Xu et al., “Plar Multilevel Metallization Technologies for ULSI Devices,” SPIE vol. 2335, 1994, pp. 70-79. |
Xu et al., “A1 planarization processes for multilayer metallization of quarter micrometer devices,” Thin Solid Films, vol. 253, 1994, pp. 367-371. |
Singer, “The Interconnect Challenge: Filling Small, High Aspect Ratio Contact Holes,” Semiconductor International, Aug. 1994, 5 pages. |
Robinson, “A1 hits sub-0.25 micron vias,” pp. 37 and 42, Electronic Engineering Times, Issue 939, Feb. 1997. |
Metal Deposition Products, Applied Materials-Products and Services, 5 pages, printed Nov. 1999, ©1999 Applied Materials, Inc. |
“Ionized Physical Vapor Deposition,” printed Dec. 1999, www.ece.neu.edu/edsnu/hopwood, 8 pages. |