Gwo-Yuh Shiau

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy structure for multiple gate dielectric interface and methods
- Patent number 9,356,108
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huei-Ru Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure for multiple gate dielectric interface and methods
- Patent number 8,847,319
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huei-Ru Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bonding pad for image sensors
- Patent number 8,710,560
- Issue date Apr 29, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrate with reduced surface roughness
- Patent number RE44376
- Issue date Jul 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gwo-Yuh Shiau
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Method of fabricating backside illuminated image sensor
- Patent number 8,357,561
- Issue date Jan 22, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color filter-embedded MSM image sensor
- Patent number 8,053,853
- Issue date Nov 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiunn-Yih Chyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for thinning a substrate
- Patent number 8,048,807
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating backside illuminated image sensor
- Patent number 7,923,344
- Issue date Apr 12, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bonding pad
- Patent number 7,883,917
- Issue date Feb 8, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating image sensor devices
- Patent number 7,883,926
- Issue date Feb 8, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrate with reduced surface roughness
- Patent number 7,863,067
- Issue date Jan 4, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming planarized coatings on contact hole patterns of v...
- Patent number RE41697
- Issue date Sep 14, 2010
- Taiwan Semiconductor Manufacturing Company
- Chia-Tung Ho
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Process for wafer bonding
- Patent number 7,732,299
- Issue date Jun 8, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Yuan Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating image sensor devices
- Patent number 7,709,872
- Issue date May 4, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bonding pad for backside illuminated image sensor
- Patent number 7,659,595
- Issue date Feb 9, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating backside illuminated image sensor
- Patent number 7,648,851
- Issue date Jan 19, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens structures suitable for use in image sensors and method for ma...
- Patent number 7,443,005
- Issue date Oct 28, 2008
- Tiawan Semiconductor Manufacturing Co., Ltd.
- Ching-Sen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing trenching in fabricating split gate flash dev...
- Patent number 7,144,773
- Issue date Dec 5, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to preserve alignment mark optical integrity
- Patent number 6,803,291
- Issue date Oct 12, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming planarized coatings on contact hole patterns of v...
- Patent number 6,645,851
- Issue date Nov 11, 2003
- Taiwan Semiconductor Manufacturing Company
- Chia-Tung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhance the process window of memory cell line/space dense pattern...
- Patent number 6,632,590
- Issue date Oct 14, 2003
- Taiwan Semiconductor Manufacturing Company
- San-De Tzu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Overlay target pattern and algorithm for layer-to-layer overlay met...
- Patent number 6,077,756
- Issue date Jun 20, 2000
- Vanguard International Semiconductor
- Hua-Tai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing uniform photoresist coatings for tight control...
- Patent number 5,985,363
- Issue date Nov 16, 1999
- Vanguard International Semiconductor
- Gwo-Yuh Shiau
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Alignment pattern and algorithm for photolithographic alignment mar...
- Patent number 5,982,044
- Issue date Nov 9, 1999
- Vanguard International Semiconductor Corporation
- Hua-Tai Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Striation-free coating method for high viscosity resist coating
- Patent number 5,677,001
- Issue date Oct 14, 1997
- Vanguard International Semiconductor Corporation
- Li-Ming Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Barbituric acid-modified bismaleimide with diamine and polyisocyana...
- Patent number 5,326,794
- Issue date Jul 5, 1994
- Industrial Technology Research Institute
- Jing-Pin Pan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide adhesive composition including barbituric acid modifier
- Patent number 5,200,474
- Issue date Apr 6, 1993
- Industrial Technology Research Institute
- Ker M. Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Dummy Structure for Multiple Gate Dielectric Interface and Methods
- Publication number 20140342541
- Publication date Nov 20, 2014
- Huei-Ru Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Structure for Multiple Gate Dielectric Interface and Methods
- Publication number 20130234244
- Publication date Sep 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huei-Ru Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING BACKSIDE ILLUMINATED IMAGE SENSOR
- Publication number 20110159631
- Publication date Jun 30, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING IMAGE SENSOR DEVICES
- Publication number 20100151615
- Publication date Jun 17, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING BACKSIDE ILLUMINATED IMAGE SENSOR
- Publication number 20100087029
- Publication date Apr 8, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Thinning a Substrate
- Publication number 20100062611
- Publication date Mar 11, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BONDING PAD
- Publication number 20090124073
- Publication date May 14, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BONDING PAD FOR IMAGE SENSORS
- Publication number 20090039452
- Publication date Feb 12, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BONDING PAD FOR BACKSIDE ILLUMINATED IMAGE SENSOR
- Publication number 20090020842
- Publication date Jan 22, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BONDING PAD
- Publication number 20080246152
- Publication date Oct 9, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ENHANCING LIGHT SENSITIVITY FOR BACKSIDE ILLU...
- Publication number 20080237761
- Publication date Oct 2, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Substrate With Reduced Surface Roughness
- Publication number 20080227276
- Publication date Sep 18, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process For Wafer Bonding
- Publication number 20080194076
- Publication date Aug 14, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Yuan Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING IMAGE SENSOR DEVICES
- Publication number 20080061330
- Publication date Mar 13, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Gwo-Yuh Shiau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AVOIDING WAFER BREAKAGE DURING MANUFACTURE OF BACKSIDE I...
- Publication number 20080044984
- Publication date Feb 21, 2008
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yuan-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Color filter-embedded MSM image sensor
- Publication number 20070257283
- Publication date Nov 8, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiunn-Yih Chyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating backside illuminated image sensor
- Publication number 20070207566
- Publication date Sep 6, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT GATE FLASH DEVICES
- Publication number 20070069328
- Publication date Mar 29, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING TRENCHING IN FABRICATING SPLIT GATE FLASH DEV...
- Publication number 20060275984
- Publication date Dec 7, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lens structures suitable for use in image sensors and method for ma...
- Publication number 20050274968
- Publication date Dec 15, 2005
- Ching-Sen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PRESERVE ALIGNMENT MARK OPTICAL INTEGRITY
- Publication number 20040185637
- Publication date Sep 23, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.,
- Shih-Chi Fu
- H01 - BASIC ELECTRIC ELEMENTS

Gwo-Yuh Shiau

Person

Patents Grantslast 30 patents

Dummy structure for multiple gate dielectric interface and methods

Dummy structure for multiple gate dielectric interface and methods

Embedded bonding pad for image sensors

Silicon substrate with reduced surface roughness

Method of fabricating backside illuminated image sensor

Color filter-embedded MSM image sensor

Method and apparatus for thinning a substrate

Method of fabricating backside illuminated image sensor

Semiconductor device with bonding pad

Methods for fabricating image sensor devices

Silicon substrate with reduced surface roughness

Method of forming planarized coatings on contact hole patterns of v...

Process for wafer bonding

Methods for fabricating image sensor devices

Embedded bonding pad for backside illuminated image sensor

Method of fabricating backside illuminated image sensor

Lens structures suitable for use in image sensors and method for ma...

Method for preventing trenching in fabricating split gate flash dev...

Method to preserve alignment mark optical integrity

Method of forming planarized coatings on contact hole patterns of v...

Enhance the process window of memory cell line/space dense pattern...

Overlay target pattern and algorithm for layer-to-layer overlay met...

Method of providing uniform photoresist coatings for tight control...

Alignment pattern and algorithm for photolithographic alignment mar...

Striation-free coating method for high viscosity resist coating

Barbituric acid-modified bismaleimide with diamine and polyisocyana...

Polyimide adhesive composition including barbituric acid modifier

Patents Applicationslast 30 patents

Dummy Structure for Multiple Gate Dielectric Interface and Methods

Dummy Structure for Multiple Gate Dielectric Interface and Methods

METHOD OF FABRICATING BACKSIDE ILLUMINATED IMAGE SENSOR

METHODS FOR FABRICATING IMAGE SENSOR DEVICES

METHOD OF FABRICATING BACKSIDE ILLUMINATED IMAGE SENSOR

Method and Apparatus for Thinning a Substrate

SEMICONDUCTOR DEVICE WITH BONDING PAD

EMBEDDED BONDING PAD FOR IMAGE SENSORS

EMBEDDED BONDING PAD FOR BACKSIDE ILLUMINATED IMAGE SENSOR

SEMICONDUCTOR DEVICE WITH BONDING PAD

SYSTEM AND METHOD FOR ENHANCING LIGHT SENSITIVITY FOR BACKSIDE ILLU...

Silicon Substrate With Reduced Surface Roughness

Process For Wafer Bonding

METHODS FOR FABRICATING IMAGE SENSOR DEVICES

METHODS OF AVOIDING WAFER BREAKAGE DURING MANUFACTURE OF BACKSIDE I...

Color filter-embedded MSM image sensor

Method of fabricating backside illuminated image sensor

SPLIT GATE FLASH DEVICES

METHOD FOR PREVENTING TRENCHING IN FABRICATING SPLIT GATE FLASH DEV...

Lens structures suitable for use in image sensors and method for ma...

METHOD TO PRESERVE ALIGNMENT MARK OPTICAL INTEGRITY