Gordon M. GRIVNA

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic semiconductor device assemblies
- Patent number 12,183,785
- Issue date Dec 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Peter Moens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with dissimlar materials and methods
- Patent number 12,132,086
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing residual contamination in singulated semiconduct...
- Patent number 12,100,622
- Issue date Sep 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for source-down vertical semiconductor device
- Patent number 12,094,967
- Issue date Sep 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a polymer support...
- Patent number 11,978,671
- Issue date May 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,881,398
- Issue date Jan 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with dissimlar materials and methods
- Patent number 11,810,954
- Issue date Nov 7, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing residual contamination in singulated semiconduct...
- Patent number 11,784,093
- Issue date Oct 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic semiconductor device assemblies
- Patent number 11,742,381
- Issue date Aug 29, 2023
- Semiconductor Components Industries, LLC
- Peter Moens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacture for trench-gate insulated-gate bipolar trans...
- Patent number 11,670,706
- Issue date Jun 6, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Meng-Chia Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with dissimlar materials and methods
- Patent number 11,563,091
- Issue date Jan 24, 2023
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 11,488,865
- Issue date Nov 1, 2022
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for source-down vertical semiconductor device
- Patent number 11,380,788
- Issue date Jul 5, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a polymer support...
- Patent number 11,367,657
- Issue date Jun 21, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for supporting ultra-thin semicondu...
- Patent number 11,355,341
- Issue date Jun 7, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having multi-thickness gate insulator
- Patent number 11,257,916
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a fuse and a transistor coupled to t...
- Patent number 11,088,072
- Issue date Aug 10, 2021
- Semiconductor Components Industries, LLC
- Jefferson W. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gate insulated-gate bipolar transistors
- Patent number 11,056,581
- Issue date Jul 6, 2021
- Semiconductor Components Industries, LLC
- Mingjiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 11,043,420
- Issue date Jun 22, 2021
- Semiconductor Components Industries, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 10,950,503
- Issue date Mar 16, 2021
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing residual contamination in singulated semiconduct...
- Patent number 10,916,474
- Issue date Feb 9, 2021
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating a back layer on a substrate using exposure to...
- Patent number 10,854,516
- Issue date Dec 1, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including an insulating structure
- Patent number 10,833,154
- Issue date Nov 10, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method including a conductive member withi...
- Patent number 10,804,296
- Issue date Oct 13, 2020
- Semiconductor Components Industries, LLC
- Jefferson W. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 10,796,961
- Issue date Oct 6, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a die comprising a high electron mobil...
- Patent number 10,784,140
- Issue date Sep 22, 2020
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating a back layer on a singulated semiconductor waf...
- Patent number 10,770,350
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,741,447
- Issue date Aug 11, 2020
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gate insulated-gate bipolar transistors (IGBTs)
- Patent number 10,727,326
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Meng-Chia Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20240395925
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER
- Publication number 20240243014
- Publication date Jul 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE
- Publication number 20240055298
- Publication date Feb 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JeongPyo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS
- Publication number 20240030293
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCT...
- Publication number 20230402325
- Publication date Dec 14, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...
- Publication number 20230352518
- Publication date Nov 2, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Rick Carlton JEROME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20230352525
- Publication date Nov 2, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Peter MOENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED GATE TRENCH POWER MOSFET WITH HIGH-K SHIELD DIELECTRIC
- Publication number 20230253468
- Publication date Aug 10, 2023
- Semiconductor Components Industries, LLC
- Zia HOSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS
- Publication number 20230095014
- Publication date Mar 30, 2023
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230020438
- Publication date Jan 19, 2023
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20220293781
- Publication date Sep 15, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT...
- Publication number 20220277999
- Publication date Sep 1, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...
- Publication number 20220271118
- Publication date Aug 25, 2022
- Semiconductor Components Industries, LLC
- Rick Carlton JEROME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...
- Publication number 20220262633
- Publication date Aug 18, 2022
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS
- Publication number 20220093745
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220020848
- Publication date Jan 20, 2022
- Semiconductor Components Industries, LLC
- Peter MOENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20210305096
- Publication date Sep 30, 2021
- Semiconductor Components Industries, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20210296482
- Publication date Sep 23, 2021
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT...
- Publication number 20210296176
- Publication date Sep 23, 2021
- Semiconductor Components Industries, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING ELECTRONIC DEVICES HAVING A BACK LAYER AND APP...
- Publication number 20210183705
- Publication date Jun 17, 2021
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCT...
- Publication number 20210118739
- Publication date Apr 22, 2021
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE
- Publication number 20210118734
- Publication date Apr 22, 2021
- Semiconductor Components Industries, LLC
- JeongPyo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Including a Polymer Support Layer and a Process o...
- Publication number 20210035864
- Publication date Feb 4, 2021
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A LEADFRAME OR A DIODE BRIDGE CONFIG...
- Publication number 20200411555
- Publication date Dec 31, 2020
- Semiconductor Components Industries, LLC
- Jefferson W. HALL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH-GATE INSULATED-GATE BIPOLAR TRANSISTORS (IGBTs) AND METHODS...
- Publication number 20200350424
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Meng-Chia LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BACKSIDE OPENINGS FOR AN...
- Publication number 20200321291
- Publication date Oct 8, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAFE OPERATING AREA IMPROVEMENT IN POWER DEVICES AND RELATED METHODS
- Publication number 20200295149
- Publication date Sep 17, 2020
- Semiconductor Components Industries, LLC
- Balaji PADMANABHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...
- Publication number 20200258739
- Publication date Aug 13, 2020
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE...
- Publication number 20200118878
- Publication date Apr 16, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20200105700
- Publication date Apr 2, 2020
- Semiconductor Components Industries, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Gordon M. GRIVNA

Person

Patents Grantslast 30 patents

Method of separating electronic devices having a back layer and app...

Monolithic semiconductor device assemblies

Semiconductor devices with dissimlar materials and methods

Method of reducing residual contamination in singulated semiconduct...

Structures and methods for source-down vertical semiconductor device

Process of forming an electronic device including a polymer support...

Semiconductor device and method for supporting ultra-thin semicondu...

Semiconductor devices with dissimlar materials and methods

Method of reducing residual contamination in singulated semiconduct...

Monolithic semiconductor device assemblies

Methods of manufacture for trench-gate insulated-gate bipolar trans...

Semiconductor devices with dissimlar materials and methods

Method and apparatus for plasma dicing a semi-conductor wafer

Structures and methods for source-down vertical semiconductor device

Process of forming an electronic device including a polymer support...

Semiconductor device and method for supporting ultra-thin semicondu...

Electronic device having multi-thickness gate insulator

Semiconductor device including a fuse and a transistor coupled to t...

Trench-gate insulated-gate bipolar transistors

Fan-out wafer level packaging of semiconductor devices

Method of separating electronic devices having a back layer and app...

Method of reducing residual contamination in singulated semiconduct...

Method of separating a back layer on a substrate using exposure to...

Electronic device including an insulating structure

Semiconductor device and method including a conductive member withi...

Method of separating electronic devices having a back layer and app...

Electronic device comprising a die comprising a high electron mobil...

Method of separating a back layer on a singulated semiconductor waf...

Method and apparatus for plasma dicing a semi-conductor wafer

Trench-gate insulated-gate bipolar transistors (IGBTs)

Patents Applicationslast 30 patents

STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER

PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS

METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCT...

METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...

MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES

SHIELDED GATE TRENCH POWER MOSFET WITH HIGH-K SHIELD DIELECTRIC

SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE

PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT...

METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...

SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...

SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS

MONOLITHIC SEMICONDUCTOR DEVICE ASSEMBLIES

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

STRUCTURES AND METHODS FOR SOURCE-DOWN VERTICAL SEMICONDUCTOR DEVICE

STRUCTURE AND METHOD FOR ELECTRONIC DIE SINGULATION USING ALIGNMENT...

METHOD OF SEPARATING ELECTRONIC DEVICES HAVING A BACK LAYER AND APP...

METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCT...

PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE

Electronic Device Including a Polymer Support Layer and a Process o...

SEMICONDUCTOR DEVICE INCLUDING A LEADFRAME OR A DIODE BRIDGE CONFIG...

TRENCH-GATE INSULATED-GATE BIPOLAR TRANSISTORS (IGBTs) AND METHODS...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BACKSIDE OPENINGS FOR AN...

SAFE OPERATING AREA IMPROVEMENT IN POWER DEVICES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDU...

METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE...

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES