Gu Hwan KIM

Person

Busan, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Transparency-enhanced fabric using polyester-ether block copolymer...
- Patent number 11,781,266
- Issue date Oct 10, 2023
- JEONGSAN INTERNATIONAL CO., LTD
- Gu Hwan Kim
- D03 - WEAVING
Information Patent Grant
Manufacturing method of a thermoplastic elastomer yarn
- Patent number 11,432,611
- Issue date Sep 6, 2022
- JEONGSAN INTERNATIONAL CO., LTD
- Gu Hwan Kim
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Apparatus for controlling ESS according to transient stability stat...
- Patent number 11,043,814
- Issue date Jun 22, 2021
- KOREA ELECTRIC POWER CORPORATION
- Tae-Ok Kim
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Artificial leather using polyester and manufacturing method therefor
- Patent number 10,472,763
- Issue date Nov 12, 2019
- JEONGSAN INTERNATIONAL CO., LTD
- Gu Hwan Kim
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Method for regenerating silicon from silicon waste and silicon manu...
- Patent number 8,821,826
- Issue date Sep 2, 2014
- Epworks Co., Ltd.
- Gu Sung Kim
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Grant
Chipstack package and manufacturing method thereof
- Patent number 8,368,231
- Issue date Feb 5, 2013
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level stack structure for system-in-package and method thereof
- Patent number 8,278,766
- Issue date Oct 2, 2012
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chipstack package and manufacturing method thereof
- Patent number 7,977,156
- Issue date Jul 12, 2011
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level stack structure for system-in-package and method thereof
- Patent number 7,824,959
- Issue date Nov 2, 2010
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stack structure for system-in-package and method thereof
- Patent number 7,786,594
- Issue date Aug 31, 2010
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture of wafer level package with air pads
- Patent number 7,550,317
- Issue date Jun 23, 2009
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack package and manufacturing method thereof
- Patent number 7,537,959
- Issue date May 26, 2009
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method of manufacturing the same
- Patent number 7,534,656
- Issue date May 19, 2009
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-chip package (MCP) with a conductive bar and method for manuf...
- Patent number 7,531,890
- Issue date May 12, 2009
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly having wafer with image sensor chips, a photo-sensitive ad...
- Patent number 7,521,657
- Issue date Apr 21, 2009
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,375,426
- Issue date May 20, 2008
- Samsung Electronics Co., Ltd.
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods thereof
- Patent number 7,371,614
- Issue date May 13, 2008
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer-level electronic modules with integral connector contacts
- Patent number 7,307,340
- Issue date Dec 11, 2007
- Samsung Electronics Co., Ltd.
- Seung Duk Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder bump structure
- Patent number 7,300,864
- Issue date Nov 27, 2007
- Samsung Electronics Co., Ltd.
- Keum-Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack package and manufacturing method thereof
- Patent number 7,276,799
- Issue date Oct 2, 2007
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method of manufacturing same
- Patent number 7,262,475
- Issue date Aug 28, 2007
- Samsung Electronics Co., Ltd.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Center pad type IC chip with jumpers, method of processing the same...
- Patent number 7,224,055
- Issue date May 29, 2007
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stack structure for system-in-package and method thereof
- Patent number 7,215,033
- Issue date May 8, 2007
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a wafer level chip scale package
- Patent number 7,196,000
- Issue date Mar 27, 2007
- Samsung Electronics Co., Ltd.
- Jin-Hyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with air pads and manufacturing method thereof
- Patent number 7,141,885
- Issue date Nov 28, 2006
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package (MCP) with a conductive bar and method for manuf...
- Patent number 6,908,785
- Issue date Jun 21, 2005
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and method for manufacturing the same
- Patent number 6,836,018
- Issue date Dec 28, 2004
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level stack chip package and method for manufacturing same
- Patent number 6,607,938
- Issue date Aug 19, 2003
- Samsung Electronics Co., Ltd.
- Yong Hwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and method for manufacturing the same
- Patent number 6,586,275
- Issue date Jul 1, 2003
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package and method for manufacturing the same
- Patent number 6,518,675
- Issue date Feb 11, 2003
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING-IN-MEMORY BASED ACCELERATING DEVICES, ACCELERATING SYSTE...
- Publication number 20240403600
- Publication date Dec 5, 2024
- SK HYNIX INC.
- Yong Kee KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEAT MOLDED ARTICLE AND PREPARING METHOD THEREOF
- Publication number 20240141585
- Publication date May 2, 2024
- Hyundai Motor Company
- Myoung Ryoul Lee
- D03 - WEAVING
Information Patent Application
TEXTILE FABRIC AND METHOD OF MANUFACTURING SAME
- Publication number 20240140078
- Publication date May 2, 2024
- Hyundai Motor Company
- Hyun Dae Cho
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITION FOR ECO-FRIENDLY ARTIFICIAL LEATHER HAVING COFFEE GROUN...
- Publication number 20230304218
- Publication date Sep 28, 2023
- Hyundai Motor Company
- Gun Kang
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
METHOD FOR MANUFACTURING ARTIFICIAL LEATHER SEAT COVERING
- Publication number 20230098077
- Publication date Mar 30, 2023
- HYUNDAI TRANSYS INCORPORATED
- Jun Ho SONG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
TRANSPARENCY-ENHANCED FABRIC USING POLYESTER-ETHER BLOCK COPOLYMER...
- Publication number 20200362509
- Publication date Nov 19, 2020
- JEONGSAN INTERNATIONAL CO., LTD.
- Gu Hwan Kim
- D03 - WEAVING
Information Patent Application
THERMOPLASTIC ELASTOMER YARN WITH IMPROVED UNWINDING, WEAVING AND Y...
- Publication number 20200214383
- Publication date Jul 9, 2020
- JEONGSAN INTERNATIONAL Co., Ltd.
- Gu Hwan Kim
- A43 - FOOTWEAR
Information Patent Application
APPARATUS FOR CONTROLLING ESS ACCORDING TO TRANSIENT STABILITY STAT...
- Publication number 20200185920
- Publication date Jun 11, 2020
- Korea Electric Power Corporation
- Tae-Ok KIM
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SKIN LAYER FOR ARTIFICIAL LEATHER AND METHOD FOR MANUFACTURING ARTI...
- Publication number 20200115849
- Publication date Apr 16, 2020
- Hyundai Motor Company
- Hye-Min LEE
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
ARTIFICIAL LEATHER USING POLYESTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20180148891
- Publication date May 31, 2018
- JEONGSAN INTERNATIONAL CO., LTD.
- Gu Hwan KIM
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
METHOD OF PROVIDING A BOOKMARK SERVICE AND AN ELECTRONIC DEVICE TH...
- Publication number 20130262635
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Gu-Sul KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFAC...
- Publication number 20130037946
- Publication date Feb 14, 2013
- FOUNDATION SEOUL TECHNOPARK
- Sung-Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE...
- Publication number 20120225501
- Publication date Sep 6, 2012
- EPWORKS CO., LTD.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL LED INTERPOSER
- Publication number 20110272729
- Publication date Nov 10, 2011
- EPWORKS CO., LTD.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPSTACK PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110237004
- Publication date Sep 29, 2011
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REGENERATING SILICON FROM SILICON WASTE AND SILICON MANU...
- Publication number 20110081289
- Publication date Apr 7, 2011
- EPWORKS CO., LTD.
- Gu Sung KIM
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Wafer level stack structure for system-in-package and method thereof
- Publication number 20100320597
- Publication date Dec 23, 2010
- Samsung Electronics Co., Ltd.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE...
- Publication number 20100193903
- Publication date Aug 5, 2010
- EPWORKS CO., LTD.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chipstack package and manufacturing method thereof
- Publication number 20090209063
- Publication date Aug 20, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip stack package and manufacturing method thereof
- Publication number 20070281374
- Publication date Dec 6, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device and method of manufacturing the same
- Publication number 20070264745
- Publication date Nov 15, 2007
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level stack structure for system-in-package and method thereof
- Publication number 20070257350
- Publication date Nov 8, 2007
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder bump structure for flip chip package and method for manufact...
- Publication number 20070205512
- Publication date Sep 6, 2007
- In-Young Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME...
- Publication number 20070197030
- Publication date Aug 23, 2007
- Samsung Electronics Co., Ltd.
- Gu-Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level stack structure for system-in-package and method thereof
- Publication number 20070170576
- Publication date Jul 26, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE
- Publication number 20070132108
- Publication date Jun 14, 2007
- Samsung Electronics Co., Ltd.
- Jin-Hyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacture of wafer level package with air pads
- Publication number 20070085219
- Publication date Apr 19, 2007
- Samsung Electronics Co., Ltd.
- Gu-Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor device and methods thereof
- Publication number 20070019089
- Publication date Jan 25, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-Chai Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of manufacturing optical device having transparent cover and...
- Publication number 20070010041
- Publication date Jan 11, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Suk-Chae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-embedded interposer structure and fabrication method thereof,...
- Publication number 20070007641
- Publication date Jan 11, 2007
- Kang-Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS

Gu Hwan KIM

Person

Patents Grantslast 30 patents

Transparency-enhanced fabric using polyester-ether block copolymer...

Manufacturing method of a thermoplastic elastomer yarn

Apparatus for controlling ESS according to transient stability stat...

Artificial leather using polyester and manufacturing method therefor

Method for regenerating silicon from silicon waste and silicon manu...

Chipstack package and manufacturing method thereof

Wafer level stack structure for system-in-package and method thereof

Chipstack package and manufacturing method thereof

Wafer level stack structure for system-in-package and method thereof

Wafer level stack structure for system-in-package and method thereof

Method for manufacture of wafer level package with air pads

Chip stack package and manufacturing method thereof

Image sensor device and method of manufacturing the same

Multi-chip package (MCP) with a conductive bar and method for manuf...

Assembly having wafer with image sensor chips, a photo-sensitive ad...

Semiconductor package

Image sensor device and methods thereof

Wafer-level electronic modules with integral connector contacts

Method for forming solder bump structure

Chip stack package and manufacturing method thereof

Image sensor device and method of manufacturing same

Center pad type IC chip with jumpers, method of processing the same...

Wafer level stack structure for system-in-package and method thereof

Method for manufacturing a wafer level chip scale package

Wafer level package with air pads and manufacturing method thereof

Multi-chip package (MCP) with a conductive bar and method for manuf...

Wafer level package and method for manufacturing the same

Wafer level stack chip package and method for manufacturing same

Wafer level package and method for manufacturing the same

Wafer level package and method for manufacturing the same

Patents Applicationslast 30 patents

PROCESSING-IN-MEMORY BASED ACCELERATING DEVICES, ACCELERATING SYSTE...

SEAT MOLDED ARTICLE AND PREPARING METHOD THEREOF

TEXTILE FABRIC AND METHOD OF MANUFACTURING SAME

COMPOSITION FOR ECO-FRIENDLY ARTIFICIAL LEATHER HAVING COFFEE GROUN...

METHOD FOR MANUFACTURING ARTIFICIAL LEATHER SEAT COVERING

TRANSPARENCY-ENHANCED FABRIC USING POLYESTER-ETHER BLOCK COPOLYMER...

THERMOPLASTIC ELASTOMER YARN WITH IMPROVED UNWINDING, WEAVING AND Y...

APPARATUS FOR CONTROLLING ESS ACCORDING TO TRANSIENT STABILITY STAT...

SKIN LAYER FOR ARTIFICIAL LEATHER AND METHOD FOR MANUFACTURING ARTI...

ARTIFICIAL LEATHER USING POLYESTER AND MANUFACTURING METHOD THEREFOR

METHOD OF PROVIDING A BOOKMARK SERVICE AND AN ELECTRONIC DEVICE TH...

SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFAC...

THREE DIMENSIONAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE...

WAFER LEVEL LED INTERPOSER

CHIPSTACK PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR REGENERATING SILICON FROM SILICON WASTE AND SILICON MANU...

Wafer level stack structure for system-in-package and method thereof

THREE DIMENSIONAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE...

Chipstack package and manufacturing method thereof

Chip stack package and manufacturing method thereof

Image sensor device and method of manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Solder bump structure for flip chip package and method for manufact...

CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME...

Wafer level stack structure for system-in-package and method thereof

METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE

Method for manufacture of wafer level package with air pads

Image sensor device and methods thereof

Method of manufacturing optical device having transparent cover and...

Chip-embedded interposer structure and fabrication method thereof,...