Gorley Lau

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Aluminum-filled via structure with barrier layer
- Patent number 6,977,217
- Issue date Dec 20, 2005
- Cypress Semiconductor Corporation
- Mira Ben-Tzur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metallization structure in an integrated circuit
- Patent number 6,969,448
- Issue date Nov 29, 2005
- Cypress Semiconductor Corp.
- Gorley L. Lau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a low resistivity Ti-containing interconnect and...
- Patent number 6,906,421
- Issue date Jun 14, 2005
- Cypress Semiconductor Corporation
- Ende Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal stack for local interconnect layer
- Patent number 6,774,033
- Issue date Aug 10, 2004
- Cypress Semiconductor Corporation
- Mira Ben-Tzur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature metallization process
- Patent number 6,756,302
- Issue date Jun 29, 2004
- Cypress Semiconductor Corporation
- Ende Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal layer(s) and/or antireflective coating laye...
- Patent number 6,534,398
- Issue date Mar 18, 2003
- Cypress Semiconductor Corp.
- Ende Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming void-free metallization in an integrated circuit
- Patent number 6,455,427
- Issue date Sep 24, 2002
- Cypress Semiconductor Corp.
- Gorley L. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal layer(s) and/or antireflective coating laye...
- Patent number 6,187,667
- Issue date Feb 13, 2001
- Cypress Semiconductor Corp.
- Ende Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature metallization process
- Patent number 6,140,228
- Issue date Oct 31, 2000
- Cypress Semiconductor Corporation
- Ende Shan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming metal layer(s) and/or antireflective coating laye...
- Publication number 20010008793
- Publication date Jul 19, 2001
- CYPRESS SEMICONDUCTOR CORP.
- Ende Shan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Aluminum-filled via structure with barrier layer

Method for forming a metallization structure in an integrated circuit

Method of forming a low resistivity Ti-containing interconnect and...

Metal stack for local interconnect layer

Low temperature metallization process

Method of forming metal layer(s) and/or antireflective coating laye...

Method for forming void-free metallization in an integrated circuit

Method of forming metal layer(s) and/or antireflective coating laye...

Low temperature metallization process

Patents Applicationslast 30 patents

Method of forming metal layer(s) and/or antireflective coating laye...