Claims
- 1. A die for dispensing molten solder comprising:a die body of elongated shape formed of a single sheet of metal capable of flexing of not less than 1.5 μm per inch of die length, said body having a front side and a back side, a gate opening through said front and back sides of said die body for receiving molten solder from a reservoir, an elongated slot opening in the front side of said die body in fluid communication with said gate opening for distributing said molten solder to a solder receiving surface, and a pressure means mounted on the die body for providing pressure to said die body to enable an intimate contact between said solder receiving surface and said die body.
- 2. A die according to claim 1, wherein said pressure means comprises a plurality of springs mounted in a perpendicular direction to said elongated die body.
- 3. A die according to claim 1, wherein said pressure means comprises a plurality of bellows mounted in a perpendicular direction to said elongated die body.
- 4. A die according to claim 3, wherein said plurality of bellows further comprising passageways for molten solder to flow therethrough in fluid communication with said elongated slot opening.
- 5. A die according to claim 3, wherein said die body further comprising a trailing edge for removing excess molten solder from said solder receiving surface.
Parent Case Info
This application is a divisional of Ser. No. 09/070,121 filed on Apr. 30 1998, now U.S. Pat. No. 6,056,191.
US Referenced Citations (14)
Foreign Referenced Citations (1)
Number |
Date |
Country |
8-148819 |
Jun 1996 |
JP |