Gongda Yao

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,991,157
- Issue date Jun 5, 2018
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,390,970
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform barrier layer and metal seed layer w...
- Patent number 8,158,511
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform metal seed layer over a plurality of...
- Patent number 7,989,343
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer over recessed feature surfa...
- Patent number 7,795,138
- Issue date Sep 14, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal / metal nitride barrier layer for semiconductor device applic...
- Patent number 7,687,909
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a sculptured copper seed layer
- Patent number 7,589,016
- Issue date Sep 15, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,381,639
- Issue date Jun 3, 2008
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a tantalum nitride/tantalum diffusion barrier...
- Patent number 7,253,109
- Issue date Aug 7, 2007
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,074,714
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of a barrier layer on a dielectric material
- Patent number 6,939,801
- Issue date Sep 6, 2005
- Applied Materials, Inc.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preventing diffusion of copper through a tantalum-compris...
- Patent number 6,919,275
- Issue date Jul 19, 2005
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning substrates
- Patent number 6,908,865
- Issue date Jun 21, 2005
- Applied Materials, Inc.
- Martin Kranz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Damage-free sculptured coating deposition
- Patent number 6,758,947
- Issue date Jul 6, 2004
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner materials
- Patent number 6,528,180
- Issue date Mar 4, 2003
- Applied Materials, Inc.
- Wei Ti Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for enhancing sidewall coverage during sputter...
- Patent number 6,451,179
- Issue date Sep 17, 2002
- Applied Materials, Inc.
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tailoring of a wetting/barrier layer to reduce electromigration in...
- Patent number 6,383,915
- Issue date May 7, 2002
- Applied Materials, Inc.
- Jingang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier applications for aluminum planarization
- Patent number 6,368,880
- Issue date Apr 9, 2002
- Applied Materials, Inc.
- Shri Singhvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing the first wafer effect
- Patent number 6,303,994
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow chamber and process
- Patent number 6,299,689
- Issue date Oct 9, 2001
- Applied Materials, Inc.
- Hougong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter deposited barrier layers
- Patent number 6,271,592
- Issue date Aug 7, 2001
- Applied Materials, Inc.
- Edwin Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated PVD system for aluminum hole filling using ionized metal...
- Patent number 6,238,533
- Issue date May 29, 2001
- Applied Materials, Inc.
- Peter Satitpunwaycha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon-doped titanium wetting layer for aluminum plug
- Patent number 6,232,665
- Issue date May 15, 2001
- Applied Materials, Inc.
- Gongda Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier applications for aluminum planarization
- Patent number 6,207,558
- Issue date Mar 27, 2001
- Applied Materials, Inc.
- Shri Singhvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing the first wafer effect
- Patent number 6,139,698
- Issue date Oct 31, 2000
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming titanium silicide in situ
- Patent number 6,110,821
- Issue date Aug 29, 2000
- Applied Materials, Inc.
- Gene Y. Kohara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Central coil design for ionized metal plasma deposition
- Patent number 6,077,402
- Issue date Jun 20, 2000
- Applied Materials, Inc.
- Liubo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow chamber and process
- Patent number 6,077,404
- Issue date Jun 20, 2000
- Applied Material, Inc.
- Hougong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aluminum hole filling method using ionized metal adhesion layer
- Patent number 6,045,666
- Issue date Apr 4, 2000
- Applied Materials, Inc.
- Peter Satitpunwaycha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxygen enhancement of ion metal plasma (IMP) sputter deposited barr...
- Patent number 5,985,759
- Issue date Nov 16, 1999
- Applied Materials, Inc.
- Edwin Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...
- Publication number 20160322255
- Publication date Nov 3, 2016
- Applied Materials, Inc.
- Tony CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing a uniform barrier layer and metal seed layer w...
- Publication number 20110256716
- Publication date Oct 20, 2011
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a uniform metal seed layer over a plurality of...
- Publication number 20100255678
- Publication date Oct 7, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer over recessed feature surfa...
- Publication number 20090269922
- Publication date Oct 29, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer which provides an im...
- Publication number 20090053888
- Publication date Feb 26, 2009
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a sculptured copper seed layer
- Publication number 20080166869
- Publication date Jul 10, 2008
- APPLIED MATERIALS, INC.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal / metal nitride barrier layer for semiconductor device applic...
- Publication number 20070241458
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damage-free sculptured coating deposition
- Publication number 20070178682
- Publication date Aug 2, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20070020922
- Publication date Jan 25, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low resistivity barrier layers for copper inte...
- Publication number 20050272254
- Publication date Dec 8, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a tantalum nitride / tantalum diffusion barrie...
- Publication number 20050208767
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20050085068
- Publication date Apr 21, 2005
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer and a metal conducti...
- Publication number 20050020080
- Publication date Jan 27, 2005
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of preventing diffusion of copper through a tantalum-compris...
- Publication number 20040171250
- Publication date Sep 2, 2004
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective deposition of a barrier layer on a dielectric material
- Publication number 20030224578
- Publication date Dec 4, 2003
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and method for improving throughput in a cluster tool for...
- Publication number 20030131458
- Publication date Jul 17, 2003
- APPLIED MATERIALS, INC.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cleaning substrates
- Publication number 20030062333
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- Martin Kranz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated barrier layer structure for copper contact level metalli...
- Publication number 20020192948
- Publication date Dec 19, 2002
- APPLIED MATERIALS, INC.
- Fusen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of obtaining low temperature alpha-ta thin films using wafer...
- Publication number 20020142589
- Publication date Oct 3, 2002
- APPLIED MATERIALS, INC.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damage-free sculptured coating deposition
- Publication number 20020029958
- Publication date Mar 14, 2002
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Barrier applications for aluminum planarization
- Publication number 20010005629
- Publication date Jun 28, 2001
- Applied Materials Inc.
- Shri Singhvi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for depositing a diffusion barrier layer and a metal conduct...

Method for depositing a diffusion barrier layer and a metal conduct...

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Method of depositing a metal seed layer over recessed feature surfa...

Metal / metal nitride barrier layer for semiconductor device applic...

Method of depositing a sculptured copper seed layer

Method of depositing a metal seed layer on semiconductor substrates

Method of depositing a tantalum nitride/tantalum diffusion barrier...

Method of depositing a metal seed layer on semiconductor substrates

Selective deposition of a barrier layer on a dielectric material

Method of preventing diffusion of copper through a tantalum-compris...

Method and apparatus for cleaning substrates

Damage-free sculptured coating deposition

Liner materials

Method and apparatus for enhancing sidewall coverage during sputter...

Tailoring of a wetting/barrier layer to reduce electromigration in...

Barrier applications for aluminum planarization

Method and apparatus for reducing the first wafer effect

Reflow chamber and process

Sputter deposited barrier layers

Integrated PVD system for aluminum hole filling using ionized metal...

Silicon-doped titanium wetting layer for aluminum plug

Barrier applications for aluminum planarization

Method and apparatus for reducing the first wafer effect

Method for forming titanium silicide in situ

Central coil design for ionized metal plasma deposition

Reflow chamber and process

Aluminum hole filling method using ionized metal adhesion layer

Oxygen enhancement of ion metal plasma (IMP) sputter deposited barr...

Patents Applicationslast 30 patents

METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Method of depositing a metal seed layer over recessed feature surfa...

Method of depositing a diffusion barrier layer which provides an im...

Method of depositing a sculptured copper seed layer

Metal / metal nitride barrier layer for semiconductor device applic...

Damage-free sculptured coating deposition

Method of depositing a metal seed layer on semiconductor substrates

Method of depositing low resistivity barrier layers for copper inte...

Method of depositing a tantalum nitride / tantalum diffusion barrie...

Method of depositing a metal seed layer on semiconductor substrates

Method of depositing a diffusion barrier layer and a metal conducti...

Method of preventing diffusion of copper through a tantalum-compris...

Selective deposition of a barrier layer on a dielectric material

Apparatus and method for improving throughput in a cluster tool for...

Method and apparatus for cleaning substrates

Integrated barrier layer structure for copper contact level metalli...

Method of obtaining low temperature alpha-ta thin films using wafer...

Damage-free sculptured coating deposition

Barrier applications for aluminum planarization