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Gina Hoang
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Garden Grove, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Methods to control wafer warpage upon compression molding thereof a...
Patent number
9,865,551
Issue date
Jan 9, 2018
Henkel IP & Holding GmbH
Tadashi Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive for electronic component
Patent number
9,780,068
Issue date
Oct 3, 2017
Henkel AG & Co. KGaA
Sugiura Yoko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive die attach film for large die semiconductor packages and...
Patent number
9,449,938
Issue date
Sep 20, 2016
Henkel IP & Holding GmbH
Pukun Zhu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Pre-cut wafer applied underfill film on dicing tape
Patent number
9,362,105
Issue date
Jun 7, 2016
Henkel IP & Holding GmbH
Gina Hoang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive for electronic component
Patent number
9,305,892
Issue date
Apr 5, 2016
Henkel AG & Co. KGaA
Sugiura Yoko
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Pre-cut wafer applied underfill film
Patent number
9,281,182
Issue date
Mar 8, 2016
Henkel IP & Holding GmbH
YounSang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chain extended epoxy to improve adhesion of conductive die attach film
Patent number
9,200,184
Issue date
Dec 1, 2015
Henkel IP & Holding GmbH
Junbo Gao
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS
Publication number
20210163674
Publication date
Jun 3, 2021
Henkel IP & Holding GmbH
Jay CHAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR ELECTRONIC COMPONENT
Publication number
20160190094
Publication date
Jun 30, 2016
Henkel AG & Co. KGaA
Sugiura Yoko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
Publication number
20160148894
Publication date
May 26, 2016
Henkel IP & Holding GmbH
Pukun Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS TO CONTROL WAFER WARPAGE UPON COMPRESSION MOLDING THEREOF A...
Publication number
20160079187
Publication date
Mar 17, 2016
Henkel IP & Holding GmbH
Tadashi Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR ELECTRONIC COMPONENT
Publication number
20140242757
Publication date
Aug 28, 2014
Henkel IP & Holding GmbH
Sugiura Yoko
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
DICING BEFORE GRINDING AFTER COATING
Publication number
20140057411
Publication date
Feb 27, 2014
HENKEL US IP LLC
Gina Hoang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film
Publication number
20130306916
Publication date
Nov 21, 2013
Henkel Corporation
Junbo Gao
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM
Publication number
20130210239
Publication date
Aug 15, 2013
Henkel Corporation
YounSang Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE
Publication number
20130196472
Publication date
Aug 1, 2013
Henkel Corporation
Gina Hoang
H01 - BASIC ELECTRIC ELEMENTS