Glenn L. Kehley

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Automatic calibration and built-in diagnostic procedures for line s...
- Patent number 6,809,330
- Issue date Oct 26, 2004
- Lockheed Martin Corporation
- Robert M. Krohn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low maintenance line scan camera
- Patent number 6,534,763
- Issue date Mar 18, 2003
- Lockheed Martin Corporation
- Robert M. Krohn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,256,203
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated, multi-chip, thermally conductive packaging device and m...
- Patent number 6,075,287
- Issue date Jun 13, 2000
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,061,245
- Issue date May 9, 2000
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with heat transfer means
- Patent number 6,037,658
- Issue date Mar 14, 2000
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuitized interposer with apertured member and method fo...
- Patent number 5,984,691
- Issue date Nov 16, 1999
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly for connecting first and second circu...
- Patent number 5,938,454
- Issue date Aug 17, 1999
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated multi-chip circuit package with heat-sink sup...
- Patent number 5,926,369
- Issue date Jul 20, 1999
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for separable interconnecting electronic compo...
- Patent number 5,919,050
- Issue date Jul 6, 1999
- International Business Machines Corporation
- Glenn Lee Kehley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuitized interposer with apertured member and method fo...
- Patent number 5,759,047
- Issue date Jun 2, 1998
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink structure with corrugated wound wire heat conductive elem...
- Patent number 5,673,177
- Issue date Sep 30, 1997
- International Business Machines Corporation
- William Louis Brodsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Automatic calibration and built-in diagnostic procedures for line s...
- Publication number 20040119005
- Publication date Jun 24, 2004
- Lockheed Martin Corporation
- Robert M. Krohn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low maintenance line scan camera
- Publication number 20030034447
- Publication date Feb 20, 2003
- Lockheed Martin Corporation
- Robert M. Krohn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Low maintenance line scan camera
- Publication number 20020130257
- Publication date Sep 19, 2002
- Lockheed Martin Corporation
- Robert M. Krohn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Glenn L. Kehley

Person

Patents Grantslast 30 patents

Automatic calibration and built-in diagnostic procedures for line s...

Low maintenance line scan camera

Free standing, three dimensional, multi-chip, carrier package with...

Integrated, multi-chip, thermally conductive packaging device and m...

Free standing, three dimensional, multi-chip, carrier package with...

Electronic package with heat transfer means

Flexible circuitized interposer with apertured member and method fo...

Electrical connector assembly for connecting first and second circu...

Vertically integrated multi-chip circuit package with heat-sink sup...

Method and apparatus for separable interconnecting electronic compo...

Flexible circuitized interposer with apertured member and method fo...

Heat sink structure with corrugated wound wire heat conductive elem...

Patents Applicationslast 30 patents

Automatic calibration and built-in diagnostic procedures for line s...

Low maintenance line scan camera

Low maintenance line scan camera