12, 2025
- Intel Corporation
- Tae Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALOG-TO-DIGITAL CONVERTERS AND METHODS FOR SETTLING OF THE REFERE...
- Publication number 20250030432
- Publication date Jan 23, 2025
- Intel Corporation
- Thomas BROWN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS
- Publication number 20250007145
- Publication date Jan 2, 2025
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...
- Publication number 20250006667
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios PANAGOPOULOS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS
- Publication number 20250006719
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios Panagopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20240429221
- Publication date Dec 26, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...
- Publication number 20240429117
- Publication date Dec 26, 2024
- Intel Corporation
- Harshit DHAKAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...
- Publication number 20240429588
- Publication date Dec 26, 2024
- Intel Corporation
- Diego Correas-Serrano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20240266745
- Publication date Aug 8, 2024
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240258296
- Publication date Aug 1, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS
- Publication number 20240063136
- Publication date Feb 22, 2024
- Intel Corporation
- Haris Khan Niazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240030098
- Publication date Jan 25, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSCEIVER AND WAVEGUIDE LAUNCHER ARRAY
- Publication number 20240006735
- Publication date Jan 4, 2024
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE CIRCUIT ON A BACK-END-OF-LINE OF A PACKAGE
- Publication number 20240006347
- Publication date Jan 4, 2024
- Intel Corporation
- Qiang YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20230344131
- Publication date Oct 26, 2023
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
- Publication number 20230320021
- Publication date Oct 5, 2023
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRECISION SCALABLE PACKAGING ARCHITECTURE BASED ON RADIO FREQU...
- Publication number 20230307846
- Publication date Sep 28, 2023
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20230246338
- Publication date Aug 3, 2023
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
- Publication number 20230207407
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
- Publication number 20230207492
- Publication date Jun 29, 2023
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...
- Publication number 20230207408
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
- Publication number 20230208010
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
- Publication number 20230207404
- Publication date Jun 29, 2023
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...
- Publication number 20230208009
- Publication date Jun 29, 2023
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
- Publication number 20230198058
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS

Georgios C. Dogiamis

Person

Patents Grantslast 30 patents

Package substrate with glass core having vertical power planes for...

Magnetic planar spiral and high aspect ratio inductors for power de...

Microelectronic assemblies having a hybrid bonded interposer for di...

Waveguide interconnect bridges

Liquid cooled interposer for integrated circuit stack

Waveguide interconnects for semiconductor packages and related methods

Thermal management in integrated circuit packages

Components for millimeter-wave communication

Modular microchannel thermal solutions for integrated circuit devices

Methods for conductively coating millimeter waveguides

High-throughput additively manufactured power delivery vias and traces

Components for millimeter-wave communication

Microelectronic devices designed with mold patterning to create pac...

Multi-filter die

Platforms including microelectronic packages therein coupled to a c...

Millimeter-wave dielectric waveguide bundle including first and sec...

Millimeter-wave dielectric waveguide including an opening of varyin...

Microelectronic support for millimeter-wave communication including...

Dispersive waveguide crosstalk mitigation

Power delivery structures

Integrated radio frequency (RF) front-end module (FEM)

Magnetic induced heating for solder interconnects

Components for millimeter-wave communication

Thermal management in integrated circuit packages

Physically unclonable function circuitry of a package substrate and...

Microelectronic assemblies

Components for millimeter-wave communication

Dispersion compensation for electromagnetic waveguides

Additive manufacturing for integrated circuit assembly cables

Additive manufacturing for integrated circuit assembly connectors

Patents Applicationslast 30 patents

CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

ANALOG-TO-DIGITAL CONVERTERS AND METHODS FOR SETTLING OF THE REFERE...

STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS

AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...

ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...

MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SEC...

POWER DELIVERY STRUCTURES

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

MICROELECTRONIC ASSEMBLIES

INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS

THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES

STACKED TRANSCEIVER AND WAVEGUIDE LAUNCHER ARRAY

PASSIVE CIRCUIT ON A BACK-END-OF-LINE OF A PACKAGE

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...

HIGH PRECISION SCALABLE PACKAGING ARCHITECTURE BASED ON RADIO FREQU...

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES

COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...

SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...

3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES

COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS

WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...

EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES