Gerald Weidinger

Person

Leoben, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with cavity accommodating at least part of driven...
- Patent number 12,112,888
- Issue date Oct 8, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor made of component carrier material comprising electrically...
- Patent number 12,002,614
- Issue date Jun 4, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising embedded magnet stack
- Patent number 11,889,629
- Issue date Jan 30, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded magnetic inlay and integrated coil...
- Patent number 11,792,932
- Issue date Oct 17, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with dielectric layer for embedding in component carrier
- Patent number 11,749,613
- Issue date Sep 5, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,749,573
- Issue date Sep 5, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 11,523,520
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component with dielectric layer for embedding in component carrier
- Patent number 11,171,092
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,049,778
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-uniform magnetic foil embedded in component carrier
- Patent number 10,993,313
- Issue date Apr 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising at least one heat pipe and method for...
- Patent number 10,867,888
- Issue date Dec 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Inductor made of component carrier material comprising electrically...
- Patent number 10,861,636
- Issue date Dec 8, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Placement of component in circuit board intermediate product by flo...
- Patent number 10,709,023
- Issue date Jul 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising at least one heat pipe and method for...
- Patent number 10,665,526
- Issue date May 26, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for producing a printed circuit board with an embedded senso...
- Patent number 10,455,703
- Issue date Oct 22, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing a circuit board
- Patent number 10,306,750
- Issue date May 28, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 10,187,997
- Issue date Jan 22, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the production of a circuit board involving the removal...
- Patent number 10,051,747
- Issue date Aug 14, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having an asymmetric layer structure
- Patent number 9,967,972
- Issue date May 8, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 9,253,888
- Issue date Feb 2, 2016
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method for producing a multilayer printed circuit board, adhesion p...
- Patent number 8,685,196
- Issue date Apr 1, 2014
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing a part of a planar material layer and multilaye...
- Patent number 8,541,689
- Issue date Sep 24, 2013
- AT & S Austria Technologie & Systemtecknik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nonstick material, method for removing a part of a planar material...
- Patent number 8,388,792
- Issue date Mar 5, 2013
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component With Dielectric Layer for Embedding in Component Carrier
- Publication number 20230369235
- Publication date Nov 16, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Magnetic Inlay and Integrated Coil...
- Publication number 20230298804
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductor Inlay for a Component Carrier and a Method of Manufacturin...
- Publication number 20230298808
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20230189448
- Publication date Jun 15, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Magnetic Element, Magnetic Inlay, and Manufa...
- Publication number 20220377917
- Publication date Nov 24, 2022
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnetic Inlay With An Adjustable Inductance Value for a Component...
- Publication number 20220377895
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIDINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Cavity Accommodating at Least Part of Driven...
- Publication number 20220254554
- Publication date Aug 11, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Stepped Cavity and a Stepped Component Ass...
- Publication number 20210280479
- Publication date Sep 9, 2021
- AT&S Austria Technology & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substantially Annular Magnetic Member With Magnetic Particles in No...
- Publication number 20210241952
- Publication date Aug 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Magnetic Inlay and Integrated Coil...
- Publication number 20210195749
- Publication date Jun 24, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inductor Made of Component Carrier Material Comprising Electrically...
- Publication number 20210050141
- Publication date Feb 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising Embedded Magnet Stack
- Publication number 20200359503
- Publication date Nov 12, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising at Least One Heat Pipe and Method for...
- Publication number 20200243417
- Publication date Jul 30, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPONENT WITH DIELECTRIC LAYER FOR EMBEDDING IN COMPONENT CARRIER
- Publication number 20200083173
- Publication date Mar 12, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Stepped Cavity and a Stepped Component Ass...
- Publication number 20190378771
- Publication date Dec 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20190082543
- Publication date Mar 14, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Uniform Magnetic Foil Embedded in Component Carrier
- Publication number 20190045624
- Publication date Feb 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...
- Publication number 20180257364
- Publication date Sep 13, 2018
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gerald Weidinger
- B32 - LAYERED PRODUCTS
Information Patent Application
Inductor Made of Component Carrier Material Comprising Electrically...
- Publication number 20180182532
- Publication date Jun 28, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier Comprising at Least One Heat Pipe and Method for...
- Publication number 20180096912
- Publication date Apr 5, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SemiFlexible Printed Circuit Board With Embedded Component
- Publication number 20170339783
- Publication date Nov 23, 2017
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Having an Asymmetric Layer Structure
- Publication number 20170339784
- Publication date Nov 23, 2017
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Placement of Component in Circuit Board Intermediate Product by Flo...
- Publication number 20170181293
- Publication date Jun 22, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20170048984
- Publication date Feb 16, 2017
- AT&S Austia Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED SENSO...
- Publication number 20170020001
- Publication date Jan 19, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIDINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for the Production of a Circuit Board Involving the Removal...
- Publication number 20140373350
- Publication date Dec 25, 2014
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the Production of a Circuit Board involving the Removal...
- Publication number 20140331494
- Publication date Nov 13, 2014
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...
- Publication number 20140216795
- Publication date Aug 7, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20140000941
- Publication date Jan 2, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS

Gerald Weidinger

Person

Patents Grantslast 30 patents

Printed circuit board having embedded component

Component carrier with cavity accommodating at least part of driven...

Inductor made of component carrier material comprising electrically...

Component carrier comprising embedded magnet stack

Component carrier with embedded magnetic inlay and integrated coil...

Component with dielectric layer for embedding in component carrier

Component carrier with a stepped cavity and a stepped component ass...

Method for making contact with a component embedded in a printed ci...

Component with dielectric layer for embedding in component carrier

Component carrier with a stepped cavity and a stepped component ass...

Non-uniform magnetic foil embedded in component carrier

Component carrier comprising at least one heat pipe and method for...

Inductor made of component carrier material comprising electrically...

Placement of component in circuit board intermediate product by flo...

Component carrier comprising at least one heat pipe and method for...

Method for producing a printed circuit board with an embedded senso...

Circuit board and method for manufacturing a circuit board

Method for making contact with a component embedded in a printed ci...

Method for the production of a circuit board involving the removal...

Circuit board having an asymmetric layer structure

Method for integrating an electronic component into a printed circu...

Method for producing a multilayer printed circuit board, adhesion p...

Method for removing a part of a planar material layer and multilaye...

Nonstick material, method for removing a part of a planar material...

Patents Applicationslast 30 patents

Electronic Package Comprising a Decoupling Layer Structure

Component With Dielectric Layer for Embedding in Component Carrier

Component Carrier With Embedded Magnetic Inlay and Integrated Coil...

Inductor Inlay for a Component Carrier and a Method of Manufacturin...

Method for Making Contact with a Component Embedded in a Printed Ci...

Component Carrier With Magnetic Element, Magnetic Inlay, and Manufa...

Magnetic Inlay With An Adjustable Inductance Value for a Component...

Component Carrier With Cavity Accommodating at Least Part of Driven...

Component Carrier With a Stepped Cavity and a Stepped Component Ass...

Substantially Annular Magnetic Member With Magnetic Particles in No...

Component Carrier With Embedded Magnetic Inlay and Integrated Coil...

Inductor Made of Component Carrier Material Comprising Electrically...

Component Carrier Comprising Embedded Magnet Stack

Component Carrier Comprising at Least One Heat Pipe and Method for...

COMPONENT WITH DIELECTRIC LAYER FOR EMBEDDING IN COMPONENT CARRIER

Component Carrier With a Stepped Cavity and a Stepped Component Ass...

Method for Making Contact with a Component Embedded in a Printed Ci...

Non-Uniform Magnetic Foil Embedded in Component Carrier

USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...

Inductor Made of Component Carrier Material Comprising Electrically...

Component Carrier Comprising at Least One Heat Pipe and Method for...

SemiFlexible Printed Circuit Board With Embedded Component

Circuit Board Having an Asymmetric Layer Structure

Placement of Component in Circuit Board Intermediate Product by Flo...

Method for Making Contact with a Component Embedded in a Printed Ci...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED SENSO...

Method for the Production of a Circuit Board Involving the Removal...

Method for the Production of a Circuit Board involving the Removal...

METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...