Glen E. Roeters

Person

Huntingdon Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacking system and method
- Patent number 7,193,310
- Issue date Mar 20, 2007
- Stuktek Group L.P.
- Glen E Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSP chip stack with flex circuit
- Patent number 7,081,373
- Issue date Jul 25, 2006
- Staktek Group, L.P.
- Glen E Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel stacking of BGA devices to form three-dimensional modules
- Patent number 6,878,571
- Issue date Apr 12, 2005
- Staktek Group L.P.
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin scale outline package
- Patent number 6,856,010
- Issue date Feb 15, 2005
- Staktek Group L.P.
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controllable stretching of thin materials
- Patent number 6,666,810
- Issue date Dec 23, 2003
- Honeywell International Inc.
- Glen Roeters
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Low species buffered rinsing fluids and method
- Patent number 6,652,659
- Issue date Nov 25, 2003
- Honeywell International Inc.
- Glen Roeters
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Post in ring interconnect using for 3-D stacking
- Patent number 6,573,460
- Issue date Jun 3, 2003
- DPAC Technologies Corp.
- Glen E. Roeters
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retaining ring interconnect used for 3-D stacking
- Patent number 6,573,461
- Issue date Jun 3, 2003
- DPAC Technologies Corp.
- Glen E. Roeters
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel stacking of BGA devices to form three-dimensional modules
- Patent number 6,566,746
- Issue date May 20, 2003
- DPAC Technologies, Corp.
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing inherent stress via high temperature annealing
- Patent number 6,489,184
- Issue date Dec 3, 2002
- Honeywell International Inc.
- Richard Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum device for peeling off thin sheets
- Patent number 6,431,623
- Issue date Aug 13, 2002
- Honeywell International Inc.
- Glen Roeters
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Sputtering process
- Patent number 6,261,423
- Issue date Jul 17, 2001
- Honeywell International Inc.
- Richard J. Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering process
- Patent number 6,153,060
- Issue date Nov 28, 2000
- Honeywell International Inc.
- Richard J. Pommer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Stacking system and method
- Publication number 20060261461
- Publication date Nov 23, 2006
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CSP chip stack with flex circuit
- Publication number 20060113678
- Publication date Jun 1, 2006
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless connectivity module
- Publication number 20050048997
- Publication date Mar 3, 2005
- Mike Grobler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low species buffered rinsing fluids and methods
- Publication number 20040152313
- Publication date Aug 5, 2004
- Glen Roeters
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for controllable stretching of thin materials
- Publication number 20040116266
- Publication date Jun 17, 2004
- Glen Roeters
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Thin scale outline package
- Publication number 20040108584
- Publication date Jun 10, 2004
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin scale outline package stack
- Publication number 20040108583
- Publication date Jun 10, 2004
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel stacking of BGA devices to form three-dimensional modules
- Publication number 20030127746
- Publication date Jul 10, 2003
- Harlan R. Isaak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Csp chip stack with flex circuit
- Publication number 20030111736
- Publication date Jun 19, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal ring used in 3-D stacking
- Publication number 20030085455
- Publication date May 8, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST IN RING INTERCONNECT USING FOR 3-D STACKING
- Publication number 20030051906
- Publication date Mar 20, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING INTERCONNECT USED FOR 3-D STACKING
- Publication number 20030051907
- Publication date Mar 20, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retaining ring interconnect used for 3-D stacking
- Publication number 20030051903
- Publication date Mar 20, 2003
- Dense-Pac Microsystems, Inc. a California corporation
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post in ring interconnect using 3-D stacking
- Publication number 20030051911
- Publication date Mar 20, 2003
- Glen E. Roeters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
I/O interface structure
- Publication number 20030002267
- Publication date Jan 2, 2003
- Frank E. Mantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slice interconnect structure
- Publication number 20020190367
- Publication date Dec 19, 2002
- Frank E. Mantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel stacking of BGA devices to form three-dimensional modules
- Publication number 20020053728
- Publication date May 9, 2002
- Harlan R. Isaak
- H01 - BASIC ELECTRIC ELEMENTS

Glen E. Roeters

Person

Patents Grantslast 30 patents

Stacking system and method

CSP chip stack with flex circuit

Panel stacking of BGA devices to form three-dimensional modules

Thin scale outline package

Device for controllable stretching of thin materials

Low species buffered rinsing fluids and method

Post in ring interconnect using for 3-D stacking

Retaining ring interconnect used for 3-D stacking

Panel stacking of BGA devices to form three-dimensional modules

Removing inherent stress via high temperature annealing

Vacuum device for peeling off thin sheets

Sputtering process

Sputtering process

Patents Applicationslast 30 patents

Stacking system and method

CSP chip stack with flex circuit

Wireless connectivity module

Low species buffered rinsing fluids and methods

Device for controllable stretching of thin materials

Thin scale outline package

Thin scale outline package stack

Panel stacking of BGA devices to form three-dimensional modules

Csp chip stack with flex circuit

Thermal ring used in 3-D stacking

POST IN RING INTERCONNECT USING FOR 3-D STACKING

RETAINING RING INTERCONNECT USED FOR 3-D STACKING

Retaining ring interconnect used for 3-D stacking

Post in ring interconnect using 3-D stacking

I/O interface structure

Slice interconnect structure

Panel stacking of BGA devices to form three-dimensional modules