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Georgios C. Dogiamis
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Components for millimeter-wave communication
Patent number
11,955,684
Issue date
Apr 9, 2024
Intel Corporation
Diego Correas-Serrano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dispersion compensation for electromagnetic waveguides
Patent number
11,916,604
Issue date
Feb 27, 2024
Intel Corporation
Diego Correas-Serrano
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Additive manufacturing for integrated circuit assembly cables
Patent number
11,895,815
Issue date
Feb 6, 2024
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Additive manufacturing for integrated circuit assembly connectors
Patent number
11,887,944
Issue date
Jan 30, 2024
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Additive manufacturing for integrated circuit assembly connector su...
Patent number
11,842,826
Issue date
Dec 12, 2023
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a modular side radiating waveguide...
Patent number
11,830,831
Issue date
Nov 28, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,830,787
Issue date
Nov 28, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management in integrated circuit packages
Patent number
11,784,108
Issue date
Oct 10, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit including a dielectric waveguide with a cavity t...
Patent number
11,764,452
Issue date
Sep 19, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waveguide fan-out
Patent number
11,728,290
Issue date
Aug 15, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating multiplexed hollow waveguides of variable ty...
Patent number
11,721,650
Issue date
Aug 8, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Platforms including microelectronic packages therein coupled to a c...
Patent number
11,716,826
Issue date
Aug 1, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dielectric waveguide channel for interconnecting dies in a semicond...
Patent number
11,715,693
Issue date
Aug 1, 2023
Intel Corporation
Georgios Dogiamis
G02 - OPTICS
Information
Patent Grant
Microelectronic package with mold-integrated components
Patent number
11,694,962
Issue date
Jul 4, 2023
Intel Corporation
Georgios Dogiamis
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bridge for radio frequency (RF) multi-chip modules
Patent number
11,688,660
Issue date
Jun 27, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices designed with mold patterning to create pac...
Patent number
11,658,418
Issue date
May 23, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies with substrate integrated waveguide
Patent number
11,652,264
Issue date
May 16, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with substrate-integrated components
Patent number
11,641,711
Issue date
May 2, 2023
Intel Corporation
Georgios Dogiamis
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inorganic dies with organic interconnect layers and related structures
Patent number
11,621,192
Issue date
Apr 4, 2023
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with radio frequency (RF) chiplet
Patent number
11,605,603
Issue date
Mar 14, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mmwave dielectric waveguide interconnect topology for automotive ap...
Patent number
11,594,801
Issue date
Feb 28, 2023
Intel Corporation
Georgios Dogiamis
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Contactless high-frequency interconnect
Patent number
11,581,272
Issue date
Feb 14, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-weight single mm-wave dielectric waveguide interconnect archite...
Patent number
11,575,749
Issue date
Feb 7, 2023
Intel Corporation
Georgios C. Dogiamis
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Waveguide interconnect bridges
Patent number
11,538,758
Issue date
Dec 27, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate waveguide
Patent number
11,532,574
Issue date
Dec 20, 2022
Intel Coropration
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mmwave waveguide to waveguide connectors for automotive applications
Patent number
11,476,554
Issue date
Oct 18, 2022
Intel Corporation
Georgios Dogiamis
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Multiplexer and combiner structures embedded in a mmwave connector...
Patent number
11,462,810
Issue date
Oct 4, 2022
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF front end module including hybrid filter and active circuits in...
Patent number
11,456,721
Issue date
Sep 27, 2022
Intel Corporation
Feras Eid
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Package with side-radiating wave launcher and waveguide
Patent number
11,437,706
Issue date
Sep 6, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mmwave waveguides featuring power-over-waveguide technology for aut...
Patent number
11,437,693
Issue date
Sep 6, 2022
Intel Corporation
Georgios C. Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS
Publication number
20240063136
Publication date
Feb 22, 2024
Intel Corporation
Haris Khan Niazi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
Publication number
20240030098
Publication date
Jan 25, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED TRANSCEIVER AND WAVEGUIDE LAUNCHER ARRAY
Publication number
20240006735
Publication date
Jan 4, 2024
Intel Corporation
Georgios C. DOGIAMIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE CIRCUIT ON A BACK-END-OF-LINE OF A PACKAGE
Publication number
20240006347
Publication date
Jan 4, 2024
Intel Corporation
Qiang YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
Publication number
20230344131
Publication date
Oct 26, 2023
Intel Corporation
Feras EID
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATFORMS INCLUDING MICROELECTRONIC PACKAGES THEREIN COUPLED TO A C...
Publication number
20230320021
Publication date
Oct 5, 2023
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH PRECISION SCALABLE PACKAGING ARCHITECTURE BASED ON RADIO FREQU...
Publication number
20230307846
Publication date
Sep 28, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
Publication number
20230246338
Publication date
Aug 3, 2023
Intel Corporation
Feras EID
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
Publication number
20230207407
Publication date
Jun 29, 2023
Intel Corporation
Georgios C. DOGIAMIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
Publication number
20230208010
Publication date
Jun 29, 2023
Intel Corporation
Georgios C. DOGIAMIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...
Publication number
20230207408
Publication date
Jun 29, 2023
Intel Corporation
Georgios C. DOGIAMIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
Publication number
20230207492
Publication date
Jun 29, 2023
Aleksandar ALEKSOV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
Publication number
20230207404
Publication date
Jun 29, 2023
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...
Publication number
20230208009
Publication date
Jun 29, 2023
Neelam PRABHU GAUNKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
Publication number
20230198058
Publication date
Jun 22, 2023
Intel Corporation
Veronica Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...
Publication number
20230197592
Publication date
Jun 22, 2023
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...
Publication number
20230197620
Publication date
Jun 22, 2023
Intel Corporation
Veronica Strong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS VIAS AND PLANES WITH REDUCED TAPERING
Publication number
20230197541
Publication date
Jun 22, 2023
Intel Corporation
Veronica STRONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...
Publication number
20230197646
Publication date
Jun 22, 2023
Intel Corporation
Aleksandar ALEKSOV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH INTEGRATED CIRCUIT DIES OVER INPUT/OUTP...
Publication number
20230197675
Publication date
Jun 22, 2023
Intel Corporation
Gerald S. Pasdast
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES
Publication number
20230187371
Publication date
Jun 15, 2023
Intel Corporation
Rachael J. Parker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS
Publication number
20230178513
Publication date
Jun 8, 2023
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY THROUGH CAPACITOR-DIES IN A MULTI-LAYERED MICROELECT...
Publication number
20230163098
Publication date
May 25, 2023
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURES FOR SUB-TERAHERTZ RADIO FREQUENCY DEVICES
Publication number
20230144206
Publication date
May 11, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAVEGUIDE INTERCONNECT BRIDGES
Publication number
20230088545
Publication date
Mar 23, 2023
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE
Publication number
20220416391
Publication date
Dec 29, 2022
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAVEGUIDE INTERCONNECTS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20220416393
Publication date
Dec 29, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTOR AND TRANSFORMER SEMICONDUCTOR DEVICES USING HYBRID BONDING...
Publication number
20220415555
Publication date
Dec 29, 2022
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD TO INTEGRATE THREE-DIMENSIONAL PASSIVE COMPONE...
Publication number
20220415854
Publication date
Dec 29, 2022
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY
Publication number
20220415779
Publication date
Dec 29, 2022
Intel Corporation
Georgios C. DOGIAMIS
H01 - BASIC ELECTRIC ELEMENTS