Greg Dix

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Current sensing for integrated circuit devices
- Patent number 10,753,964
- Issue date Aug 25, 2020
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined source and base contact for a field effect transistor
- Patent number 10,446,497
- Issue date Oct 15, 2019
- Microchip Technology Incorporated
- Dan Grimm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a field-effect transistor (FET) or other semicond...
- Patent number 10,326,013
- Issue date Jun 18, 2019
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor formed on heavily doped substrate
- Patent number 10,217,810
- Issue date Feb 26, 2019
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die ground shield
- Patent number 9,972,578
- Issue date May 15, 2018
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumps bonds formed as metal line interconnects in a semiconductor d...
- Patent number 9,812,380
- Issue date Nov 7, 2017
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power field effect transistor
- Patent number 9,634,135
- Issue date Apr 25, 2017
- Microchip Technology Incorporated
- Greg A. Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for constructing an isolation capacitor in an...
- Patent number 9,337,253
- Issue date May 10, 2016
- Microchip Technology Incorporated
- Gregory Dix
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Using bump bonding to distribute current flow on a semiconductor po...
- Patent number 9,093,433
- Issue date Jul 28, 2015
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage isolation using low value capacitors
- Patent number 8,988,142
- Issue date Mar 24, 2015
- Microchip Technology Incorporated
- Randy Yach
- G05 - CONTROLLING REGULATING
Information Patent Grant
Multiple well drain engineering for HV MOS devices
- Patent number 8,962,397
- Issue date Feb 24, 2015
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOS transistor with improved metal contact
- Patent number 8,937,351
- Issue date Jan 20, 2015
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated bump bonding
- Patent number 8,921,986
- Issue date Dec 30, 2014
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital-to-analog-converter with resistor ladder
- Patent number 8,896,473
- Issue date Nov 25, 2014
- Microchip Technology Incorporated
- Gregory Dix
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Work function based voltage reference
- Patent number 8,193,589
- Issue date Jun 5, 2012
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work function based voltage reference
- Patent number 7,727,833
- Issue date Jun 1, 2010
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature compensated work function based voltage reference
- Patent number 7,675,134
- Issue date Mar 9, 2010
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage ESD-protection structure
- Patent number 7,170,136
- Issue date Jan 30, 2007
- Microchip Technology Incorporated
- Randy L. Yach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage ESD-protection structure
- Patent number 6,987,300
- Issue date Jan 17, 2006
- Microchip Technology Incorporated
- Randy L. Yach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit Arrangement for Switched-Mode Power Conversion with Improve...
- Publication number 20190123654
- Publication date Apr 25, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Trench-Type Field Effect Transistor (Trench FET) With Improved Poly...
- Publication number 20190123196
- Publication date Apr 25, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Current Sensing For Integrated Circuit Devices
- Publication number 20180313874
- Publication date Nov 1, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Field Effect Transistor (FET) or Other Semiconductor Device with Fr...
- Publication number 20180145171
- Publication date May 24, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Field-Effect Transistor (FET) or Other Semicond...
- Publication number 20180145170
- Publication date May 24, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Combined Source And Base Contact For A Field Effect Transistor
- Publication number 20170287835
- Publication date Oct 5, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Dan Grimm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Ground Shield
- Publication number 20170287850
- Publication date Oct 5, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Expose Etch Stop
- Publication number 20170287834
- Publication date Oct 5, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Dan Grimm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor Formed On Heavily Doped Substrate
- Publication number 20170162648
- Publication date Jun 8, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPS BONDS FORMED AS METAL LINE INTERCONNECTS IN A SEMICONDUCTOR D...
- Publication number 20160013121
- Publication date Jan 14, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Bump Bonding
- Publication number 20140264796
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Gate Field Effect Transistor
- Publication number 20140253218
- Publication date Sep 11, 2014
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Constructing an Isolation Capacitor in an...
- Publication number 20140252551
- Publication date Sep 11, 2014
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated High Voltage Isolation Using Low Value Capacitors
- Publication number 20140253227
- Publication date Sep 11, 2014
- Randy Yach
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power MOS Transistor with Improved Metal Contact
- Publication number 20140246722
- Publication date Sep 4, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Digital-to-Analog-Converter with Resistor Ladder
- Publication number 20130314263
- Publication date Nov 28, 2013
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER FIELD EFFECT TRANSISTOR
- Publication number 20130228854
- Publication date Sep 5, 2013
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg A. Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Gate Structure for Field Effect Transistor
- Publication number 20130154017
- Publication date Jun 20, 2013
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WELL DRAIN ENGINEERING FOR HV MOS DEVICES
- Publication number 20130026545
- Publication date Jan 31, 2013
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MOS-FIELD EFFECT TRANSISTOR
- Publication number 20120129305
- Publication date May 24, 2012
- Rohan S. Braithwaite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL DMOS-FIELD EFFECT TRANSISTOR
- Publication number 20120126312
- Publication date May 24, 2012
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MOS-FIELD EFFECT TRANSISTOR
- Publication number 20120126320
- Publication date May 24, 2012
- MICROCHIP TECHNOLOGY INCORPORATED
- Rohan S. Braithwaite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING BUMP BONDING TO DISTRIBUTE CURRENT FLOW ON A SEMICONDUCTOR PO...
- Publication number 20120126406
- Publication date May 24, 2012
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET
- Publication number 20120126313
- Publication date May 24, 2012
- MICROCHIP TECHNOLOGY INCORPORATED
- Rohan S. Braithwaite
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING LOW PRESSURE EPI TO ENABLE LOW RDSON FET
- Publication number 20120126341
- Publication date May 24, 2012
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Work Function Based Voltage Reference
- Publication number 20100164468
- Publication date Jul 1, 2010
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature Compensated Work Function Based Voltage Reference
- Publication number 20090251204
- Publication date Oct 8, 2009
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- G05 - CONTROLLING REGULATING
Information Patent Application
Work Function Based Voltage Reference
- Publication number 20090250766
- Publication date Oct 8, 2009
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage ESD-protection structure
- Publication number 20060017109
- Publication date Jan 26, 2006
- MICROCHIP TECHNOLOGY INCORPORATED
- Randy L. Yach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High voltage ESD-protection structure
- Publication number 20050212052
- Publication date Sep 29, 2005
- MICROCHIP TECHNOLOGY INCORPORATED
- Randy L. Yach
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Current sensing for integrated circuit devices

Combined source and base contact for a field effect transistor

Method of forming a field-effect transistor (FET) or other semicond...

Capacitor formed on heavily doped substrate

Stacked die ground shield

Bumps bonds formed as metal line interconnects in a semiconductor d...

Power field effect transistor

Method and apparatus for constructing an isolation capacitor in an...

Using bump bonding to distribute current flow on a semiconductor po...

Integrated high voltage isolation using low value capacitors

Multiple well drain engineering for HV MOS devices

Power MOS transistor with improved metal contact

Insulated bump bonding

Digital-to-analog-converter with resistor ladder

Work function based voltage reference

Work function based voltage reference

Temperature compensated work function based voltage reference

High voltage ESD-protection structure

High voltage ESD-protection structure

Patents Applicationslast 30 patents

Circuit Arrangement for Switched-Mode Power Conversion with Improve...

Trench-Type Field Effect Transistor (Trench FET) With Improved Poly...

Current Sensing For Integrated Circuit Devices

Field Effect Transistor (FET) or Other Semiconductor Device with Fr...

Method of Forming a Field-Effect Transistor (FET) or Other Semicond...

Combined Source And Base Contact For A Field Effect Transistor

Stacked Die Ground Shield

Contact Expose Etch Stop

Capacitor Formed On Heavily Doped Substrate

BUMPS BONDS FORMED AS METAL LINE INTERCONNECTS IN A SEMICONDUCTOR D...

Insulated Bump Bonding

Multi-Gate Field Effect Transistor

Method and Apparatus for Constructing an Isolation Capacitor in an...

Integrated High Voltage Isolation Using Low Value Capacitors

Power MOS Transistor with Improved Metal Contact

Digital-to-Analog-Converter with Resistor Ladder

POWER FIELD EFFECT TRANSISTOR

Self-Aligned Gate Structure for Field Effect Transistor

MULTIPLE WELL DRAIN ENGINEERING FOR HV MOS DEVICES

METHOD FOR MANUFACTURING A MOS-FIELD EFFECT TRANSISTOR

VERTICAL DMOS-FIELD EFFECT TRANSISTOR

METHOD FOR MANUFACTURING A MOS-FIELD EFFECT TRANSISTOR

USING BUMP BONDING TO DISTRIBUTE CURRENT FLOW ON A SEMICONDUCTOR PO...

ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

USING LOW PRESSURE EPI TO ENABLE LOW RDSON FET

Work Function Based Voltage Reference

Temperature Compensated Work Function Based Voltage Reference

Work Function Based Voltage Reference

High voltage ESD-protection structure

High voltage ESD-protection structure