Ghassem Azdasht

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Solder ball feeding device
- Patent number 11,618,094
- Issue date Apr 4, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and laser arrangement for fusing a solder material deposit b...
- Patent number 11,554,434
- Issue date Jan 17, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the separate application of solder material deposits
- Patent number 11,224,928
- Issue date Jan 18, 2022
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the separate application of bonding material deposits
- Patent number 10,695,853
- Issue date Jun 30, 2020
- PAC TECH—PACKAGING TECHNOLOGIES
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for removing a test contact of a test contact arrangement
- Patent number 10,634,699
- Issue date Apr 28, 2020
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a chip module
- Patent number 10,354,971
- Issue date Jul 16, 2019
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for the separate application of connecting material deposits
- Patent number 10,286,470
- Issue date May 14, 2019
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder deposits
- Patent number 10,118,240
- Issue date Nov 6, 2018
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the separate application of solder material deposits
- Patent number 10,081,068
- Issue date Sep 25, 2018
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly and method for manufacturing the same
- Patent number 9,685,423
- Issue date Jun 20, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for electrically contacting terminal faces of two...
- Patent number 9,649,711
- Issue date May 16, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for transferring a chip to a contact substrate
- Patent number 9,401,298
- Issue date Jul 26, 2016
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for contacting, positioning and impinging a solde...
- Patent number 9,327,360
- Issue date May 3, 2016
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test contact arrangement
- Patent number 8,988,094
- Issue date Mar 24, 2015
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- G01 - MEASURING TESTING
Information Patent Grant
Diode array and method for producing a diode array
- Patent number 8,742,571
- Issue date Jun 3, 2014
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for positioning and contacting test contacts
- Patent number 8,480,298
- Issue date Jul 9, 2013
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- G01 - MEASURING TESTING
Information Patent Grant
Method for alternately contacting two wafers
- Patent number 8,361,881
- Issue date Jan 29, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device for receiving and transferring a solder ball arrang...
- Patent number 8,328,068
- Issue date Dec 11, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for removing solder material deposits from a subs...
- Patent number 8,330,076
- Issue date Dec 11, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for drying circuit substrates
- Patent number 8,256,131
- Issue date Sep 4, 2012
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- F26 - DRYING
Information Patent Grant
Device for applying an electronic component
- Patent number 8,205,325
- Issue date Jun 26, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a contact arrangement between a microelectr...
- Patent number 8,087,163
- Issue date Jan 3, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for alternately contacting two wafers
- Patent number 7,932,611
- Issue date Apr 26, 2011
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for transferring a solder deposit configuration
- Patent number 7,926,699
- Issue date Apr 19, 2011
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for mutual contacting of two wafers
- Patent number 7,882,997
- Issue date Feb 8, 2011
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for transferring a solder deposit configuration
- Patent number 7,762,446
- Issue date Jul 27, 2010
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of a soldered joint
- Patent number 7,726,543
- Issue date Jun 1, 2010
- Smart Pac GmbH Technology Services
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying a solder to a substrate
- Patent number 7,717,316
- Issue date May 18, 2010
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the production of a soldered connection
- Patent number 7,360,679
- Issue date Apr 22, 2008
- Smart Pac GmbH Technology Services
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip module and chip card module for producing a chip card
- Patent number 7,106,599
- Issue date Sep 12, 2006
- Smart Pac GmbH Technology Services
- Ghassem Azdasht
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Assembly and Method for Applying Solder Balls to a Substrate
- Publication number 20210379683
- Publication date Dec 9, 2021
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND LASER ARRANGEMENT FOR FUSING A SOLDER MATERIAL DEPOSIT B...
- Publication number 20210220934
- Publication date Jul 22, 2021
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL FEEDING DEVICE
- Publication number 20200269336
- Publication date Aug 27, 2020
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR REMOVING A TEST CONTACT OF A TEST CONTACT ARRANGEMENT
- Publication number 20180259554
- Publication date Sep 13, 2018
- Pac Tech - Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Application
Method for Forming Solder Deposits
- Publication number 20170320155
- Publication date Nov 9, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR THE SEPARATE APPLICATION OF BONDING MATERIAL DEPOSITS
- Publication number 20170165773
- Publication date Jun 15, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL FEEDING DEVICE
- Publication number 20170165772
- Publication date Jun 15, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CHIP MODULE
- Publication number 20170133340
- Publication date May 11, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THE SEPARATE APPLICATION OF SOLDER MATERIAL DEPOSITS
- Publication number 20160354853
- Publication date Dec 8, 2016
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR THE SEPARATE APPLICATION OF SOLDER MATERIAL DEPOSITS
- Publication number 20160279725
- Publication date Sep 29, 2016
- PAC TECK - PACKAGING TECHNOLOGIES GMBH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for the Separate Application of Connecting Material Deposits
- Publication number 20160250704
- Publication date Sep 1, 2016
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Assembly and Method for Manufacturing the Same
- Publication number 20150364446
- Publication date Dec 17, 2015
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for electrically contacting terminal faces of two...
- Publication number 20140027418
- Publication date Jan 30, 2014
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device for Forming Solder Deposits
- Publication number 20130087539
- Publication date Apr 11, 2013
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Diode Array and Method for Producing a Diode Array
- Publication number 20120228772
- Publication date Sep 13, 2012
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Array for Substrate Contacting
- Publication number 20120126410
- Publication date May 24, 2012
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ALTERNATELY CONTACTING TWO WAFERS
- Publication number 20110244651
- Publication date Oct 6, 2011
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for Positioning and Contacting Test Contacts
- Publication number 20110235681
- Publication date Sep 29, 2011
- Ghassem Azdasht
- G01 - MEASURING TESTING
Information Patent Application
TEST CONTACT ARRANGEMENT
- Publication number 20110089963
- Publication date Apr 21, 2011
- Ghassem Azdasht
- G01 - MEASURING TESTING
Information Patent Application
TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANG...
- Publication number 20100213243
- Publication date Aug 26, 2010
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR REMOVING SOLDER MATERIAL DEPOSITS FROM A SUBS...
- Publication number 20100181295
- Publication date Jul 22, 2010
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION
- Publication number 20100051673
- Publication date Mar 4, 2010
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR CONTACTING, POSITIONING AND IMPINGING A SOLDE...
- Publication number 20100051589
- Publication date Mar 4, 2010
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR APPLYING AN ELECTRONIC COMPONENT
- Publication number 20090249620
- Publication date Oct 8, 2009
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT BETWEEN A MICROELECT...
- Publication number 20090032296
- Publication date Feb 5, 2009
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device for Transferring a Solder Deposit Configuration
- Publication number 20080302863
- Publication date Dec 11, 2008
- PAC TECH - PACKAGING TECHNOLOGIES GMBH AND SMART PAC GMBH TECHNOLOGY SERVICES
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device For Drying Circuit Substrates
- Publication number 20080282574
- Publication date Nov 20, 2008
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical System
- Publication number 20080260370
- Publication date Oct 23, 2008
- Elke Zakel
- G02 - OPTICS
Information Patent Application
Method and Device for Transferring a Chip to a Contact Substrate
- Publication number 20080210368
- Publication date Sep 4, 2008
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device For Mutual Contacting of Two Wafers
- Publication number 20080171404
- Publication date Jul 17, 2008
- PAC TECH- PACKAGIN TECHNOLOGIES GMBH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS

Ghassem Azdasht

Person

Patents Grantslast 30 patents

Solder ball feeding device

Method and laser arrangement for fusing a solder material deposit b...

Device for the separate application of solder material deposits

Device for the separate application of bonding material deposits

Device for removing a test contact of a test contact arrangement

Method for producing a chip module

Device for the separate application of connecting material deposits

Method for forming solder deposits

Device for the separate application of solder material deposits

Semiconductor chip assembly and method for manufacturing the same

Method and device for electrically contacting terminal faces of two...

Method and device for transferring a chip to a contact substrate

Method and device for contacting, positioning and impinging a solde...

Test contact arrangement

Diode array and method for producing a diode array

Device for positioning and contacting test contacts

Method for alternately contacting two wafers

Transfer device for receiving and transferring a solder ball arrang...

Method and device for removing solder material deposits from a subs...

Method and device for drying circuit substrates

Device for applying an electronic component

Method of manufacturing a contact arrangement between a microelectr...

Device for alternately contacting two wafers

Method and device for transferring a solder deposit configuration

Method and device for mutual contacting of two wafers

Method and device for transferring a solder deposit configuration

Method for the production of a soldered joint

Method and device for applying a solder to a substrate

Method for the production of a soldered connection

Chip module and chip card module for producing a chip card

Patents Applicationslast 30 patents

Assembly and Method for Applying Solder Balls to a Substrate

METHOD AND LASER ARRANGEMENT FOR FUSING A SOLDER MATERIAL DEPOSIT B...

SOLDER BALL FEEDING DEVICE

DEVICE FOR REMOVING A TEST CONTACT OF A TEST CONTACT ARRANGEMENT

Method for Forming Solder Deposits

DEVICE FOR THE SEPARATE APPLICATION OF BONDING MATERIAL DEPOSITS

SOLDER BALL FEEDING DEVICE

METHOD FOR PRODUCING A CHIP MODULE

DEVICE FOR THE SEPARATE APPLICATION OF SOLDER MATERIAL DEPOSITS

DEVICE FOR THE SEPARATE APPLICATION OF SOLDER MATERIAL DEPOSITS

Device for the Separate Application of Connecting Material Deposits

Semiconductor Chip Assembly and Method for Manufacturing the Same

Method and device for electrically contacting terminal faces of two...

Method and Device for Forming Solder Deposits

Diode Array and Method for Producing a Diode Array

Contact Array for Substrate Contacting

METHOD AND DEVICE FOR ALTERNATELY CONTACTING TWO WAFERS

Device for Positioning and Contacting Test Contacts

TEST CONTACT ARRANGEMENT

TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANG...

METHOD AND DEVICE FOR REMOVING SOLDER MATERIAL DEPOSITS FROM A SUBS...

METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION

METHOD AND DEVICE FOR CONTACTING, POSITIONING AND IMPINGING A SOLDE...

METHOD AND DEVICE FOR APPLYING AN ELECTRONIC COMPONENT

METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT BETWEEN A MICROELECT...

Method and Device for Transferring a Solder Deposit Configuration

Method and Device For Drying Circuit Substrates

Optical System

Method and Device for Transferring a Chip to a Contact Substrate

Method and Device For Mutual Contacting of Two Wafers