Guy Brouillette

Person

Shefford, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Mold shave apparatus and injection molded soldering process
- Patent number 8,162,199
- Issue date Apr 24, 2012
- International Business Machines Corporation
- Eric E. Bourchard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for transferring solder bumps
- Patent number 7,070,087
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Guy Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,566,612
- Issue date May 20, 2003
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,527,158
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Guy Paul Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,394,334
- Issue date May 28, 2002
- International Business Machines Corporation
- Guy Paul Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,341,418
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making interconnect for low temperature chip attachment
- Patent number 6,340,630
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder column attach by injection molded solder and...
- Patent number 6,276,596
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 6,149,122
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 6,133,633
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for low temperature chip attachment
- Patent number 6,127,735
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming solder bumps
- Patent number 6,056,191
- Issue date May 2, 2000
- International Business Machines Corporation
- Guy Paul Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for transferring solder bumps and method of using
- Patent number 6,003,757
- Issue date Dec 21, 1999
- International Business Machines Corporation
- Guy Daniel Beaumont
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct chip attach for low alpha emission interconnect system
- Patent number 5,897,336
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Guy Paul Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 5,775,569
- Issue date Jul 7, 1998
- IBM Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
- Publication number 20090294090
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Eric E. Bouchard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
- Publication number 20080156849
- Publication date Jul 3, 2008
- International Business Machines Corporation
- Eric E. Bouchard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Injection molded continuously solidified solder method and apparatus
- Publication number 20050263571
- Publication date Dec 1, 2005
- Luc Belanger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS
- Publication number 20040214420
- Publication date Oct 28, 2004
- International Business Machines Corporation
- Guy Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for direct chip attach by solder bumps and an underfill layer
- Publication number 20020062556
- Publication date May 30, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature solder column attach by injection molded solder and...
- Publication number 20020023945
- Publication date Feb 28, 2002
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS

Guy Brouillette

Person

Patents Grantslast 30 patents

Mold shave apparatus and injection molded soldering process

Method and apparatus for transferring solder bumps

Method for direct chip attach by solder bumps and an underfill layer

Method and apparatus for forming solder bumps

Method and apparatus for forming solder bumps

Method for direct chip attach by solder bumps and an underfill layer

Method for making interconnect for low temperature chip attachment

Low temperature solder column attach by injection molded solder and...

Method for building interconnect structures by injection molded sol...

Method for building interconnect structures by injection molded sol...

Interconnect for low temperature chip attachment

Method and apparatus for forming solder bumps

Apparatus for transferring solder bumps and method of using

Direct chip attach for low alpha emission interconnect system

Method for building interconnect structures by injection molded sol...

Patents Applicationslast 30 patents

MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS

MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS

Injection molded continuously solidified solder method and apparatus

METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS

Method for direct chip attach by solder bumps and an underfill layer

Low temperature solder column attach by injection molded solder and...