Gerhard H. Ruehle

Person

Sindelfingen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 8,929,086
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for structural enhancement of compression system board conne...
- Patent number 7,930,820
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 7,543,373
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for using gel package structure enhancing thermal dissipatio...
- Patent number 7,344,919
- Issue date Mar 18, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable housing for mounting pin grid array
- Patent number 6,669,488
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Dierk Kaller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact assembly, connector assembly utilizing same, and electronic...
- Patent number 6,644,983
- Issue date Nov 11, 2003
- International Business Machines Corporation
- Willi Recktenwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of interconnecting with a system board
- Patent number 6,605,953
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method of interconnecting with a system board
- Patent number 6,549,024
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for enhancing a system board
- Patent number 6,538,460
- Issue date Mar 25, 2003
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Application and test methodology for use with compression land grid...
- Patent number 6,529,023
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Wiren D. Becker
- G01 - MEASURING TESTING
Information Patent Grant
System interface assembly and method
- Patent number 6,462,573
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus of interconnecting with a system board
- Patent number 6,433,562
- Issue date Aug 13, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus of interconnecting with a system board
- Patent number 6,429,644
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Grant
Probing systems for chilled environment
- Patent number 6,342,788
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Michael Ford McAllister
- G01 - MEASURING TESTING
Information Patent Grant
High frequency probe
- Patent number 6,252,391
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Multi-Chip Module (MCM) of a Computer System
- Publication number 20080089024
- Publication date Apr 17, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069358
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070072450
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069754
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070072344
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069753
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus of interconnecting with a system board
- Publication number 20020186002
- Publication date Dec 12, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus of interconnecting with a system board
- Publication number 20020180422
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Michael F. McAllister
- G01 - MEASURING TESTING
Information Patent Application
APPLICATION AND TEST METHODOLOGY FOR USE WITH COMPRESSION LAND GRID...
- Publication number 20020171442
- Publication date Nov 21, 2002
- Wiren D. Becker
- G01 - MEASURING TESTING
Information Patent Application
Contact assembly, connector assembly utilizing same, and electronic...
- Publication number 20020111080
- Publication date Aug 15, 2002
- International Business Machines Corporation
- Willi Recktenwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable housing for mounting pin grid array
- Publication number 20020071257
- Publication date Jun 13, 2002
- International Business Machines Corporation
- Dierk Kaller
- H01 - BASIC ELECTRIC ELEMENTS

Gerhard H. Ruehle

Person

Patents Grantslast 30 patents

Gel package structural enhancement of compression system board conn...

Method for structural enhancement of compression system board conne...

Gel package structural enhancement of compression system board conn...

Method for using gel package structure enhancing thermal dissipatio...

Removable housing for mounting pin grid array

Contact assembly, connector assembly utilizing same, and electronic...

Method and apparatus of interconnecting with a system board

Method of interconnecting with a system board

Method and apparatus for enhancing a system board

Application and test methodology for use with compression land grid...

System interface assembly and method

Method and apparatus of interconnecting with a system board

Method and apparatus of interconnecting with a system board

Probing systems for chilled environment

High frequency probe

Patents Applicationslast 30 patents

Multi-Chip Module (MCM) of a Computer System

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Method and apparatus of interconnecting with a system board

Method and apparatus of interconnecting with a system board

APPLICATION AND TEST METHODOLOGY FOR USE WITH COMPRESSION LAND GRID...

Contact assembly, connector assembly utilizing same, and electronic...

Removable housing for mounting pin grid array